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How Sonics Uses Jasper Formal Verification

How Sonics Uses Jasper Formal Verification
by Paul McLellan on 11-11-2014 at 7:00 am

The Jasper part of Cadence announced jointly with Sonics a relationship whereby Sonics uses JasperGold Apps as part of their verification. I talked to Drew Wingard, the CTO, about how they use it.

One way is during the day when their design engineers use Jasper as part of their verification arsenal. Interestingly it is the design… Read More


Semiconductor Safety

Semiconductor Safety
by Daniel Nenni on 11-06-2014 at 7:00 am

Semiconductors and automotive are now like peanut butter and jelly. Certainly you can have one without the other but why would you? I remember when a car first talked to me telling me that the door was ajar. It sounded more like, “the door is a jar” but I got the point. Now my car tells me just about everything including what is wrong with… Read More


In-Design DFM Signoff for 14nm FinFET Designs

In-Design DFM Signoff for 14nm FinFET Designs
by Pawan Fangaria on 11-04-2014 at 4:00 pm

While FinFET yield controversy is going on, I see a lot being done to improve that yield by various means. One prime trend today, it must be, it’s worthwhile, is to pull up various signoffs as early as possible during the design cycle. And DFM signoff is a must with respect to yield of fabrication. This reminds me about my patents filed… Read More


Cadence Mixed Signal Technology Forum

Cadence Mixed Signal Technology Forum
by Paul McLellan on 10-29-2014 at 7:00 am

Yesterday was Cadence’s annual mixed-signal technology forum. I think that there was a definite theme running through many of the presentations, namely that wireless communication of one kind or another is on a sharp rise with more and more devices needing to connect to WiFi, Bluetooth and so on. This was most obvious during… Read More


How ST Designs with Layout Dependent Effects (LDE)

How ST Designs with Layout Dependent Effects (LDE)
by Daniel Payne on 10-15-2014 at 12:00 am

I first visited STat their Agrate, Italy site where Flash memory development is done. At DACthis year Antonio Bogani talked about how ST designs with LDE while using EDA tools and a PDK (Process Design Kit) from Cadence. They recorded the 17 minute presentation, and you can view it herewithout having to register. Antonio’s… Read More


TSMC ♥ Cadence!

TSMC ♥ Cadence!
by Daniel Nenni on 10-11-2014 at 4:30 pm

One of the questions I routinely ask amongst the fabless semiconductor ecosystem is, “How are the EDA vendors doing?” There are always complaints because, let’s face it, we all like to complain. On occasion however I do hear about a vendor who goes above and beyond the call of duty and it really brightens my day.

Of late,… Read More


10nm, the View from IBM

10nm, the View from IBM
by Paul McLellan on 10-05-2014 at 7:01 am

On the Cadence booth at DAC, Lars Liebmann of IBM presented on the challenges of 10nm. As he put it, how the lithography folks are keeping things very interesting for the EDA tool development engineers. Although 14nm/16nm hasn’t yet ramped into HVM, the advanced work for tools and IP has all moved to 10nm. Although Lars gave… Read More


Key Collaboration to Enable Designs at Advanced Nodes

Key Collaboration to Enable Designs at Advanced Nodes
by Pawan Fangaria on 10-03-2014 at 10:00 pm

In the semiconductor ecosystem, several partners (or better to say stakeholders) join together in the overall value chain to finally output the most coveted chip, err I should say SoC these days. It becomes really interesting when we start analyzing the real value added by each of them, none appears to be less. Well, then to whom … Read More


Samsung 14nm FinFET Design with Cadence Tools

Samsung 14nm FinFET Design with Cadence Tools
by Daniel Payne on 09-22-2014 at 5:30 pm

The first consumer products with 20nm processing are arriving in 2014 like the 2 billion transistor A8 chip in the iPhone 6, however at the 14nm node there are new designs underway to continue the trend of Moore’s Law. To get a better feel for the challenges of designing with 14nm FinFET technology I watched a 23 minute video … Read More


SmartScan Addresses Test Challenges of SoCs

SmartScan Addresses Test Challenges of SoCs
by Pawan Fangaria on 09-04-2014 at 4:00 pm

With advancement of semiconductor technologies, ever increasing sizes of SoCs bank on higher densities of design rather than giving any leeway towards increasing chip area and package sizes; a phenomenon often overlooked. The result is – larger designs with lesser number of pins bonded out of ever shrinking package sizes;… Read More