Avestra: Agentic AI for SystemVerilog Assertion Generation

Avestra: Agentic AI for SystemVerilog Assertion Generation
by Daniel Nenni on 08-24-2026 at 2:00 pm

Avestra Studio Tuple Tech

Modern ASIC, SoC, CPU, and GPU development depends on verification processes that detect subtle functional defects before tapeout. SystemVerilog Assertions (SVA) are particularly important because they encode temporal design intent: how signals, states, and transactions must behave across clock cycles. Unlike conventional… Read More


The Sky’s the Limit: SiFive’s BigSky Brings RISC-V to the Datacenter

The Sky’s the Limit: SiFive’s BigSky Brings RISC-V to the Datacenter
by Daniel Nenni on 08-24-2026 at 6:00 am

The Sky’s the Limit SiFive’s BigSky Brings RISC V to the Datacenter

SiFive is bringing RISC-V closer to mainstream datacenter deployment with the BigSky SF-2U870, an enterprise-grade development server designed for hyperscalers, semiconductor companies, software vendors, and ecosystem partners. Announced in Santa Clara on August 24, 2026, alongside Hot Chips, the rackable 2U platform… Read More


How TSMC Is Wiring the AI Era With Light

How TSMC Is Wiring the AI Era With Light
by Daniel Nenni on 08-21-2026 at 10:00 am

How TSMC Is Wiring the AI Era With Light

TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More


Intel Eyes a Memory Comeback as AI Rewrites Chip Economics

Intel Eyes a Memory Comeback as AI Rewrites Chip Economics
by Daniel Nenni on 08-21-2026 at 6:00 am

Intel Eyes Memory Comeback

Intel is considering a return to memory technology decades after abandoning mainstream DRAM and, more recently, selling its NAND business. Chief executive Lip-Bu Tan has argued that memory should no longer be viewed simply as a low-margin commodity. Artificial intelligence is turning bandwidth, latency and data movement … Read More


CEO Interview with Ajit Prabhu of Quest Global

CEO Interview with Ajit Prabhu of Quest Global
by Daniel Nenni on 08-20-2026 at 12:00 pm

Ajit Prabhu CEO Quest Global Headshot

Ajit Prabhu is the Co-Founder and CEO of Quest Global, a global engineering services company driven by a single purpose: to be the most trusted partner for solving the world’s hardest engineering problems. Under his leadership, Quest Global has built long-term, sustainable partnerships and delivers end-to-end engineering… Read More


CEO Interview with Sumeet Kumar of Innatera

CEO Interview with Sumeet Kumar of Innatera
by Daniel Nenni on 08-20-2026 at 8:00 am

SK Headshot 2 (1)

Dr. Sumeet Kumar is CEO of Innatera, the pioneering Dutch neuromorphic processor company. Dr. Kumar was previously with Intel and Indrion Technologies, and has spent his career in microprocessor development. He co-founded Innatera in 2018 as a spin off from the Delft University of Technology.

Tell us about your company?

When… Read More


Hot Chips 2026: Architectures for the Agentic Computing Era

Hot Chips 2026: Architectures for the Agentic Computing Era
by Daniel Nenni on 08-19-2026 at 2:00 pm

Hot Chips 2026 Agentrys Quadric SemiWiki

Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More


Meet Quadric on the Road: Three Must-Attend AI Events

Meet Quadric on the Road: Three Must-Attend AI Events
by Daniel Nenni on 08-19-2026 at 6:00 am

Catch Quadric Hot Chips AI Infra

This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More


Beyond Moore: Co-Optimizing AI from Systems to Materials

Beyond Moore: Co-Optimizing AI from Systems to Materials
by Daniel Nenni on 08-18-2026 at 10:00 am

Beyond Moore AI from manufacturing to Systems

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More


A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon

A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon
by Daniel Nenni on 08-14-2026 at 8:00 am

A 0.42 Nanometer Breakthrough Could Push Transistors Beyond Silicon

Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.

Silicon transistors are approaching physical limits that make each new generation… Read More