While some might have expected the exponential growth in design rules number and complexity to cool down a little, it looks as if these are only heating up more. The multiplicity of technology nodes, lithography options, , fundamental technology options (Bulk, FD-SOI, FinFET), different process flavors and specific applications,… Read More
Shootout at 22nm!
For an industry that drives improvement at an exponential rate it is funny how often something old is new again. Intel went into high volume production on 22nm in 2011, and TSMC and Samsung have both had 20nm technologies in production for several years. And yet, recently we have seen renewed interest in 22nm. GLOBALFOUNDRIES has… Read More
Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!
Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.
Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More
Top 10 Updates from the TSMC Technology Symposium, Part II
An earlier article described some of the technical and business highlights from the recent TSMC Symposium in Santa Clara (link). This article continues that discussion, with the top five updates.… Read More
Samsung Should Just Buy eSilicon Already!
As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.
Today … Read More
Succeeding with 56G SerDes, HBM2, 2.5D and FinFET
eSilicon presented their advanced ASIC design capabilities at a seminar last Wednesday evening. This event was closed to the press, bloggers and analysts, but I managed to get some details from a friend who attended. The event title was: “Advanced ASICs for the Cloud-Computing Era: Succeeding with 56G SerDes, HBM2, 2.5D and FinFET… Read More
TSMC Talks About 22nm, 12nm, and 7nm EUV!
The TSMC Symposium was jam-packed this year with both people and information. I had another 60 minutes of fame in the Solido booth where I signed 100 books, thank you to all who stopped by for a free book and a SemiWiki pen. SemiWiki bloggers Tom Dillinger and Tom Simon were also there so look for more TSMC Symposium blogs coming in the… Read More
TSMC Design Platforms Driving Next-Gen Applications
Coming up is the 23rd annual TSMC Technology Symposium where you can get first-hand updates on advanced and specialty technologies, advanced backend capabilities, future development plans, and network with hundreds of TSMC’s customers and partners. This year the Silicon Valley event kicks off at the Santa Clara Convention… Read More
Another Live Event at Samsung!
Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which are… Read More
CEO Interview: Amit Gupta of Solido Design
Solido Design Automation is rapidly making a name for itself in EDA. Amit Gupta is founder and CEO of Solido Design Automation, based in Saskatoon, Canada. You should also know that Solido is one of the founding members of SemiWiki.com. In the last six years we have published 44 Solido related blogs that have racked up more than 200,000… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay