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Optimizing logical, physical, electrical, and manufacturing effects, Cadence digital implementation technology eliminates iteration without sacrificing design quality by addressing timing sensitivity, yield variation, and leakage power from the start. … Read More
I learn a lot these days through webinars and videos because IC design tools like schematic capture and custom layout are visually oriented. Today I watched a video presentation from Steve Lewis and Stacy Whiteman of Cadence that showed how Virtuoso 6.1.5 is used in a custom IC design flow:… Read More
Selectively automating non-critical aspects of custom IC design allows engineers to focus on precision-crafting their designs. Cadence circuit design solutions enable fast and accurate entry of design concepts, which includes managing design intent in a way that flows naturally in the schematic. Using this advanced, parasitic-aware… Read More
Back before Denali was acquired by Cadence they used to run an annual conference called MemCon. Since Denali was the Switzerland of EDA, friend of everyone and enemy of none, there would be presentations from other memory IP companies and from major EDA companies. For example, in 2010, Bruggeman, then CMO of Cadence, gave the opening… Read More
Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.
Here’s… Read More
What does mango beer have to do with semiconductor design and manufacturing? At a table of beer drinkers from around the world I would have never thought fruity beer would pass a taste test, not even close. As it turns out, the mango beer is very good! Same goes for 20nm planar devices. “Will not work”, “Will not yield”, “Will not scale”,… Read More
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
Mark Twain remarked that everyone talks about the weather but nobody does anything about it. 3D ICs seems to be a bit like that. Over the last couple of years there have been lots of people talking about 3D but very little that has actually been manufactured. In addition to the weather, everyone talks about Xilinx’s 3D Virtex… Read More
Cadence invited Francois Lemery of ST Microelectronics to speak at a luncheon last Monday at DAC about designing for the 20nm node using module generators. Here are my trip report notes:
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
Podcast EP16: Hyperscale Computing & Changes in the Datacenter
Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus
Most Viewed Blog 2018
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