We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More
Podcast EP223: The Impact Advanced Packaging Will Have on the Worldwide Semiconductor Industry with Bob Patti
Dan is joined by Bob Patti, the owner and President of NHanced Semiconductors. Previously, Bob founded ASIC Designs Inc., an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he participated in more than 100 tapeouts. Tezzaron Semiconductor grew from that company, with… Read More
Successful 3DIC design requires an integrated approach
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?