The opening of the TSMC 2026 earning call series brought no surprises. CC Wei has done more than 30 such calls since taking the CEO position in 2018 and he never fails to disappoint. Once again, CC Wei reported numbers above guidance driven by strong demand and flawless execution. This illustrates the benefit of TSMC’s close collaborations… Read More
Author: Daniel Nenni
TSMC to Elon Musk: There are no Shortcuts in Building Fabs!
WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence
This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there.
The semiconductor industry faces unprecedented challenges as it pushes toward advanced nodes below 3nm, managing exponential… Read More
Hardening the Silicon: Why Analog Anti-Tamper IP is the New Security Baseline
In today’s increasingly connected world, there are billions of SoCs, powering everything from automotive ECUs to industrial IoT sensors and processing sensitive data. While software-level security is taken seriously, hardware-level vulnerabilities have often been an afterthought. As hackers are now using more complex… Read More
Renesas Scalable Automotive SoC Design Using Arteris NoC
The increasing complexity of advanced driver assistance systems (ADAS) and automated driving architectures has driven a transition from traditional bus-based interconnects to scalable Network-on-Chip (NoC) fabrics. Renesas’ next-generation R-Car automotive SoC platforms adopt Arteris FlexNoC interconnect intellectual… Read More
NoC Matters: Designing the Backbone of Next-Gen AI SoCs
Modern SoC design for artificial intelligence workloads has fundamentally shifted the role of the network-on-chip (NoC) from a simple connectivity fabric to a primary architectural determinant of system performance, power, and scalability. As compute density increases and heterogeneous accelerators proliferate, data… Read More
CEO Interview with Dr. Hardik Kabaria of Vinci
Hardik Kabaria is the founder and CEO of Vinci, a frontier lab building systems that make physical reality continuously computable.
While software has become programmable, physics has remained episodic—accessed through discrete simulations and approximations. Vinci is changing that. Under Kabaria’s leadership, the company
CEO Interview with Steve Kim of Chips&Media
I’m Steve Kim, the CEO of Chips&Media. I’ve been immersed in the multimedia imaging industry for approximately two decades. Prior to joining Chips&Media, I spent over five years working within handset manufacturing companies. Following more than ten years here at Chips&Media in roles spanning Marketing, Sales,… Read More
NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures
As edge AI systems become more centralized and compute-dense, on-chip data movement is increasingly the architectural bottleneck. NXP’s expanded deployment of Arteris network-on-chip (NoC) and cache-coherent interconnect IP highlights a broader industry trend: interconnect architecture is now a first-order design … Read More
Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure
SiFive’s newly announced $400 million Series G financing represents a significant technical inflection point for high-performance RISC-V CPU development targeted at agentic AI data center workloads. The funding, which values the company at $3.65 billion, is specifically intended to accelerate next-generation CPU IP, … Read More
From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More
ASML High-NA EUV is Not Ready for High-Volume Production