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Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely.
The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More
Mid-infrared (MIR) photonic integrated circuits are emerging as a key technology for applications ranging from environmental monitoring and medical diagnostics to defense and industrial process control. The MIR spectral region, often referred to as the molecular “fingerprint” region, exhibits strong absorption features… Read More
The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More
During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More
The CHERI Alliance is a non-profit organization dedicated to accelerating the global adoption of CHERI (Capability Hardware Enhanced RISC Instructions), a technology designed to improve computer security at the hardware level. Established as an independent entity, the Alliance brings together industry leaders, researchers,… Read More
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
Jerome Paye has served as CEO of TAU Systems since late 2025, having joined the company shortly after its founding in 2022 as Chief Operating Officer. In that time, he has helped build TAU Systems into a high-performing team now focused on delivering the ultimate light source for semiconductor lithography.
Paye brings more than… Read More
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
The rapid escalation of cyberattacks over the past two decades has exposed a fundamental weakness at the core of modern computing systems: the lack of memory safety. Industry data consistently shows that the majority of critical software vulnerabilities stem from memory corruption issues such as buffer overflows, use-after-free… Read More
TSMC Technology Symposium 2026 Overview