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DRC Concept for IP Qualification and SoC Integration

DRC Concept for IP Qualification and SoC Integration
by Pawan Fangaria on 05-30-2016 at 7:00 am

In the history of semiconductor design and manufacturing, the age-old concept of DRC rule-deck qualification for handshake between design and manufacturing still applies strongly to produce working silicon. In fact, DRC clean GDSII works as the de facto golden gate between a design and a foundry for manufacturing the chip for… Read More


Aart de Geus, Technomics and #53DAC

Aart de Geus, Technomics and #53DAC
by Daniel Payne on 05-29-2016 at 8:00 pm

The number one EDA+IP vendor in our industry today is Synopsys, and their eloquent leader is Aart de Geus, so I expect that the Monday interview at #53DAC on June 6th will be well attended and worthwhile to witness in the DAC Pavilion, start time is 11:30AM, so arrive early to get a seat. One of Aart’s coined words is Technomics,… Read More


Six Reasons to Visit Cadence at #53DAC this Year in Austin

Six Reasons to Visit Cadence at #53DAC this Year in Austin
by Daniel Payne on 05-29-2016 at 4:00 pm

For bloggers like myself spending four days at #53DAC is almost a non-stop blur of activity, visiting EDA vendors, IP providers and foundries to learn about what’s happening in our semiconductor industry. Cadence is both an EDA vendor and IP provider, so DAC is a great showcase for them to tell us what’s new in 2016 and… Read More


What the #3 EDA company is showing at #53DAC this year

What the #3 EDA company is showing at #53DAC this year
by Daniel Payne on 05-29-2016 at 12:00 pm

I live in Tualatin, Oregon just a few miles away from the corporate headquarters of the #3 EDA company in the world, Mentor Graphics. Since DAC is fast approaching, I thought it would be useful to give you a quick overview of what Mentor is going to be talking about in Austin, Texas during June 5-9. … Read More


Power Noise Sign-off at #53DAC

Power Noise Sign-off at #53DAC
by Daniel Payne on 05-29-2016 at 7:00 am

When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More


How TSMC Tackles Variation at Advanced Nodes

How TSMC Tackles Variation at Advanced Nodes
by Pawan Fangaria on 05-27-2016 at 12:00 pm

The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More


Who protects power protection chips?

Who protects power protection chips?
by Tom Simon on 05-25-2016 at 12:00 pm

Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.

Power protection chips work like electronic fuses,… Read More


Testing IGBTs before they go into EVs

Testing IGBTs before they go into EVs
by Don Dingee on 05-23-2016 at 4:00 pm

In the pages of SemiWiki, we are usually talking about what to do with billions of really small transistors – for a change of pace today, we’ll discuss what to do with a few really big ones. Mentor Graphics has just announced their latest MicReD platform for thermal testing of IGBTs, experiencing a resurgence (pun intended) thanks… Read More


What Does an MPW and a Pizza Have in Common?

What Does an MPW and a Pizza Have in Common?
by Daniel Nenni on 05-23-2016 at 12:00 pm

Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More


"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis

"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis
by Tom Dillinger on 05-23-2016 at 7:00 am

A common SoC design methodology in current use starts with preparation of the physical floorplan — e.g., block/pin placement, global clock domain and bus signal planning, developing the global/local power distribution (and dynamic power domain management techniques). Decoupling capacitor estimated densities and… Read More