Many credible market analysis firms are predicting the semiconductor market to reach the trillion dollar mark over the next six years or so. Just compare this to the more than six decades it took for the market to cross the $500 billion mark. The projected growth rate is incredible indeed and is driven by fast growing market segments… Read More
Author: Kalar Rajendiran
Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint
Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months
The semiconductor industry has been responding to increasing device complexity and performance requirements in multiple ways. To create smaller and more densely packed components, the industry is continually advancing manufacturing technology. This includes the use of new materials and processes, such as extreme ultraviolet… Read More
Real-Time AI-driven Image Signal Processing with Reduced Memory Footprint and Processing Latency
In our day to day lives, we all benefit from image signal processing (ISP), whether everyone realizes it or not. ISP is the technique of processing image data captured by an imaging device. It involves a series of algorithms that transform raw image data into a usable image by correcting for distortions, removing noise, adjusting… Read More
Coherent Optics: Synergistic for Telecom, DCI and Inter-Satellite Networks
The telecommunications industry has experienced significant growth in recent years, driven by the increasing demand for high-speed internet and data services. This growth has created a surge in traffic on optical networks, leading to the development of new telecom network architectures that can support the increasing demand… Read More
IP Lifecycle Management for Chiplet-Based SoCs
Chiplet-based System-on-Chips (SoCs) are becoming increasingly popular in the semiconductor industry due to their potential to improve design efficiency, increase performance, and reduce costs. While chiplets are seen as a way to reduce the cost of innovation, they introduce a lot of challenges too. Packaging, interconnect… Read More
Driving the Future of HPC Through 224G Ethernet IP
The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More
Emerging Stronger from the Downturn
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
Chiplet Modeling and Workflow Standardization Through CDX
Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More
Alchip is Golden, Keeps Breaking Records on Multiple KPIs
I don’t know the story behind the name Alchip. I’ve been asking this question ever since its founding in 2003 and still haven’t found the answer. Wikipedia sometimes provides insights and stories behind names of companies, products and services but I couldn’t find any regarding the name Alchip. One thing is for sure. After its consistent… Read More








Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business