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Methodology for Aging-Aware Static Timing Analysis

Methodology for Aging-Aware Static Timing Analysis
by Tom Dillinger on 12-28-2021 at 10:00 am

char STA flow

At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.)  This article reviews the highlights of their presentation.

BackgroundRead More


Scalable Concolic Testing. Innovation in Verification

Scalable Concolic Testing. Innovation in Verification
by Bernard Murphy on 12-23-2021 at 10:00 am

Scalable Concolic Testing

Combining simulation and symbolic methods is an attractive way to excite rare branches in block-level verification, but is this method really scalable? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and I continue our series on research ideas. As always,… Read More


More Than Moore and Charting the Path Beyond 3nm

More Than Moore and Charting the Path Beyond 3nm
by Kalar Rajendiran on 12-22-2021 at 10:00 am

Cadence AIML Technologies

The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More


Topics for Innovation in Verification

Topics for Innovation in Verification
by Bernard Murphy on 12-21-2021 at 6:00 am

signpost min

Paul, Raúl and I are having fun with our Innovation in Verification series, and you seem to be also, judging by the hit rates we’re getting. We track these carefully to judge what you find most interesting and what seems to fall more under the category of “Meh”. Paul and others also get informal feedback in client meetings but it would… Read More


Learning-Based Power Modeling. Innovation in Verification

Learning-Based Power Modeling. Innovation in Verification
by Bernard Murphy on 11-23-2021 at 6:00 am

Innovation New

Learning-Based Power Modeling. Innovation in Verification

Is it possible to automatically generate abstract power models for complex IP which can both run fast and preserve high estimation accuracy? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and… Read More


Battery Sipping HiFi DSP Offers Always-On Sensor Fusion

Battery Sipping HiFi DSP Offers Always-On Sensor Fusion
by Tom Simon on 11-11-2021 at 10:00 am

HiFi DSP

Earbuds are one of the fastest growing market segments, which is creating the need for audio DSPs with higher performance and a smaller energy footprint. More than just being wireless speakers – earbuds, and wearables for that matter, have become a sophisticated extension of the user interface of phones and laptops, etc.… Read More


Memory Consistency Checks at RTL. Innovation in Verification

Memory Consistency Checks at RTL. Innovation in Verification
by Bernard Murphy on 10-28-2021 at 6:00 am

Innovation New

Multicore systems working with shared memory must support a well-defined model for consistency of thread accesses to that memory. There are multiple possible consistency models. Can a design team run memory consistency checks at RTL? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur,… Read More


Cadence Reveals Front-to-Back Safety

Cadence Reveals Front-to-Back Safety
by Bernard Murphy on 10-27-2021 at 6:00 am

J897 Functional Safety Press Image small min

This is another level-up story, a direction I am finding increasingly appealing. This is when a critical supplier in the electronics value chain moves beyond islands of design automation to provide an integrated solution for the front-to-back design for capabilities now essential for automotive and industrial automation … Read More


Design Planning and Optimization for 3D and 2.5D Packaging

Design Planning and Optimization for 3D and 2.5D Packaging
by Tom Dillinger on 10-25-2021 at 6:00 am

platform

Introduction

Frequent SemiWiki readers are aware of the growing significance of heterogeneous multi-die packaging technologies, offering a unique opportunity to optimize system-level architectures and implementations. The system performance, power dissipation, and area/volume (PPA/V) characteristics of a multi-die… Read More


On-Device Tensilica AI Platform For AI SoCs

On-Device Tensilica AI Platform For AI SoCs
by Kalar Rajendiran on 10-05-2021 at 6:00 am

Varying On Device AI Requirements 1

During his keynote address at the CadenceLIVE 2021 conference, CEO Lip-Bu Tan made some market trend comments. He observed that most of the data nowadays is generated at the edge but only 20% is processed there. He predicted that by 2030, 80% of data is expected to be processed at the edge. And most of this 80% will be processed on edge… Read More