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Electronic Design Automation
Synopsys is the dominant player in the commercial EDA and semiconductor IP markets so it is always interesting to hear what John Koeter, Vice President of Marketing for IP, Services and System Level Solutions, has to say. John presented “The Role of IP in a Changing Landscape” at the SemiCO IMPACT Conference and I talked to him again… Read More
I visited Oasys Design Systems and talked to Craig Robbins, their VP sales. For the first time this year, Oasys has a theater presentations and demos of RealTime Designer which are open to anyone attending the show. In previous years, they have had suite demos for appropriately qualified potential customers but outside they have… Read More
Lorentz Solution presented at TSMC’s DAC 2012 Open Innovation Platform Theater. The presenter was Lorentz Sales Director, Tom Simon. He presented what Lorentz calls its Electromagnetic Design and Analysis Platform. One of the main points of the talk was the cooperative work that Lorentz does with TSMC.
On Wednesday at DAC I met with Bob Slee, distributor and Michael Siu, AE for MunEDA to get an update on what’s new. MunEDA has EDA software for:
Fergus Slorach, CTO and Founder of Methodics met with me at DAC on Wednesday afternoon to provide an update on software configuration management for hardware designers.… Read More
Sunday Night – you have to network at the EDAC kick-off party.… Read More
Paul Estrada, COO of Berkeley DA met with me on the final day of DAC to provide an update. BDA coined the phrase Analog FastSPICE and have continued to dominate that market segment in the world of SPICE circuit simulators.… Read More
I met with Jay Madiraju of Mentor Graphics on Wednesday at DAC to get an update on their AMS simulation products. We worked together at Mentor back when Mach TA was being developed as a Fast SPICE circuit simulator.… Read More
Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More
At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be … Read More
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Huawei’s and SMIC’s Requirement for 5nm Production: Improving Multipatterning Productivity