CEO Interview with Dr. Mohammad Rastegari of Elastix.AI

CEO Interview with Dr. Mohammad Rastegari of Elastix.AI
by Daniel Nenni on 03-15-2026 at 2:00 pm

mohammad headshot

Mohammad Rastegari is a prominent AI researcher and entrepreneur currently serving as the CEO and Co-Founder of Elastix.AI. Based in the Greater Seattle Area, he also holds the position of Affiliate Assistant Professor at the University of Washington’s Electrical & Computer Engineering Department. His professional… Read More


Tesla and Samsung Relationship Update

Tesla and Samsung Relationship Update
by Daniel Nenni on 03-15-2026 at 8:00 am

Elon Musk Lip Bu Tan Wafer Deal

The majority of my 40+ year career has been spent managing the relationship between leading-edge semiconductor design and manufacture, working with just about every commercial foundry and top customer in one way or another. It’s my thing—it fascinates me. I’m also a fan of disruption, and the latest disruptions the semiconductor… Read More


Agentic AI and the Future of Engineering

Agentic AI and the Future of Engineering
by Daniel Nenni on 03-13-2026 at 6:00 am

sassine announces agentic ai hires converge 2026

Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are now dealing with… Read More


WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge 

WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge 
by Daniel Nenni on 03-12-2026 at 10:00 am

A Practical Blueprint for Scaling the Digital Foundation of Silicon Photonics and Co Packaged Optics (1)

The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much

Read More

Ravi Subramanian on Trends that are Shaping AI at Synopsys

Ravi Subramanian on Trends that are Shaping AI at Synopsys
by Daniel Nenni on 03-12-2026 at 8:00 am

Ravi Interview Synopsys Converge

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More


Axiomise Introduces nocProve to Transform NoC Design Verification

Axiomise Introduces nocProve to Transform NoC Design Verification
by Daniel Nenni on 03-12-2026 at 6:00 am

Axiomise Launches nocProve for NoC Verification

Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely.

The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More


Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers

Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers
by Daniel Nenni on 03-10-2026 at 8:00 am

CAE INL 2025

Mid-infrared (MIR) photonic integrated circuits are emerging as a key technology for applications ranging from environmental monitoring and medical diagnostics to defense and industrial process control. The MIR spectral region, often referred to as the molecular “fingerprint” region, exhibits strong absorption features… Read More


Efficient Bump and TSV Planning for Multi-Die Chip Designs

Efficient Bump and TSV Planning for Multi-Die Chip Designs
by Daniel Nenni on 03-10-2026 at 6:00 am

Efficient Bump and TSV Planning for Multi Die Chip Designs

The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More


The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem

The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem
by Daniel Nenni on 03-09-2026 at 10:00 am

RISC V Now Andes Conference

During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More


Capability Hardware Enhanced RISC Instructions CHERI Alliance

Capability Hardware Enhanced RISC Instructions CHERI Alliance
by Daniel Nenni on 03-09-2026 at 8:00 am

CHERI Alliance Overview 2026

The CHERI Alliance is a non-profit organization dedicated to accelerating the global adoption of CHERI (Capability Hardware Enhanced RISC Instructions), a technology designed to improve computer security at the hardware level. Established as an independent entity, the Alliance brings together industry leaders, researchers,… Read More