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Mentor @ the TSMC Open Innovation Platform Forum

Mentor @ the TSMC Open Innovation Platform Forum
by glforte on 01-16-2013 at 6:16 pm

At TSMC’s Open Innovation Platform (OIP) Ecosystem Forum, Mentor made technical presentations on four different topics, two of them co-presented with TSMC and LSI Corporation. Those presentations are described below with links to downloadable pdf presentation files.

Finding and Fixing Double Patterning Errors in 20nm Design

David also won the Customer’s Choice award (selected by attendee vote) for his presentation on Finding and Fixing Double Patterning Errors in 20nm Designs at TSMC’s Open Innovation Platform ecosystem event. In this presentation, David describes the new constraints that double patterning brings to the 20nm node, and how IC designers can deal with DP related design rule violations. View presentation…

A Platform for TSMC’s CoWoS 3DIC Reference Flow

The first phase of 3DIC adoption will be based on silicon interposers. Designing multi-die systems using this technology introduces new challenges for the EDA design flow. At the TSMC OIP event, Mentor described solutions for 3DIC design specifically tailored to TSMC manufacturing processes.View presentation

Automated Approach for Waiving Physical Verification Errors in IP

Redundantly reviewing recurring errors during custom and third-party IP integration can slow down SoC verification. An automated waiver management methodology enables design and verification teams to specify and process a variety of design rule waivers, reducing debugging time and improving SoC results. Mentor and LSI recently described the use of this technology at the TSMC OIP event. View presentation

Improving IC Design for Reliability

Verification of 20nm designs is expected to bring significant challenges. A robust verification methodology that addresses circuit reliability is increasingly difficult. At 20nm, new devices that incorporate thin oxides are less robust and more subject to electrical overstress (EOS) failures. The increased use of mixed-signal and multi-voltage design techniques also increases the likelihood that transistors could be implemented in an incorrect voltage domain. At TSMC’s recent OIP event, Mentor showed techniques to prevent long term electrical failure using new tools to validate ESD structures, protect against EOS, manage multiple power domains, and carefully balance sensitive analog circuits. View presentation


A Brief History of Apache Design

A Brief History of Apache Design
by Daniel Nenni on 01-16-2013 at 3:00 pm

Apache Design Solutions was founded in 2001 by Andrew Yang and three researchers from HP Labs (Norman Chang, Shen Lin, Weize Xie). They realized that engineers striving to meet the goal of increased device miniaturization, as defined by Moore’s Law, would eventually hit stumbling blocks in their progress. The founding team believed that success in the end would depend on how well chip designers can manage the power consumption, power delivery and power density of their designs. They also believed that how well engineers navigated the fragmented, silo-based electronic design eco-system would help them achieve competitive differentiation and cost reduction for their end-products. The team realized that engineers use various architectural and circuit techniques, including reducing voltage supply, to control power consumed by smartphones, tablets and hand-held devices. But these techniques made circuits more vulnerable to fluctuations and anomalies, either when manufactured or operated.

Before the release of Apache’s first flagship product RedHawk™ in 2003, chip designers relied on approximations, and ‘DC’ (or static) analysis methods, that are insufficient for predicting fluctuations coming from the interaction of the chip with its package and board. Apache’s RedHawk provided the industry with its first ‘dynamic’ power noise simulation technology, allowing chip designers to simulate their entire design, along with the package and board, and predict operation prior to manufacturing the parts. RedHawk introduced the industry to several key technologies that have become increasingly relevant, and are still unmatched over ten years later. These technologies include: (a) extraction of inductance for on-chip power/ground interconnects, in addition to their resistive and capacitive components, (b) linear model creation of on-chip MOSFET devices through the use of Apache Power Models, (c) automatic generation of on-chip vectors using a VectorLess™ approach, and (d) simultaneous analysis of multiple voltage domains handling billion+ node matrices, and considering various operating modes on the chip such as power up, power down, etc. In its debut year, RedHawk was presented with EDN Magazine’s Innovation of the Year Award (2003).

RedHawk’s first-in-class technologies, built on best-in-class extraction and solver engines, has led to its adoption as the ‘sign-off’ solution of choice by electronic system designers around the world for power noise simulation and design optimization. The release of RedHawk was followed by the introduction of Totem™, meeting the distinct needs of analog, IP, memory, and custom circuit design engineers for power noise and reliability analysis.


