CEO Interview with Paul Butler of VeriQuantix

CEO Interview with Paul Butler of VeriQuantix
by Daniel Nenni on 10-04-2026 at 10:00 am

Paul’s Quantum Link Interview

Paul is an experienced CEO/General Manager/Investment Manager who has led and developed teams in a technology domain across the communications, medical and mining industries. With qualifications in Electrical Engineering and a Bachelor of Economics Paul has been able to develop and bring new products to global markets.

Tell… Read More


CEO Interview with Joel Jorgensen of FlowAccel

CEO Interview with Joel Jorgensen of FlowAccel
by Daniel Nenni on 10-04-2026 at 6:00 am

Winning Between the Milestones

Joel Jorgensen founded FlowAccel, helping silicon systems engineering leaders deliver on roadmap commitments and scale development organizations. During 25 years at Intel, he spent 15 years in analog design and architecture for non-volatile memory technologies, earning two patents and co-authoring two IEEE ISSCC papers.… Read More


CEO Interview Greene Tweed

CEO Interview Greene Tweed
by Daniel Nenni on 10-02-2026 at 10:00 am

Greene Tweed

Magen Buterbaugh was appointed President and CEO of Greene Tweed in January 2023. A seasoned leader, with broad industry expertise, Magen has led multiple chemicals & materials-based businesses – spanning from startups to multibillion-dollar enterprises. She led and scaled new innovative research and development platforms… Read More


Intel Foundry: AI performance now depends on the whole system

Intel Foundry: AI performance now depends on the whole system
by Daniel Nenni on 10-02-2026 at 6:00 am

AI performance now depends on the whole system

For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More


TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design

TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design
by Daniel Nenni on 10-01-2026 at 10:00 am

TSMC’s AI Design Kit Bringing Agentic AI Into Chip Design

TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More


OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design Matters

OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design Matters
by Daniel Nenni on 10-01-2026 at 8:00 am

Synopsys OpenAI

Wow, OpenAI and Synopsys just announced a multiyear partnership to develop GPT-Synopsys, a specialized artificial intelligence model for semiconductor design. The agreement combines OpenAI’s frontier models with Synopsys’ electronic design automation software and engineering expertise. Its ambition is to help engineers… Read More


Why the energy sector must plan for post-quantum cyber security now

Why the energy sector must plan for post-quantum cyber security now
by Daniel Nenni on 10-01-2026 at 6:00 am

Why ASML Is Racing to Build 110 EUV Machines

In a September 2026 World Economic Forum article, Ali El Kaafarani argues that energy companies should begin preparing their systems for post-quantum cryptography now. The reason is practical: power infrastructure lasts for decades, while replacing its security can take years. Equipment purchased today may still be operating… Read More


SiFive and AMD Bring ROCm to RISC-V Datacenter Servers—and Why It Matters

SiFive and AMD Bring ROCm to RISC-V Datacenter Servers—and Why It Matters
by Daniel Nenni on 09-30-2026 at 8:00 am

BigSky 2U + Full Rack Render

SiFive and AMD demonstrated an AI workload that brings together two open technologies: the RISC-V processor architecture and AMD’s ROCm GPU software platform. At the AI Infra Summit on September 15, 2026, the companies showed ROCm 10.0 running on SiFive’s BigSky datacenter development server. SiFive P870-D CPUs served as the… Read More


Why Advanced Chip Packaging Is Becoming a Design Problem

Why Advanced Chip Packaging Is Becoming a Design Problem
by Daniel Nenni on 09-29-2026 at 2:00 pm

Why Advanced Chip Packaging Is Becoming a Design Problem

As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More


Siemens and TSMC push AI deeper into chip design

Siemens and TSMC push AI deeper into chip design
by Daniel Nenni on 09-29-2026 at 8:00 am

Siemens and TSMC push AI deeper into chip design

Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More