Design the Right Chip: Why Prototyping Has to Be Easy

Design the Right Chip: Why Prototyping Has to Be Easy
by Daniel Nenni on 10-15-2026 at 10:00 am

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Design the right chip. Design the chip right.

Every verification methodology in mainstream use answers the second half of that sentence and assumes the first. Simulation, emulation, formal, constrained-random testbenches, coverage closure — all of them take a specification as given and ask whether the implementation matches… Read More


Why AI Security Starts at the Chip Level

Why AI Security Starts at the Chip Level
by Daniel Nenni on 10-15-2026 at 6:00 am

Luminous Shield Over an AI Chip

Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital services. As these systems grow more capable, they also process more sensitive information and depend on increasingly complex hardware. The Synopsys white paper, “Securing… Read More


CTO Interview with Sirish Munipalli of Moores Lab AI

CTO Interview with Sirish Munipalli of Moores Lab AI
by Daniel Nenni on 10-14-2026 at 12:00 pm

Agentic AI for chip verification

Sirish Munipalli is Co-Founder and CTO of Moores Lab AI, where he leads the development of agentic AI for chip design verification, including SpecAgent(tm), the company’s specification and modeling platform. He has spent about 15 years designing and verifying complex silicon: FPGA prototyping at Intel, post-silicon validation… Read More


Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company

Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company
by Daniel Nenni on 10-13-2026 at 12:00 pm

Eric Hong Enabling Silicon Success

Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel, leading the development… Read More


Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

Teradyne Unveils Magnum E2 for the Next Wave of AI Memory
by Daniel Nenni on 10-13-2026 at 10:00 am

High speed memory testing for AI

Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More


Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs

Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs
by Daniel Nenni on 10-13-2026 at 6:00 am

Open software unites chips and AI

Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More


CTO Interview with Dr. Zakir Syed of ClockEdge

CTO Interview with Dr. Zakir Syed of ClockEdge
by Daniel Nenni on 10-12-2026 at 12:00 pm

Precision for every clock edge

Dr. Zakir Syed is Co-founder and Chief Technology Officer of ClockEdge, where he has played a central role in developing specialized simulation technology for advanced semiconductor clock networks. He brings more than 30 years of experience in electronic design automation and semiconductor verification. He joined Simplex… Read More


Chips&Media targets AI memory bottlenecks with new compression IP

Chips&Media targets AI memory bottlenecks with new compression IP
by Daniel Nenni on 10-12-2026 at 10:00 am

Chips&Media targets AI memory bottlenecks with new compression IP

Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an expansion beyond video applications… Read More


Keysight Advances its Design Software with Agentic AI

Keysight Advances its Design Software with Agentic AI
by Daniel Nenni on 10-12-2026 at 6:00 am

AI Orchestrates RF Circuit Design

Keysight Technologies is opening a new route for artificial intelligence into radio frequency engineering. Announced on October 6, 2026, its latest software capabilities let engineers connect their own AI agents and large language models to Advanced Design System (ADS) 2027. Agents can help generate and optimize circuits,… Read More


DAC 2027 Opens Call for Contributions as AI Reshapes Chip Design

DAC 2027 Opens Call for Contributions as AI Reshapes Chip Design
by Daniel Nenni on 10-11-2026 at 12:00 pm

DAC 2027 AI reshapes chip design

The Design Automation Conference is the premier semiconductor ecosystem conference. I have attended 43 DACs including the most recent one in Long Beach. My first DAC was in Albuquerque NM. It was a month after my University so i was still in college mode. DAC was quite the celebration back then so I fit right in

I remember conferences… Read More