Consider this a standout presentation at the Silicon Catalyst Spring Portfolio Update Meeting held yesterday at the Computer History Museum. Mahesh Tirupattur, CEO of Analog Bits, is a modern-day, multidimensional semiconductor hero and one of my trusted few. Analog Bits is a premier member of the semiconductor ecosystem,… Read More
Author: Daniel Nenni
What Winemakers and Chip Designers Have in Common
Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More
PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More
CEO Interview with RP Singh of Seasia Infotech
Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More
CEO Interview with Adi Gelvan of Speedata
Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 … Read More
TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More








Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs