AI-designed Chip Points Toward a Faster Future for Custom Silicon

AI-designed Chip Points Toward a Faster Future for Custom Silicon
by Daniel Nenni on 08-27-2026 at 10:00 am

AI Designed Chip Why Redwood Matters

Architect Labs says it has created Redwood, an AI accelerator designed and verified almost entirely by artificial intelligence in less than two weeks. If independently validated and successfully translated from a programmable prototype into manufactured silicon, the project could represent a major change in how computer… Read More


Huawei Can’t Shrink Its Chips, So It’s Folding Them

Huawei Can’t Shrink Its Chips, So It’s Folding Them
by Daniel Nenni on 08-27-2026 at 8:00 am

Huawei Can’t Shrink Its Chips, So It’s Folding Them

On May 25, Huawei semiconductor chief He Tingbo unveiled LogicFolding, an architecture intended to advance chip performance without relying on ever-smaller transistors. Presented alongside Huawei’s “Tau Scaling Law,” the approach prioritizes signal speed over transistor dimensions. It is a genuine engineering response… Read More


A comeback journey: Rebuilding confidence through formal verification

A comeback journey: Rebuilding confidence through formal verification
by Daniel Nenni on 08-26-2026 at 10:00 am

Lindu K

When Lindu Krishna joined Axiomise after a career break, she wasn’t just relearning technical concepts – she was rebuilding her confidence, redefining what it means to be a woman engineer and quietly becoming the person who can take ownership of complex formal verification blocks. Backed by a culture where nobody sits … Read More


Synopsys Wins the AI Silicon Brain Drain

Synopsys Wins the AI Silicon Brain Drain
by Daniel Nenni on 08-25-2026 at 4:00 pm

Synopsys Wins the AI SIlicon Brain Drain

The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More


Webinar: Warpage has a Timing Problem

Webinar: Warpage has a Timing Problem
by Daniel Nenni on 08-25-2026 at 9:00 am

Thermo mechanical (1)

In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.

JOHN BRUGGEMAN


By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the … Read More


Avestra: Agentic AI for SystemVerilog Assertion Generation

Avestra: Agentic AI for SystemVerilog Assertion Generation
by Daniel Nenni on 08-24-2026 at 2:00 pm

Avestra Studio Tuple Tech

Modern ASIC, SoC, CPU, and GPU development depends on verification processes that detect subtle functional defects before tapeout. SystemVerilog Assertions (SVA) are particularly important because they encode temporal design intent: how signals, states, and transactions must behave across clock cycles. Unlike conventional… Read More


The Sky’s the Limit: SiFive’s BigSky Brings RISC-V to the Datacenter

The Sky’s the Limit: SiFive’s BigSky Brings RISC-V to the Datacenter
by Daniel Nenni on 08-24-2026 at 6:00 am

The Sky’s the Limit SiFive’s BigSky Brings RISC V to the Datacenter

SiFive is bringing RISC-V closer to mainstream datacenter deployment with the BigSky SF-2U870, an enterprise-grade development server designed for hyperscalers, semiconductor companies, software vendors, and ecosystem partners. Announced in Santa Clara on August 24, 2026, alongside Hot Chips, the rackable 2U platform… Read More


How TSMC Is Wiring the AI Era With Light

How TSMC Is Wiring the AI Era With Light
by Daniel Nenni on 08-21-2026 at 10:00 am

How TSMC Is Wiring the AI Era With Light

TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More


Intel Eyes a Memory Comeback as AI Rewrites Chip Economics

Intel Eyes a Memory Comeback as AI Rewrites Chip Economics
by Daniel Nenni on 08-21-2026 at 6:00 am

Intel Eyes Memory Comeback

Intel is considering a return to memory technology decades after abandoning mainstream DRAM and, more recently, selling its NAND business. Chief executive Lip-Bu Tan has argued that memory should no longer be viewed simply as a low-margin commodity. Artificial intelligence is turning bandwidth, latency and data movement … Read More


CEO Interview with Ajit Prabhu of Quest Global

CEO Interview with Ajit Prabhu of Quest Global
by Daniel Nenni on 08-20-2026 at 12:00 pm

Ajit Prabhu CEO Quest Global Headshot

Ajit Prabhu is the Co-Founder and CEO of Quest Global, a global engineering services company driven by a single purpose: to be the most trusted partner for solving the world’s hardest engineering problems. Under his leadership, Quest Global has built long-term, sustainable partnerships and delivers end-to-end engineering… Read More