In this webinar, Google Cloud and NetApp explore how semiconductor companies can address the growing infrastructure demands of modern Electronic Design Automation (EDA) workflows. As process technologies continue to advance and chip designs become increasingly complex, engineering teams require scalable, high-performance… Read More
Author: Daniel Nenni
WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads
CEO Interview with Yossi Meyouhas of Xsight Labs
Yossi Meyouhas is the CEO of Xsight Labs. Yossi joined Xsight Labs in May 2021 as Chief Operating Officer. Prior to Xsight Labs, Yossi was SVP R&D in Valens Semiconductors (2017-2021), and before that served in multiple senior positions in Marvell Technology Group, the last being SVP Engineering and General Manager of Marvell
COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More
Semidynamics Brings Its Full Inference Stack to ISC HPC 2026 — And Why It Matters
AI inference is quickly becoming the real battleground for next-generation computing. Training still gets the headlines, but inference is where AI becomes a business, a service, and an infrastructure problem. Every chatbot response, agentic workflow, code assistant, scientific model, and enterprise copilot depends on … Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk
As semiconductor complexity accelerates across AI, automotive, and edge computing markets, SoC architecture has become a critical determinant of commercial success. Modern silicon programs must simultaneously achieve aggressive performance-per-watt targets, support evolving workloads, and maintain manageable development… Read More
CEO Interview with Mark Goranson of EMASS
Mark Goranson is the Chief Executive Officer EMASS, a wholly owned subsidiary of Nanoveu, for which they serve as the semiconductor technology division. With more than 45 years in the global semiconductor industry, he has held senior leadership roles at companies including Intel, Freescale Semiconductor, and ON Semiconductor.… Read More
CEO Interview with James Regan of Oriole
James Regan is a seasoned technology executive and physicist with over 30 years in optical communications. As Co-Founder and CEO of Oriole, he is pioneering the next radical breakthrough in advanced optical networking systems for AI. James has a proven track record of transforming university research into globally impactful… Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.
On the outside PDF Solutions is a publicly traded semiconductor… Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More
RISC-V and AI: The Architecture Shift Is Now
The semiconductor industry has experienced several defining transitions over the last three decades. We moved from single-core to multicore processors, from ASIC-centric designs to IP-based SoCs, and from monolithic integration to heterogeneous architectures. Today, another transition is underway, one that may ultimately… Read More










Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?