Now a day, a SoC can be highly complex, having 100s of IPs performing various functionalities along with multi-core CPUs on it. Managing power, performance and area of the overall semiconductor design in the SoC becomes an extremely challenging task. Even if the IPs and various design blocks are highly optimized within themselves,… Read More
Front-End Design Summit: Physically Aware Design
Save closure time and boost performance by incorporating knowledge of physically aware design early into your front-end design implementation flow
With the adoption of advanced process nodes, design closure is becoming increasingly difficult due to the lack of convergence between the front end and the back end of the register-transfer… Read More
Signoff Summit and Voltus
Yesterday Cadence had an all-day Signoff Summit where they talked about the tools that they have for signoff in advanced nodes. Well, of course, those tools work just fine in non-advanced nodes too, but at 20nm and 16nm there are FinFETs, double patterning, timing impacts from dummy metal fill, a gazillion corners to be analyzed… Read More
Meeting the Challenges of Designing Internet of Things SoCs with the Right Design Flow and IP
Connecting “things” to the Internet and enabling sensing and remote control, data gathering, transmission, and analysis improves many areas: safety and quality of life, healthcare, manufacturing and service delivery, energy efficiency, and the environment. The concept of the Internet of Things (IoT) is quickly becoming… Read More
Cadence Design Systems’ Shares Are Surprisingly Cheap
In the third and final (for now) part of this series on the EDA design tool vendors, I’d like to take a closer look at Cadence Design Systems. This is probably the most interesting of the three from both an industry perspective as well as an investment perspective for a variety of reasons. With that said I’d like to first provide some … Read More
Signoff Summit: The Fastest Path to Design Signoff
Cadence’s Signoff Summit will be held next week, November 21 at Cadence in San Jose.
This is the first of a series of all-day Signoff Summits from Cadence that focus on the multiple facets of design signoff. This first summit will include keynote addresses plus sessions covering the multiple solution components that comprise… Read More
A New IC Power Integrity Tool
In EDA we have come to expect that only small start-up companies create new tools, however a team at Cadencehas developed a new IC power integrity tool called Voltus from scratch. To learn more I spoke last week with KT Moore, a Group Director at Cadence. I’ve known KT for over a decade, and first met him when he was at Magma marketing… Read More
nVidia: Virtual Platform/Emulation Hybrid
I was the VP marketing at VaST Systems Technology and then at Virtutech. Both companies sold virtual platform technology which consisted of two parts:
- an extremely fast processor emulation technology that actually worked by doing a binary translation of the target binary code (e.g. an ARM) into the native instruction set of the
ARM in Samsung 14nm FinFET
I am at ARM TechCon today. One interesting presentation was made jointly between Samsung, Cadence and ARM themselves about developing physical libraries (ARM), a tool flow (Cadence) and test chips (Samsung). It was titled Samsung ARM and Cadence collaborate on the silicon-proven world first 14-nm FinFET Cortex-A7 ARM CPU and… Read More
Cadence’s Mixed-Signal Technology Summit
On October 10, I attended another Cadence Summit, this one titled the Cadence Mixed-Signal Technology Summit. Recently, I had written about the Cadence Silicon Verification Summit. The verification event was the first of its kind, and I thought it had terrific content. Being more of a digital guy myself, I was unaware that Cadence… Read More