ASML’s dominance was not born from a single invention. It emerged from four decades of systems engineering, supplier orchestration, and repeated bets on lithographic transitions that competitors judged too expensive. Founded in 1984 as a Philips–ASM joint venture, the Dutch company first differentiated itself with modular… Read More
Author: Daniel Nenni
ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution
Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
CEO Interview with Jerry Chen of Upbeat Technology
Jerry Chen, CEO and Founder of Upbeat Technology, received his Master of Science in ECE from the University of Texas at Austin. Started working as an IC design engineer in Silicon Valley at Intel, Lucent, Apple, and Procket Network since 1995. Later transitioned into Technical Marketing roles, serving as Director of Marketing… Read More
Using Claude AI for Chip Design
After speaking with dozens of semiconductor professionals at the Design Automation Conference in Long Beach about AI in the chip-design workflow, Claude emerged as the common denominator in every conversation. We’re still at the tip of the iceberg when it comes to using AI in the design flow. If management is pushing your team … Read More
Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion
Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More
CEO Interview with Leon Lauritsen of Aras
Leon Lauritsen is the CEO of Aras, a leading provider of digital thread solutions for product lifecycle management and engineering AI. He joined the company in 2022 through the acquisition of Minerva PLM, where he had been for over 20 years. While at Minerva, Leon led sales and marketing globally and expanded its geographic coverage… Read More
Comparing Intel EMIB and Intel Foveros
Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More
NVIDIA Brings Agentic AI Toolkit to EDA
NVIDIA’s expansion of the NVIDIA Agent Toolkit with PhysicsNeMo and CUDA-X libraries marks a shift from general-purpose AI assistants toward autonomous engineering systems. Instead of limiting agents to document retrieval, code generation, or workflow automation, the expanded toolkit lets developers connect reasoning… Read More
Synopsys and Intel Foundry Enable System-Level Design on Intel 14A
Synopsys and Intel Foundry are expanding their collaboration to accelerate customer adoption of Intel 14A, connecting advanced process technology with production-ready electronic design automation, silicon intellectual property, multiphysics analysis, and multi-die integration. Announced at the 2026 DAC Chips to … Read More
ChipAgent Raises $134Million and Why it Matters
In my 45 years experience in the semiconductor industry, 43 of that in EDA and IP, I have never seen such a meteoric rise of an EDA company. I do remember money being raised for EDA in the early days but never have I seen such a customer success in such a short amount of time.
I first met ChipAgents at DVCon Silicon Valley in 2025. It was an … Read More
ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance