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IBIS-AMI Back-Channel System Optimization in Practice

IBIS-AMI Back-Channel System Optimization in Practice
by Mike Gianfagna on 02-18-2020 at 6:00 am

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I recently spent some time at DesignCon 2020 in Santa Clara. For those who haven’t attended this show in a while, you need to go. It’s no longer a small event focused on chip design. It has grown into a true system-level conference, with a broad ecosystem represented on the show floor and in the technical sessions. Ecosystem is an important… Read More


AI Interposer Power Modeling and HBM Power Noise Prediction Studies

AI Interposer Power Modeling and HBM Power Noise Prediction Studies
by Mike Gianfagna on 02-07-2020 at 6:00 am

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I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More


Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes

Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes
by Mike Gianfagna on 02-04-2020 at 10:00 am

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This year is the 25th anniversary for DesignCon.  The show has changed a lot over the years. Today, it’s a vibrant showcase of all aspects of advanced product design – from ICs to boards to systems. The show floor reflects the diverse ecosystem. If you missed it this year, definitely plan to go next year.

The DesignCon technical program… Read More


Computing with Light

Computing with Light
by Daniel Nenni on 12-27-2019 at 6:00 am

Evolution of programmable photonics

I recently wrote about this year’s Cadence Photonics Summit. As I mentioned in that post, it was a fascinating event with several companies providing useful and informative presentations. You can access some of the presentations on the event site. One presentation, given by Jose Capmany of iPronics, was especially interesting… Read More


Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology

Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
by Tom Dillinger on 12-18-2019 at 10:00 am

Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology.  A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer;  the interposer… Read More


Cadence Continues Photonics Industry Engagement

Cadence Continues Photonics Industry Engagement
by Daniel Nenni on 12-17-2019 at 10:00 am

On November 13, Cadence held its annual Photonics Summit. Cadence has been hosting this event for several years with the intention of advancing the photonics industry. With this event, Cadence has been a catalyst in furthering photonic product development. It’s quite remarkable that Cadence hosts such an event in a field where… Read More


Another Smart EDA Merger Adds RF Tools

Another Smart EDA Merger Adds RF Tools
by Daniel Payne on 12-12-2019 at 10:00 am

Cadence acquires AWR

Mergers and acquisitions are just a fact of modern business life, so the semiconductor, IP and EDA industries all can benefit, but only when the two companies have complementary products with some actual synergy. Cadence acquired OrCAD back in 1999, adding a Windows-based PCB tool to their product lineup, and here in 2019 some … Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More


Cadence and Green Hills Share More Security Thoughts at ARM Techcon

Cadence and Green Hills Share More Security Thoughts at ARM Techcon
by Randy Smith on 10-15-2019 at 10:00 am

On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More


Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market

Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market
by Tom Simon on 09-24-2019 at 6:00 am

A few years back people were saying that the “EDA” problem was solved and that design tools had become commodity. At the same time people hailed ADAS, smart homes, mobile communication and AI as the frontiers of electronics.  Perhaps it could be said that layout tools, routers, placers, and circuit simulators had largely matured… Read More