hip webinar automating integration workflow 800x100 (1)
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This is How We Autonomous

This is How We Autonomous
by Roger C. Lanctot on 10-13-2017 at 12:00 pm

Some days it seems like the world is obsessed with autonomous vehicles. No one really understands why. Surveys tell us that consumers are both interested in and repelled by self-driving cars. What’s missing is the business model – the commercial reason for the existence of self-driving cars.

Today’s announced acquisition of Read More


Why Cars aren’t as Safe as Planes

Why Cars aren’t as Safe as Planes
by Roger C. Lanctot on 10-12-2017 at 12:00 pm

People are often confused and amazed that airline travel is so much safer than travel by bus, rail or car. The safety of air travel is truly miraculous, particularly in comparison to the disastrous history of terrestrial travel.

This reality was highlighted by the latest fatality data released by the U.S. Department of Transportation… Read More


TechCon: See ANSYS and TSMC co-present

TechCon: See ANSYS and TSMC co-present
by Bernard Murphy on 10-12-2017 at 7:00 am

ANSYS and TSMC will be co-presenting at ARM TechCon on Multiphysics Reliability Signoff for Next Generation Automotive Electronics Systems. The event is on Thursday October 26th, 10:30am-11:20am in Grand Ballroom B.


You can get a free Expo pass which will give you access to this event HERE and see the session page for the event … Read More


AI Based Software Designing AI Based Hardware – Autonomous Automotive SoC Platform

AI Based Software Designing AI Based Hardware – Autonomous Automotive SoC Platform
by Mitch Heins on 10-10-2017 at 12:00 pm


For those of you who missed the NetSpeed Systems, Imagination Technologies webinar, “Alexa, can you help me build a better SoC”, you’ll be happy to hear that the session was recorded and can still be viewed (see link at the bottom of this page). I’ll warn you now however, that this was a high-bandwidth session packed with information,… Read More


Driver Distraction? Don’t Look at Me!

Driver Distraction? Don’t Look at Me!
by Roger C. Lanctot on 10-06-2017 at 7:00 am

The Automobile Club of America’s (AAA) ongoing battle with driver distraction, among other issues such as drowsy driving and teen driving, turns a new page with a report flagging 23 of 30 tested in-vehicle infotainment systems as demanding that drivers pay a high or very high level of attention when performing tasks with… Read More


Semiconductor IP on Fortune’s 2017 100 Fastest-Growing Companies List!

Semiconductor IP on Fortune’s 2017 100 Fastest-Growing Companies List!
by Daniel Nenni on 10-04-2017 at 7:00 am

The Semiconductor IP market has always been a big draw for SemiWiki readership and I expect that to continue. One of the more interesting companies we have covered over the past 6+ years is CEVA, who is now on Fortune’s 2017 100 Fastest-Growing Companies List. In fact, CEVA is the ONLY semiconductor IP company on the list and they join… Read More


Robust NVM Solutions for Specialty and Advanced FinFET Technologies Webinar

Robust NVM Solutions for Specialty and Advanced FinFET Technologies Webinar
by Daniel Nenni on 09-25-2017 at 12:00 pm

Webinars are a very effective communications channel in a fast paced industry like semiconductor design. If you sign-up in advance and you can’t make the live version, you will be automatically notified when the replay is available so you can watch it at your leisure. I’m guilty of this for sure, because of my hectic… Read More


Walden Rhines on the Automotive Electronics Landscape

Walden Rhines on the Automotive Electronics Landscape
by Roger C. Lanctot on 09-23-2017 at 8:00 am

Mentor President and CEO Walden Rhines gave a comprehensive overview of the automotive electronics landscape at the Mentor Integrated Electrical Solutions Forum (IESF) in Plymouth, Mich., this week. A key focal point of Rhines’ comments was the twin industry disruptors: EVs and AVs.

A Texas Instruments alum, Rhines described… Read More


Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs

Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs
by Bernard Murphy on 09-17-2017 at 7:00 am

In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More