CEO Interview with Andrew Seddon of CircuitHub

CEO Interview with Andrew Seddon of CircuitHub
by Daniel Nenni on 11-01-2026 at 9:00 am

Andrew Seddon Faster Hardware Development

Andrew Seddon is a British engineer and the co-founder and CEO of CircuitHub. His product design background spans industrial equipment, medical devices and special effects equipment, including work on a motion-capture headset for A Christmas Carol. His experience of working with electronics manufacturers led him to establish… Read More


The Compass: Finding Tomorrow in the Minds of Yesterday

The Compass: Finding Tomorrow in the Minds of Yesterday
by Daniel Nenni on 11-01-2026 at 8:00 am

The Compass Novel Cover

What makes a breakthrough possible? Intelligence, certainly, but also curiosity, persistence and the courage to follow an idea before anyone can see where it leads. Sunil Mehta’s novel The Compass builds its premise around this question. Four students discover a mysterious compass that allows them to travel through time by … Read More


CEO Interview with Peter Jenkins of Infinitesima

CEO Interview with Peter Jenkins of Infinitesima
by Daniel Nenni on 11-01-2026 at 7:00 am

Peter Jenkins Angstrom Scale Process Control

As CEO, Peter Jenkins, leads the development and commercialisation of angstrom-scale process control technology, helping semiconductor manufacturers gain deeper process insights, improve yields and enable the next generation of advanced devices.

His international career has also included roles in the Netherlands, South… Read More


CEO Interview with Ram Machness of Arbe

CEO Interview with Ram Machness of Arbe
by Daniel Nenni on 11-01-2026 at 6:00 am

Ram Machness Radar for Eyes Off Driving

Ram Machness is the Chief Executive Officer at Arbe, a global leader in high-definition radar solutions for autonomous vehicles. He has three decades of experience in the semiconductor and automotive industries. In his previous role at Arbe as Chief Business Officer, he led product strategy and management, forged partnerships

… Read More

CEO Interview with Dr. Sean Wei of Easy-Logic

CEO Interview with Dr. Sean Wei of Easy-Logic
by Daniel Nenni on 10-30-2026 at 10:00 am

Easy Logic Technology functional ECO profile

Dr. Wei has served as CEO of Easy-Logic since 2020, focusing on building a strong operational foundation for the company. Previously, as CTO, he led the development of the core algorithms and tool architecture for the flagship product EasylogicECO, seamlessly aligning EasylogicECO technology with user needs.

Dr. Wei holds … Read More


TSMC’s Patent and the Harsh Realities of 3D DRAM Competition

TSMC’s Patent and the Harsh Realities of 3D DRAM Competition
by Daniel Nenni on 10-30-2026 at 8:00 am

Layered Memory, Fierce DRAM Competition

Discussions around TSMC’s vertical DRAM patents raise an intriguing question: could the world’s leading foundry eventually challenge established memory manufacturers? The curiosity is understandable. Patent disclosures involving vertical transistors and integrated capacitors show that TSMC is exploring architectures… Read More


How AI is Reshaping Semiconductor Design and Manufacturing

How AI is Reshaping Semiconductor Design and Manufacturing
by Daniel Nenni on 10-30-2026 at 6:00 am

How AI is Reshaping Semiconductor Design and Manufacturing

While AI is transforming nearly every industry, some of its most significant advances are happening inside the semiconductor factories building the chips that power it. If you design AI systems, those manufacturing advances directly influence your performance, efficiency, and path to market.

The message from the recent Global… Read More


From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters

From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters
by Daniel Nenni on 10-28-2026 at 10:00 am

Metrology, analytics, and autonomous manufacturing

Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More


Ceva’s Next-Generation NeuPro Brings a Unified AI Platform from Sensors to Infrastructure

Ceva’s Next-Generation NeuPro Brings a Unified AI Platform from Sensors to Infrastructure
by Daniel Nenni on 10-28-2026 at 4:00 am

NeuPro Sensors to AI infrastructure

Ceva is expanding the reach of its neural processing technology with a next-generation NeuPro portfolio designed to serve everything from always-on sensors to AI infrastructure. The announcement introduces four NPU families sharing a common architecture and unified software stack, giving semiconductor developers a consistent… Read More


ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results

ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results
by Daniel Nenni on 10-27-2026 at 10:00 am

chipagents announcement

ChipAgents is expanding its agentic AI platform across digital and analog semiconductor engineering, aiming to connect fragmented design workflows through a common system that can plan tasks, operate engineering tools and evaluate results.

The Santa Clara company says its IC-Star engine combines organizational design … Read More