What to Expect from the GSA Executive European Forum?

What to Expect from the GSA Executive European Forum?
by Eric Esteve on 04-02-2019 at 7:00 am

I plan to attend to the GSA European Forum in Munich (April 15-16), so I first looked at the event description and at the impressive speakers list. In such event, the goal is at 50% to listen, and 50% to network with the speakers and the other attendant. The center of gravity is clearly semiconductor, but the event involved speakers … Read More


The Rebirth of Dolphin Integration!

The Rebirth of Dolphin Integration!
by Eric Esteve on 09-10-2018 at 7:00 am

You may have seen this Press Release (see below) announcing that Dolphin Integration (Dolphin) has been acquired by Soitec (60%) and MBDA (40%) – you can see more information about these two companies at the bottom of this blog. Founded in 1985, Dolphin had some recurrent cash flow issues during the last couple of years, that they… Read More


FDSOI Status and Roadmap

FDSOI Status and Roadmap
by Scotten Jones on 07-23-2018 at 7:00 am

FDSOI is gaining traction in the market place. At their foundry forum in May, Samsung announced they have 17 FDSOI products in high volume manufacturing (you can read Tom Dilliger’s write up of the Samsung Foundry Forum here). At SEMICON West in July, GLOBALFOUNDRIES (GF) announced FDSOI design wins worth $2 billion dollars in … Read More


SEMICON West – Soitec is becoming a key enabler

SEMICON West – Soitec is becoming a key enabler
by Scotten Jones on 07-22-2018 at 7:00 am

A variety of growing and emerging segments of the semiconductor industry rely on Silicon-On-Insulator (SOI) wafers. Soitec is the primary source for SOI wafers particularly on 300mm. On Tuesday at SEMICON I got to sit down with Bernard Aspar, Soitec’s Executive Vice President, Communication & Power BU and Christophe… Read More


IP-SoC 2017: IP Innovation, Foundries, Low Power and Security

IP-SoC 2017: IP Innovation, Foundries, Low Power and Security
by Eric Esteve on 12-03-2017 at 12:00 pm

The 20[SUP]th[/SUP] IP-SoC conference will be held in Grenoble, France, on December 6-7, 2017. IP-SoC is not just a marketing fest, it’s the unique IP centric conference, with presentations reflecting the complete IP ecosystem: IP suppliers, foundries, industry trends and applications, with a focus on automotive. It will … Read More


Semicon West – The FDSOI Ecosystem

Semicon West – The FDSOI Ecosystem
by Scotten Jones on 07-21-2017 at 12:00 pm

At Semicon West last week I attended presentations by Soitec and CEA Leti, and had breakfast with CEA Leti CEO Marie Semeria, key members of the Fully Depleted Silicon On Insulator (FDSOI) ecosystem. I have also seen some comments in the SemiWiki forum lately that make me believe there is some confusion on the roles of different companies… Read More


IEDM 2016 – Marie Semeria LETI Interview

IEDM 2016 – Marie Semeria LETI Interview
by Scotten Jones on 12-21-2016 at 7:00 am

Marie Semeria is the CEO of Leti, one of the world’s premier research organization for semiconductor technology and the key development center for FDSOI. I first interviewed Marie at SEMICON West and at IEDM I had a chance to sit down with her and get an update on Leti’s efforts over the last several months.

My interview… Read More


Soitec – Enabling the FDSOI Revolution

Soitec – Enabling the FDSOI Revolution
by Scotten Jones on 10-18-2016 at 12:00 pm

Recently I published two blogs on Fully Depleted Silicon On Insulator (FDSOI) and the potential the technology shows for a variety of low power and wireless applications. In order to produce FDSOI devices, the device layer has to be thin enough to ensure the device is fully depleted and ideally the buried oxide has to be thin enough… Read More


Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)

Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)
by Adele Hars on 08-25-2016 at 12:00 pm

By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More


Positive pointers from Samsung, GF, Renesas, NXP/Freescale, ST, Soitec – so will 2016 be the year of FD-SOI?

Positive pointers from Samsung, GF, Renesas, NXP/Freescale, ST, Soitec – so will 2016 be the year of FD-SOI?
by Adele Hars on 02-10-2016 at 4:00 pm

A little over a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. Quite a bit of it came out of the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on the SOI Consortium website (click here to see what’s there) – but keep checking… Read More