Figure1: ANSYS-Apache products / company timelines.

The introduction of the Chip Power Model (CPM™) technology and Sentinel™ product family in 2006, were seminal events in Apache’s history. For the first time, chip designers could create compact Spice-compatible models of their chips that preserved the time and frequency domain electrical characteristics of the chip layout. This model soon became the ‘currency’ for the exchange of power data enabling chip-aware package and system analysis. For its industry contribution, Apache’s CPM was presented with EDN Magazine’s Innovation of the Year Award (2006).


Figure2: The growing gap between power consumption in electronic systems
and the maximum allowed power budget.

The success of smart hand-held devices depended on how efficiently designers could squeeze increasing functionality within much smaller form factors, while managing to meet the end device’s power budget. Apache’s acquisition of Sequence Design in 2009, and the introduction of the PowerArtist™ platform, addressed chip designers growing need to simulate designs very early during the design phase, when architectural definitions are created using register transfer language (RTL) descriptions. PowerArtist enables accurate and predictive RTL-based power analysis and helps identify power bugs and cases of wasted power consumption in the design. This simulation driven design-for-power methodology allows engineers to address the growing gap between device power consumption and the maximum allowed power in end electronics systems.


Figure3: Increasing divergence between current flowing in wires versus their ability to handle such current levels.

Increasing functionality requirements in smaller form factors have accelerated the adoption and use of advanced technology nodes such as 28-nanometer (nm) and below. The logic operations performed in a chip result in a flow of current in various inter-connects on the chip. But the wires and vias fabricated using advanced technology nodes cannot sustain increased current levels, and are at risk for field failures. Additionally, MOS devices and on-chip interconnects are increasingly susceptible to failures from high levels of current flow, resulting from an electro-static discharge (ESD) event. To address this growing design challenge, Apache introduced PathFinder™, the industry’s first full-chip level, package-aware ESD integrity simulation and analysis platform. PathFinder enables designers to predict and address ESD induced failure they would not be able to identify otherwise, until very late in the product design cycle. Apache’s PathFinder was also presented with EDN Magazine’s Innovation of the Year Award (2010).


Figure4: The ANSYS-Apache simulation ecosystem brings semiconductor foundry, IP providers, SoC design houses, package vendors, and system integrators together.

Apache’s innovative product platforms solve specific analysis needs and enable a simulation environment that brings together disparate design teams such as automotive or communications system companies and their IC suppliers, or IC design firms and their foundry or ASIC manufacturing partners.

Apache’s revenue increased 3X from 2006 to 2010, underscoring the strong adoption of its products and technologies by semiconductor and system design companies worldwide. Apache’s achievements were recognized by being a recipient of Deloitte Technology’s Fast 50 Award in 2008, for being among the top 15 fastest growing software and information technology companies in Silicon Valley. The following year, Apache was again honored by being selected to receive Deloitte’s 2009 Technology Fast 500 Award, as one of the fastest growing technology companies in North America. Apache’s R&D team focuses on consistently delivering first-in-class technologies and best-in-class engines to meet the capacity, performance and accuracy requirements for the customers, which include all of the top twenty semiconductor companies.

Apache filed for an initial public offering under the symbol APAD in March 2011. On June 30, 2011, ANSYS signed a definitive agreement to acquire Apache, and on August 1, 2011, Apache Design, Inc. became a wholly-owned subsidiary of ANSYS, Inc.

ANSYS’ simulation technologies address complex multi-physics challenges and enable simulation-driven product development. As semiconductor devices pervade every aspect of our lives, in cars, smartphones or in smart-meters, their impact on the end systems (and vice-versa) is becoming a key design challenge for customers. The combination of Apache’s chip-level power, thermal, signal and EMI modeling solutions, along with ANSYS’ package and system electro-magnetic, thermal and mechanical simulation platforms, enables faster convergence for the next generation of low-power, energy-efficient designs. Together the joint team solves design challenges such as those associated with high-speed signal transmission, stacked-die design integration, automotive, and mission-critical electronic system reliability validation. ANSYS-Apache remains committed to providing consistent customer support and delivering continuous technology innovation in all our products and platforms.


