ChipAgents has introduced Build-A-Chip-Bench, a benchmark developed with NVIDIA to evaluate whether AI agents can complete digital chip design tasks from specification through physical implementation. The initiative measures progress beyond generating hardware code, asking whether autonomous systems can deliver verified… Read More
Author: Daniel Nenni
ChipAgents and NVIDIA Put Autonomous Chip Design to the Test
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
EUV has long been an interesting story. We have written 200+ articles on EUV and they just keep on coming. Thankfully the premier lithography conference is right here in Silicon Valley. SPIE began in 1955 as the Society of Photographic Instrumentation Engineers, bringing together engineers using scientific cameras and high-speed… Read More
CEO Interview with Alex Higginbottom of Zenithon
Alex Higginbottom is co-founder and CEO of Zenithon, which he started with Abetharan Antony in July 2025 to build the first world models for extreme physics. He previously worked in deeptech commercialisation and spent time in fusion research, starting a PhD in the field before leaving after a year to build the company.
Tell … Read More
TSMC 2026 OIP Ecosystem Forum Summary
TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More
CASPA CEO Summit and Why it Matters
It’s an honor to attend events like this as a guest, and even more so as a speaker. On Friday at 3:30 p.m., I’ll be moderating a panel with the CEOs of three of the hottest AI startups. I definitely have a few questions ready for them! My beautiful wife and I will also be at the banquet. I hope to see you there!
The CASPA CEO Summit arrives … Read More
CEO Interview with Lieuwke de Jong of Sweet Atoms
Lieuwke de Jong is a globally experienced executive and entrepreneur who operates at the intersection of industry, government and innovation. His career spans defense-aligned sectors, aerospace, energy, life sciences and advanced materials and he is known for connecting stakeholders across government, research and industry… Read More
Data Center Energy Trends Force a Rethink of Chip Power Delivery
Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:
Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More
WEBINAR: The Convergence of Edge Accelerators
The rapid growth of AI at the edge is forcing SoC architects to rethink traditional processor designs. Dedicated NPUs deliver impressive performance for today’s models, but evolving AI workloads, increasing system complexity and growing pressure on power and silicon budgets are exposing the limitations of fixed-function… Read More
From Cloud to Silicon: IC-Link and TSMC Open the Door
Access to advanced semiconductor technology involves much more than choosing a process node. Design teams also need computing capacity, compatible tools, secure technology access, and experienced support. IC-Link by imec’s expanded collaboration with TSMC addresses that combination, potentially making sophisticated… Read More
Beyond the Die: Verifying the Connected Chip
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
Jensen Huang and the Cost of Unchecked Influence