Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)

Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)
by Adele Hars on 08-25-2016 at 12:00 pm

 By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation and adjustable performance level mandatory for energy-starved systems, perfectly suiting the needs of the numerous categories of connected devices commonly referred to as the Internet of Things. This natural synergy was made obvious during the talks we listened to during past editions of the conference. For this reason, we adopted “Energy Efficient Technology for the Internet of Things” as the theme of the 2016 IEEE S3S.

This theme will be present throughout the conference. It will start on October 10th with a full day tutorial addressing two important IoT-related topics: Energy Efficient Computing and Communications, and will peak during the Plenary Hot Topics session, focused on the Internet of Things, on Thursday October 13th.

We have an outstanding technical program, including a very strong list of invited speakers, all of them leading authorities from illustrious organizations.

Our Keynote speakers are decision-makers from major industries:

  • Nick Yu, VP, Qualcomm, will explain why “The Homogeneous architecture is a dead fairy tale”
  • Ron Martino, VP, NXP, will present “Advanced Innovation and Requirements for future Smart, Secure and Connected Applications”
  • Peter Gammel, CTO, Skyworks, will describe “RF front end requirements and roadmaps for the IoT”

Several sessions will also be of particular interest to designers and technologistswho want to learn about new knobs to implement in their circuits: Two tutorials, related to 3D technology and FD-SOI design respectively and the technical sessions on SOI and Low Voltage Circuit Design. Applications will be illustrated in our session dedicated to SOI circuit implementations.

You can look at our Advance Program to get details about the technical content of the conference, as well as the conference venue and registration.

And you still have time to actively participate by submitting a late news paper before August 31st.

Hyatt Regency San Francisco Airport

The conference has a long tradition of allying technical and social activities. This will be the case again this year with several dinners & receptions that will give us plenty of opportunities to discuss with our colleagues.

With its broad scope of technology-related applications and social-oriented environment, the S3S is an excellent venue to meet new people with different but related research interests. It is an efficient way to shed new light on your own focus area, and to sprout new ideas and collaboration themes. It is also a place where industry and academia can exchange about the application of on-going research and tomorrow’s company needs.

Deadline for Late News submissions is August 31st, 2016

Please click here to go to the 2016 S3S Conference Registration page.

For further information, please visit our website at s3sconference.org or contact the conference manager, Joyce Lloyd: manager@s3sconference.org

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Bio:
Dr. Frederic Allibert is the General Chair of the 2016 IEEE S3S Conference. (S3S, in various formats, has been ongoing since 1975.) He is a senior scientist and member of the R&D staff at Soitec, where he has supported the development of products and technologies for applications, including FD-SOI, RF, imagers, and high-mobility materials since 1999. As Soitec’s assignee at the Albany Nanotech Center (2011-2015), his focus was on substrate technologies for advanced nodes. Since then, he’s been exploring substrate-device interactions in various fields of micro-electronics, including RF and logic.