All Things Resistive

All Things Resistive
by Christie Marrian on 01-16-2013 at 5:03 am

A quick re-introduction of ReRAM-Forum.com which is dedicated to all things related to resistive RAM, broadly characterized as ReRAM (or RRAM) and CBRAM. The technology is seen as the ‘next generation’ non-volatile memory solution and is being developed by companies large and small for a variety of applications in storage, memory and more recently logic. The technology is at the ‘test chip’ stage (an example from Adesto Technologies shown here) and evolving rapidly. The Blog has been going for 6 months and has featured posts on many of the main players both in industry and academia.

The most recent couple of posts have focused on two extremes of the ReRAM firmament. At one end of the scale, Nantero a start-up in Woburn, MA who are one of the veterans of the field having been formed in 2001. They are still going and have recently completed a successful Series D funding round. Their technology is different from others in the field with their switching technology based on carbon nanotubes as opposed to a metal oxide or other inorganic. They have received a fair amount of negative coverage over the years as they fell into the ‘products in two years’ trap. But they are still going and apparently thriving. ReRAM-Forum.com has more details on recent developments at Nantero and their technology.


HP is at the other extreme size wise and they have developed quite a reputation in the field for their bold pronouncements about the promise of two terminal metal oxide based devices and have an aggressive path to commercialization with SK Hynix although again they have been prone to repeated ‘products in two years’ announcements. Recently, the lid has been lifted a little on HP’s thinking on the materials and mechanisms involved in ReRAM and CBRAM devices. Check out some recent Blogs on HP and their technology over at ReRAM-Forum. There are some interesting hints that HP are beginning to see opportunities for their resistive switches outside Storage (NAND replacement) and Memory (DRAM replacement) as illustrated by their hybrid CMOS/memristor circuits schematic.

No self respecting Blog can start the year without some predictions for the upcoming year and ReRAM-Forum is no exception. In fact Paul McLellan here at SemiWiki and I both came up with a similar EUV prediction (there was no conferring but frankly it is not a very difficult one to foresee). EUV seems set for a key role in the future of ReRAM following SanDisk’s ‘Waiting for EUV’ comment last year. However, given the delays, maybe we will hear a different view this year. In any case if it is ReRAM related you’ll know where to find it!

A belated Happy New Year to All


Scandals Rock and Shock CES 2013!

Scandals Rock and Shock CES 2013!
by Daniel Nenni on 01-15-2013 at 7:00 pm

Like any other event, the Consumer Electronics Show in Las Vegas is not immune to unethical and inappropriate behavior. Unfortunately one of digital media’s finest got caught this year doing what most publications have done since the beginning of time. CNET bowed to pressure from above and changed the outcome of the annual CNET CES Awards. The other more entertaining scandal was the topless “booth babes” one vendor used to attract a crowd, which it certainly did.

Per Wikipedia: CNET(stylized as c|net) is a tech media website that publishes reviews, news, articles, blogs, and podcasts on technology and consumer electronics. Originally founded in 1994 by Halsey Minor and Shelby Bonnie, it was the flagship brand of CNET Networks and became a brand of CBS Interactive through CNET Networks’ acquisition in 2008…[SUP].[/SUP]

According to the current press, CNET’s parent company CBS is in a legal battle with Dish Network. When CBS executives heard that the new Dish DVR (Slingbox Hopper) was on top of the list for the Best of CES Awards they requested it be removed. Here is the official spin from CNET:

“The Dish Hopper with Sling was removed from consideration due to active litigation involving our parent company CBS Corp. We will no longer be reviewing products manufactured by companies with which we are in litigation with respect to such product.

Does that make anybody feel better? And here is the Dish response:

“We are saddened that CNET’s staff is being denied its editorial independence because of CBS’ heavy-handed tactics. This action has nothing to do with the merits of our new product. Hopper with Sling is all about consumer choice and control over the TV experience. That CBS, which owns CNET.com, would censor that message is insulting to consumers.”

Personally I don’t like the DVR Comcast rents to me for an exorbitant monthly fee. It is clumsy and unreliable so I’m waiting for either Apple or Google to do TV right, but in the meantime I’m looking at Tivo and other DVR options. I imagine millions of others feel the same as I do so this is probably a big deal. CNET staffers are scrambling, jumping ship, and probably wondering how many millions of readers will abandon them.

