Given the success of the event in Silicon Valley last week, I would expect the Siemens U2U event in Munich to be even bigger. In my experience this has been the best user driven event in 2026 with the deepest customer content. EDA has always been a customer driven industry and it is good to see us recognize that from time to time. Kalar … Read More
Author: Daniel Nenni
Siemens U2U 3D IC Design and Verification Panel
CEO Interview with Geoffrey Rodgers of Chameleon Semiconductor
Geoffrey Rodgers spent most of his career at the intersection of semiconductor technology and go-to-market execution, with a focus on scaling businesses and bringing complex solutions to market. He previously led the Analog Go-To-Market motion at Synopsys following the acquisition of Analog Design Automation and held leadership… Read More
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Dr. Y.J. Mii on TSMC Technology Leadership in 2026
Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More
Advanced Microelectronics Paving the Way for 6G with Alphacore
The world stands at the threshold of a new era in wireless communication as research communities, standards bodies, and technology companies begin shaping what will become sixth generation mobile networks. While fifth generation systems are still expanding across global markets, attention has already shifted toward defining… Read More
WAVE-N Specialized Video Processing NPU for Edge AI Systems
The rapid growth of AI applications in edge devices has created a strong demand for specialized hardware capable of performing high-performance neural network inference under strict power and latency constraints. Traditional CPUs and GPUs often struggle to meet the efficiency requirements of embedded and mobile systems.… Read More
Dr. Cliff Hou and the TSMC N2 Process Technology
Before assuming his current position, Dr. Hou held several key leadership roles. He served as Vice President of Design and Technology Platform from 2011 to 2018, and later as Vice President of Technology Development starting in August 2018. Earlier in his career, from 1997 to 2007, he established TSMC’s technology design kit
Scalable Network-on-Chip Enables a Modular Chiplet Platform
The semiconductor industry is undergoing a profound transformation as system complexity, performance expectations, and time-to-market pressures continue to rise. Traditional monolithic system-on-chip (SoC) designs are increasingly giving way to modular, chiplet-based architectures that enable flexibility, scalability,… Read More
All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
SemiWiki Q&A with Julie Rogers, Executive Director, ESD Alliance
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts … Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs