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A couple of weeks ago was the 3D Architectures for Semiconductor Integration and Packagingconference in Redwood City. Cadence presented the changes that they have been making to their tool flow to enabled 2.5D (interposer-based) and true 3D TSV-based designs. You know what TSV stands for by now right? Through-silicon-via, … Read More
We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.
My curiosity kicked in when I looked at the recent press release… Read More
Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More
An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.
This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More
At DAC in June I visited and blogged about 30+ EDA and Semi IP companies, however I didn’t have time to watch the TowerJazz presentation in the Cadence Theater entitled: AMS Flow for Power Management Designs. Today I watched the 26 minute video and have summarized what I learned in this blog post.… Read More
The Silicon Valley CDNLive, the Cadence user conference, will be on March 12-13th 2013 in Santa Clara. But the heart of CDNLive are customer presentations and the call for papers is now open. The deadline is December 4th (at 5pm PST for people who really like to come down to the wire). At this point only an abstract is required.
There… Read More
Once upon a time (since every good story begins that way), I worked on 10kg, 70 mm diameter things that leapt out of tubes and chased after airplanes and helicopters. The electronics for these things were fairly marvelous, in the days when surface mount technology was in its infancy and having reliability problems in some situations.… Read More
Cadence has apparently announced that going forward the Virtuoso environment is going to be split into two and offered as two separate code-streams, the current IC6.x and a new IC12.x. The idea is to introduce a new product with features that were specifically developed for new technologies such as double patterning aware layout… Read More
Looking at the Press Release (PR) flow, it was interesting to see how TSMC has solved a communication dilemma. At first, let’s precise that #1 Silicon foundry has to work with each of the big three EDA companies. As a foundry, you don’t want to lose any customer, and then you support every major design flow. Choosing another strategy… Read More
… Mentor Graphics, Design & Reuse or Gartner. The IP-SoC conference in Grenoble has been the very first 100% dedicated to Design IP, created by Gabriele Saucier 20 years ago, when “reuse” was more a concept than a reality within the design teams, and when Design IP was far to be a sustainable business.
Pr Gabriele Saucier had the… Read More
Podcast EP16: Hyperscale Computing & Changes in the Datacenter
Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus
Podcast EP255: The Growing Proliferation of Semiconductors and AI in Cars with Amol Borkar
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[node_id] => 356
[title] => Cadence
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 80
[display_in_list] => 1
[lft] => 45
[rgt] => 46
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum","display_in_list":true},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category","display_in_list":true}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)