Unfortunately this type of “scandal” is routine in both print and digital media, even in our small semiconductor ecosystem. Publications and websites need to make money and money can corrupt content simple as that. Look for full sponsorship and advertiser disclosures at the footer of the website. If it’s not there then you should take ALL of the content with a big fat grain of salt. If they have nothing to hide then why are they hiding it?

You can see more pictures of the topless spray painted CES models on Instagram HERE. I posted the one picture for journalistic integrity. I have no problem with this type of marketing so if you want a topless picture of me posted just say so. The company who spray painted these ladies sells hard drives which is kind of funny, or not. This sure does make our DAC cheerleader scandal of 2012 look kind of silly. No worries, this “scandal” will be replaced by something else and at CES 2014 we will be “shocked” in another way. Just my opinion of course.

Join the CES 2013 discussion HERE.


Is the RTL Design Flow Broken?

Is the RTL Design Flow Broken?
by Daniel Payne on 01-15-2013 at 11:02 am

I’ve taught Verilog classes and used logic synthesis tools for ASIC and FPGA designs, so was interested to hear about Oasys Design Systems. I attended their webinar at 9AM today, so I’ll share what I learned about their approach to logical and physical synthesis. This approach competes with tools like Design Compiler Graphicalfrom Synopsys and Encounter RTL Compiler from Cadence.

Dan Ganousis
from Oasys Design Systems opened up the webinar on time and dove right into the presentation.

Continue reading “Is the RTL Design Flow Broken?”


IP vendors enable SuperSpeed USB IP take off in 2012

IP vendors enable SuperSpeed USB IP take off in 2012
by Eric Esteve on 01-15-2013 at 5:09 am

SuperSpeed USB has been clearly ranked in the Interface protocols winner list, see this previous post. It could be interesting to dig into this IP market segment, determine in which applications USB 3.0 has been successfully deployed and who are the IP vendors serving this market, enabling SuperSpeed USB to take off.

SuperSpeed (SS) USB protocol is based on a physical layer offering a 5 Gbps speed, offering 4 GT/s effective bandwidth (due to 8b/10b encoding scheme), or 500 MB/s. This is about 10 times the High Speed (HS) bandwidth, and the protocol is very similar to PCI Express gen-2, in other words SS USB is a technology breakthrough when compared with HS USB. Thus, chip maker will carefully select the provider for USB 3.0 IP solution including the PHY and the Controller. The PHY selection should lower the overall risk, and the PHY IP should be as low power as possible… and available in the targeted technology, considering the many variants offered in the latest technology nodes: 40LP, 40G, 40LPG for TSMC 40 nm, or 28HP, 28HPM, 28HPL, 28LP for TSMC 28nm!


Moreover, when SuperSpeed USB was released, the backward compatibility constraint imposes to provide both USB 2.0 and USB 3.0 function to be 100% compatible, and the equation will be even more complex as you will have to select a vendor able to offer a proven USB 2.0 solution integrated with a (proven) USB 3.0 solution. Just as a reminder, the need to support both USB 2.0 and USB 3.0 has been fatal to some well-known and very capable IP vendors, like Snowbush for the PHY and PLDA for the Controller: both have exited the market in 2012, after having heavily invested since 2008, but with no success! Because Synopsys is the historical leader in USB IP market segment for almost ten years, the company is able to provide a single GDSII for the complete PHY, that is supporting the four speeds (LS to SS) in technology nodes from 130 nm to 28 nm, including 65 nm, 55 nm or 40 nm.

What is exactly the market addressed by USB 3.0, and using which solution between Host, Device or Dual? According with Synopsys, even if there is still a difference between the number of Controller and PHY IP sales, this is not surprising, we have shown that this market behavior is frequently seen in the Interface IP business, a majority of customers are buying today the “Integrated Solution”, PHY and Controller IP. Moreover, for USB 3.0, many customers go for the Dual solution, Host and Device capable.

