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The Evolution of the Extension Implant Part IV

The Evolution of the Extension Implant Part IV
by Daniel Nenni on 05-10-2019 at 2:00 pm

Perhaps the most innovative and effective Extension implant does not involve an implant at all, but is instead an etch followed by a selective epitaxial deposition.

In this Extension fabrication methodology the Source/Drains regions in a planar device are etched away in the normal fashion to accommodate the replacement Source/Drain… Read More


Three Reasons Why You Should NOT Miss 56thDAC

Three Reasons Why You Should NOT Miss 56thDAC
by Daniel Nenni on 05-10-2019 at 7:00 am

Reason number ONE:The next five DACs will be in San Francisco and this will probably be the last one held in Las Vegas so you absolutely do NOT want to miss it. One of my most memorable DACs was in Las Vegas in 1985. My wife came with me for our second honeymoon and, by definition, it was just that, a honeymoon. This year we will probably spend… Read More


ESD Alliance CEO Outlook Features Powerhouse Lineup

ESD Alliance CEO Outlook Features Powerhouse Lineup
by Bob Smith on 05-09-2019 at 2:00 pm

Just two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.

That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator. Panelists… Read More


Anirudh Keynote at CDNLive 2019

Anirudh Keynote at CDNLive 2019
by Bernard Murphy on 05-08-2019 at 7:00 am

Anirudh Devgan (President of Cadence), gave the third keynote at CDNLive Silicon Valley this year. He has clearly become adept in this role. He has a big, but supportable vision for Cadence across markets and technologies and he’s become a master of the annual tech reveals that I usually associate with keynotes.


Anirudh opened … Read More


The Evolution of the Extension Implant Part III

The Evolution of the Extension Implant Part III
by Daniel Nenni on 05-06-2019 at 7:00 am

The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More


Webinar: ISO 26262 Compliance

Webinar: ISO 26262 Compliance
by Daniel Payne on 05-02-2019 at 12:00 pm

To me the major idea of ISO 26262 compliance is ensuring that requirements can be traced throughout the entire design and verification process, including the use of IP blocks. The first market application that comes to mind with ISO 26262 is automotive, with its emphasis on safety because human lives are at stake. Since necessity… Read More


The Evolution of the Extension Implant Part II

The Evolution of the Extension Implant Part II
by Daniel Nenni on 05-02-2019 at 7:00 am

The use of hard masks instead of photoresist for the Extension implant is an effective way to optimize the amount of dopant that is retained along the fin sidewalls for those fins that border along photoresist edges (as discussed in Part 1 of this series).

However, hard masks do nothing to address the dominant problem driving steeper… Read More


TSMC Technology Symposium Review Part II

TSMC Technology Symposium Review Part II
by Tom Dillinger on 04-30-2019 at 10:00 am

TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.

TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More


2019 TSMC Technology Symposium Review Part I

2019 TSMC Technology Symposium Review Part I
by Tom Dillinger on 04-30-2019 at 7:00 am

Each year, TSMC conducts two major customer events worldwide – the TSMC Technology Symposium in the Spring and the TSMC Open Innovation Platform Ecosystem Forum in the Fall. The Technology Symposium event was recently held in Santa Clara, CA, providing an extensive update on the status of advanced semiconductor and packaging… Read More


Free Webinar: Analog Verification with Monte Carlo, PVT Corners and Worst-Case Analysis

Free Webinar: Analog Verification with Monte Carlo, PVT Corners and Worst-Case Analysis
by Tom Simon on 04-29-2019 at 4:00 pm

The letters “PVT” roll of the tongue easily enough, belying the complexity that variations in process, temperature and voltage can cause for analog designs. For semiconductor processes, there are dozens of parameters that can affect the viability of a design. It would be easy enough to optimize a circuit with only one or two varying… Read More