CEO Interview with Brendan Emery of iQ Sense

CEO Interview with Brendan Emery of iQ Sense
by Daniel Nenni on 08-07-2026 at 8:00 am

Brendan IQ SENSE

Brendan Emery is Co-Founder and Chief Executive Officer of iQ Sense Technology. He has more than 25 years of international experience in animal health, having held senior commercial leadership roles with organisations including Boehringer Ingelheim and Norbrook Laboratories.

Together with Co-Founder and CTO Madhu Jambunathan,… Read More


Intel and TSMC Take Different Paths to High-NA EUV

Intel and TSMC Take Different Paths to High-NA EUV
by Daniel Nenni on 08-07-2026 at 8:00 am

Intel TSMC HNA EUV 2026

Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More


Intel Foundry and the DAC2026 Ecosystem

Intel Foundry and the DAC2026 Ecosystem
by Daniel Nenni on 08-07-2026 at 6:00 am

Intel Foundry DAC2026

The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.

Intel Foundry also made its presence felt, reminding everyone… Read More


CEO Interview with David Reeder from Entegris

CEO Interview with David Reeder from Entegris
by Daniel Nenni on 08-07-2026 at 6:00 am

David Reeder Entegris SemiWiki CEO Interview

David Reeder became president and CEO of Entegris in 2025, with more than 20 years of semiconductor expertise across IDMs, fabless, foundry, systems, and component companies. Most recently, Dave served as Chief Financial Officer at Chewy where he successfully oversaw all financial functions. Prior to that, Dave was Chief Financial… Read More


New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology

New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
by Daniel Nenni on 08-06-2026 at 2:00 pm

Next generation Bluetooth audio ecosystem

Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More


White Paper: The Semiconductor Foundation of Modern AI Data Centers

White Paper: The Semiconductor Foundation of Modern AI Data Centers
by Daniel Nenni on 08-06-2026 at 10:00 am

The Semiconductor Foundation of Modern AI Data Centers

Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More


Intelligence at the Edge, Leverage at the Core

Intelligence at the Edge, Leverage at the Core
by Daniel Nenni on 08-06-2026 at 10:00 am

CEVA Q2 2026

Ceva’s second-quarter 2026 performance demonstrates how an intellectual-property supplier converts design activity into high-margin revenue before customer products reach production. Total revenue increased 13% year over year to $29.0 million, led by licensing and related revenue of $18.2 million, up 21% and the highest… Read More


McClean Report June 2026: Q2 Semiconductor Market Forecast Update

McClean Report June 2026: Q2 Semiconductor Market Forecast Update
by Daniel Nenni on 08-05-2026 at 10:00 am

McClean Report June 2026 Q2 Semiconductor Market Forecast Update

The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More


Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform

Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
by Daniel Nenni on 08-05-2026 at 6:00 am

Imec Unlocks System Level III V Chiplet Integration on Si CMOS

As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More


Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation

Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation
by Daniel Nenni on 08-04-2026 at 10:00 am

HAV

For modern SoC teams, “shift left” no longer means finding a few more RTL bugs before tape-out. It means moving meaningful system validation earlier—far enough left that firmware, operating systems, drivers, applications, and external interfaces can be exercised before first silicon arrives. This change is essential as software… Read More