If the first design starts including SuperSpeed USB were for Hubs, Bridges and External storage, the market has now extended to WiFi dongle (to support WiFi 802.11ac specification, USB 2.0 is simply not offering enough bandwidth, and would generate a bottleneck!), and to Consumer Electronics products like HDTV and Blu-Ray high definition. The integration of SusperSpeed USB in Application Processors (AP) for smartphone and media tablet has started in 2011-2012, this can be verified by looking at the Samsung Exynos 5, supporting multiple USB3.0/2.0 ports (see the block diagram), so we expect many chip makers to launch new AP with SuperSpeed USB support for external interface capability, and we may also see AP supporting SSIC (joint specification issued by MIPI Alliance and USB-IF) allowing to support internal chip-to-chip communication based on USB 3.0 Controller associated with MIPI M-PHY.

According with Synopsys, the first Tape-out of a chip integrating SSIC has been completed in 2012, so we have to stay tuned, as more TO should follow in 2013. During 2012, Synopsys is claiming to have supported ten design starts integrating SuperSpeed USB in the Smartphone/Media tablet/Ultrabook segments.

This means that, four years after USB 3.0 specification being launched by USB-IF, SuperSpeed USB is finally coming to the mainstream, and we (IPNEST) expect to see a range of 60 to 75 Design Starts integrating USB 3.0 in 2013. This could be translated into USB 3.0 IP market (sub) segment weighting above $30 million, and a complete USB segment to be in the $75 million range. Clearly, an IP vendor like Synopsys is a major enabler for this SuperSpeed USB technology penetration of the mainstream market, with Design Starts in External Storage, USB Hubs, WiFi dongles, Blu-ray players, HDTV, smartphone, media tablet and certainly more to come…

Last minute: January 6, 2013, USB-IF has announced a new spec, enhancing SuperSpeed USB 3.0 up to 10 GT/s! “The USB 3.0 Promoter Group today announced development of a SuperSpeed USB (USB 3.0) enhancement that will add a much higher data rate, delivering up to twice the data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. This supplement to the USB 3.0 specification is anticipated to be completed by the middle of this year. spec should deliver a 10 Gbps data rate.”

Eric Esteve from IPNEST


Battling SoCs: QCOM vs NVDA vs Samsung

Battling SoCs: QCOM vs NVDA vs Samsung
by Daniel Nenni on 01-13-2013 at 7:00 pm

If I had to describe CES in one word it would be exhausting. There were 3,000+ vendors, 150,000+ people, lines for everything, but 100% pure excitement. Even my beautiful wife was intrigued by the technology that shapes our lives. The smart toaster was of great interest to her since she says I time my toast with the smoke alarm. The new SoCs were of the most interest to me since that is what I do for a living. Qualcomm, Nvidia, and Samsung all launched new SoCs but the Samsung marketing machine trumped them all. It really was quite a show, even Bill Clinton showed up for it.

Before the opening keynotes Nvidia formally announced the Tegra 4 which is TSMC 28nm versus the Tegra 3 at 40nm. With four Cortex A15 CPU cores and 72 GPU cores the Tegra 4 is the fastest SoC on the market (my opinion). It will also be the most expensive (my opinion). Tegra 4 uses the ARM Big/Little architecture so there is a fifth ARM A7 core for power management duties. We don’t count the little cores so this is a quad core SoC.

At an opening keynote Qualcomm introduced its 2013 line of Snapdragon SoCs, the Krait 300 and Krait 400, which are faster and capable of handling UHD. The architecture improvements and Qualcomm’s use of LPDDR3 RAM have reportedly upped the performance by 40%. The Snapdragon’s quad-core’s maximum clock rate has been given a boost from 1.7 GHz to 1.9 GHz.

At the Samsung keynote the Exynos 5 Octo SoC was announced touting the first 8 processor core SoC. Again using the ARM Big/Little Architecture, Samsung attaches one ARM A7 Little to each ARM A15 Big thus the 8 processor claim, the amazing and distorting Samsung marketing machine at its finest.

I got my hands on a tablet with the Tegra 4 inside but for the life of me I can’t remember who made it. Anyway, it was the most impressive tablet I saw at the show. It was VERY fast and had the MOST impressive graphics. No info on cost or battery life though but man was it fast. It kills the iPad 3 absolutely.

