In a world of smart devices, high performance is required in order to address several specific needs such as intelligent and immediate data processing for IoT applications, instant response from mobile devices, highly interactive user interfaces, and so on. Most of these devices are battery operated and hence require lower … Read More
HLS with ARM and FPGA Technologies Boosts SoC Performance
The way SoC size and complexity are increasing; new ways of development and verification are also evolving with innovative automated tools and environment for SoC development and optimization. IP based SoC development methodology has proved to be the most efficient for large SoCs. This needs collaboration among multiple players… Read More
More than just mobile phones for Mali
ARM TechCon 2015 was another tour de force for ARM and its ecosystem. Besides some of the developments in mobile, IoT, and security (more coming soon in the Epilogue of “Mobile Unleashed”), there were two topics that I found very educational and will cover in blogs this week. One was how the Mali family is powering more than just mobile… Read More
Merger Mania: The Future of the Semiconductor Industry
In a semiconductor industry which appears maturing, we are also seeing the technologies unravelling newer transistor structures, memories, processors, and newer ways of designing ICs and electronic systems. The present decade appears to be at the cusp of a new transformation in the semiconductor industry. Amid a slew of mergers… Read More
It’s All about Packaging — In this Material World, Who Is Your Partner?
By Dr. Dan Tracy, senior director, Industry Research and Statistics, SEMI
With the recent release of Apple’s 6s and the form factors of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for… Read More
A moment of IoT silence before we disrupt
As I sat down in the SEMI Arizona Chapter breakfast meeting a few weeks ago, a moment of semiconductor history flew right before my eyes before the IoT sessions started.
We were seated in the cafeteria of Freescale Building 94 on Elliot Road in Tempe, a place I’d been many times before, except this time may have been the last. NXP is consolidating… Read More
Moore’s Law and Silicon Forest
When I first moved to Oregon in 1978 the largest industry was forestry, but then the endangered Spotted Owl was found and that put an end to many forestry companies and decimated the economy of many rural cities. Strangely enough it turns out that the Spotted Owl was found in great numbers across multiple states, so it never should’ve… Read More
SEMI Releases Industry’s First “Global 200mm Fab Outlook to 2018” and Announces Webinar
SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and… Read More
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
IMEC and Cadence Disclose 5nm Test Chip
Recently imec and Cadence disclosed that they had fabricated 5nm test chips. This afternoon Dan Nenni and I had a conference call with Praveen Raghavan, principal engineer at imec, and Vassilios Gerousis, distinguished engineer at Cadence to get more details on what the test chip is and what was learned.
First off Vassilios really… Read More
AI RTL Generation versus AI RTL Verification