What Winemakers and Chip Designers Have in Common

What Winemakers and Chip Designers Have in Common
by Daniel Nenni on 05-22-2026 at 6:00 am

What Winemakers and Chip Designers Have in Common

Consider this a standout presentation at the Silicon Catalyst Spring Portfolio Update Meeting held yesterday at the Computer History Museum. Mahesh Tirupattur, CEO of Analog Bits, is a modern-day, multidimensional semiconductor hero and one of my trusted few. Analog Bits is a premier member of the semiconductor ecosystem,… Read More


Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes

Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
by Daniel Nenni on 05-21-2026 at 8:00 am

BroncoBlogPostDetective

A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.

Bronco … Read More


Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More


Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips

Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
by Daniel Nenni on 05-20-2026 at 8:00 am

Semidynamics Secures a Strategic Investment

In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More


PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026

PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
by Daniel Nenni on 05-19-2026 at 10:00 am

PQSNews Ultra small Embedded World

As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More


imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling

imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
by Daniel Nenni on 05-19-2026 at 6:00 am

TSMC 3DFabric Alliance Expansion Signals New Era of System Level Scaling

imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More


AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
by Daniel Nenni on 05-18-2026 at 6:00 am

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More


CEO Interview with RP Singh of Seasia Infotech

CEO Interview with RP Singh of Seasia Infotech
by Daniel Nenni on 05-17-2026 at 2:00 pm

RP Singh Photo (1)

Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More


CEO Interview with Adi Gelvan of Speedata

CEO Interview with Adi Gelvan of Speedata
by Daniel Nenni on 05-17-2026 at 12:00 pm

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Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 Read More


TSMC’s Record Tool Orders Hint at Another CapEx Shockwave

TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
by Daniel Nenni on 05-15-2026 at 8:00 am

TSMC’s Record Tool Orders Hint at Another CapEx Shockwave 2026

TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More