The biggest difference between the current batch of SoCs is that Qualcomm and Apple do not use off the shelf ARM cores. Qualcomm and Apple both license the ARM architecture and roll their own processor cores. Qualcomm has always done this for Snapdragon but Apple A6 is the first custom processor for Apple, which is in the iPhone 5.

Why do custom cores you ask? To optimize performance, cost, and battery life of course. Apple is the best example since they control the entire device including the operating system. I have an iPhone 4s and an iPhone 5. The custom SoC in the iPhone 5 is significantly faster than the iPhone 4s and the battery lasts much longer. Samsung will follow Apple and on this as well since they also control the whole device, believe it.

I do not know for an absolute fact but I would bet more than a lunch that both the Qualcomm and Apple custom SoCs also use a Big/Little strategy. In fact, I suspect that both companies use multiple Littles to squeeze the most battery life out of the devices they inhabit so the Samsung Octo announcement really is an inside joke. News flash: We only count the big processing cores, not the little power management cores or the graphics cores otherwise we would have to come up with names with 100+ cores in them and that would be annoying.

And why did Samsung rent Bill Clinton you ask? To put a famous American face on their made in Korea brand that is why. Great fit if you ask me, Samsung and an impeached American President!

You can read more about the ARM Big/Little HERE.

Join the CES 2013 discussion HERE and qualify to win an iPad Mini!


ESD Check Methodology

ESD Check Methodology
by Paul McLellan on 01-11-2013 at 5:12 pm

In Pune at the start of the month, Norman Chang, Ting-Sheng Ku, Jai Pollayil of Apache/Ansys and NVIDIA presented and ESD check methodologywith Fast Full-chip Static and Macro-level Dynamic Solutions . ESD stands for Elecro-Static Discharge and is basically injecting very high static voltages (think how your hand gets charged up sometimes when you touch a door handle) which can destroy a chip. This is done using three models which correspond to touching the chip with a finger (known as the Human Body Model or HBM), touching the chip with a machine such as manufacturing tester or an assembly machine known as the Machine Model or MM) and touching the chip with a tool such a tweezers or a screwdriver (known as the Charged Device Model or CDM). If the chip passes all these tests then it can survive test, assembly and shipping. And, after it has got to the consumer, the sort of abuse that people walking around on carpets or wearing silk shirts can give it. The human body model (HBM) has voltages in the KV range and the CDM has currents in the 10A range.

Here’s is one way that this is actually tested. Well, not really but there is an element of truth in it and it is very funny:

To avoid ESD destroying the chip, various protection structures are required that essentially route the charge away harmlessly so it doesn’t destroy the delicate gate-oxide in much the same way as a lightening protector does for a building (with much higher voltages). The challenge for a designer is that these structures must be verified before the chip tapes out. Finding out a chip doesn’t pass ESD tests after manufacture is a huge problem and will require a respin.


In days gone by, ESD protection was something required only in the I/O pads (so that they would defend the rest of the chip) but that no longer is sufficient and ESD cells are required in the core especially for flip-chip bumped chips where the I/Os are distributed across the die. This means that they need to be planned into the floorplan and taken acount of for their impact on other aspects of the design such as timing. Thinner oxides and reduced currents before metal interconnect acts like fuse-wire make this increasingly hard with each process generation.

There are two parts to verification of ESD. Static verification of all three models using test cases and block/IP level verification of the HBM/CD. Apache’s PathFinder is a tool that can handle all of this.


For static verification, performance and capacity are key in order to perform:

  • Fast full-chip layout-based checks

    • High-capacity and accurate metal/via resistance extraction
    • Inter- and intra-domain resistance checks
    • Realistic I-V model (snapback included) for diode/clamp in
  • R and current density checks

    • Current density and voltage check, particularly critical for IP
    • Full-chip ESD check required for identifying problems such as inter-block connectivity related
  • Macro-level dynamic ESD solution

    • Transistor-level stress analysis for 1M+ transistor blocks within couple of days
    • Consider substrate effect, clamp modeling with snapback, metal grid RLC, and pogo pin modeling

The dynamic verification must:

  • Perform diagnosis of potential failure mechanisms when silicon failures occur
  • Verify robustness of the fix by comparing differential stressed values of the failed junctions
  • Check potential design weaknesses of CDM events before tape-out on analog / mixed-signal / I/O blocks

The slides from the entire presentation, including much more detail of both PathFinder and NVIDIA’s methodology are here.


The First 14nm FinFET Wafer Sighting!

The First 14nm FinFET Wafer Sighting!
by Daniel Nenni on 01-11-2013 at 12:10 pm

Incredibly exciting! Even my beautiful wife was impressed by the rainbow of colors it reflected. From left to right: 28nm, 20nm, and 14nm wafers. The 20nm and 14nm wafers are from the GLOBALFOUNDRIES NY fab, made in the USA! GF also announced another $3-4B CAPEX for 2013 to increase capacity of all three of their 300mm fabs (Singapore, Dresden, and NY). Strangely enough I have been to the Singapore and Dresden fabs but not NY, and my family is from upstate NY. As soon as it warms up I will visit for sure. I love hanging with the fab guys.

This was the third annual GLOBALFOUNDRIES CES party and it was definitely the best. We got there early so I got a good look at the badges laid out for everyone. I won’t out anybody but let’s just say it was the Who’s Who of the semiconductor industry and was a big tell of who their customers and close partners are. Great food too! The Mirage Hotel really knows how to do a Las Vegas style backyard BBQ.

Good thing I did not make a bet on who would have FinFETs in production first because I would have lost! Just a minor detour but I will be keynoting FinFET Day at the Electronic Design Processing (EDPS) Symposium in Monterey this April. Friday morning there will be presentations on the challenges of FinFET design by designers from the likes of Qualcomm, ARM, NVIDIA, and Oracle. In the afternoon there will be a panel on the challenges of FinFET manufacturing with TSMC, GLOBALFOUNDRIES, and hopefully Samsung and Intel. Put it on your calendar and stay tuned to SemiWiki for updates as we get closer to the event.

GLOBALFOUNDRIES at CES is a great thing. Being at the bottom as we are, it is very important to see the entire supply chain including the final products and customers. It is a great perspective which is why I come every year. That and the hotels, food, drinks, shows, gambling, I love Las Vegas.

One funny thing about the GF party, the parting gift was a very nice world travel adapter and USB charger. The sticker on the bottom however said made in China…… whoops. Any guess on how many publications “borrow” the 14nm wafer picture taken by my nifty iPhone 5?

Don’t forget to register for the Common Platform Technology Forum. It will be FinFETtastic! Just click on the banner below. Spoiler alert: Free breakfast AND lunch!

And special thanks to the Hilton for putting us in a Penthouse Suite. Living large in Las Vegas. This room is bigger than our first apartment. You should have seen the look on my wife’s face when they said 39th floor. She is afraid of heights!


Predictions are hard, especially about the future

Predictions are hard, especially about the future
by Paul McLellan on 01-11-2013 at 11:26 am

I was asked to make some predictions about the EDA, semiconductor and electronic systems markets for 2013. I decided that it would be more fun to make some plausible predictions, some of which will be right, rather than go for anodyne predictions (“Cadence will acquire a couple of startups”) which are uninformative, not to mention boring. So, drum roll, here are my 2013 predictions:

  • There will be a lot of discussion about the costs of 20nm since it is so much more than 28nm. It will be a very slow transition with some people going straight to 14/16nm (which is really 20nm with smaller transistors which is really 26nm with smaller transistors). Expect lots of discussion about the end of Moore’s law.
  • EUV lithography will not become commercial during 2013 and so will miss the 10nm node.
  • TSV-based 3D ICs will start to become mainstream. Memory on logic, and mixed digital/analog on interposer. Expect lots of discussion about “more than Moore” and how 3D is the new way for scaling.
  • The death of a giant will finally take place. Nokia, still #1 only a year ago, will be dismembered. A consortium of Apple, Google and Samsung will buy the patents for billions to stop any trolls getting any of them. Huawei will buy the handset and base-station businesses for peanuts.
  • Synopsys will acquire Mentor. EDA will otherwise be fairly boring with the big three being the only companies able to attack the upcoming problems that require dozens of tools to be updated, not just a new point tool inserted in the flow.
  • If the IPO markets are open, Jasper, eSilicon, Atrenta and Tensilica will go public. If someone doesn’t buy them first.

OK. Everyone can play this game. What are your predictions?