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Computer Vision Design with HLS

Computer Vision Design with HLS
by Bernard Murphy on 08-21-2018 at 7:00 am

I’m on a mini-roll on the subject of high-level design for ML-based systems. No complaints from me, this is one of my favorite domains and is certainly a hot area; it’s great to that EDA vendors are so active in advancing ML-based design. Here I want to talk about the Catapult HLS flow for use in ML design.

Since I’ve covered the ML topic multiple times, I won’t bore you with a lengthy discourse on the basics. ML (at least in this context) is based on convolutional neural nets (CNNs), inspired (somewhat) by the way neurons process information in our brains, starting from a full image and progressing through transformations in layers of operations with coefficients/weights pre-determined by training to ultimately indicate recognition of a trained image.

From a design point of view, this doesn’t look much like regular logic design/architecture, though of course it all winds up in logic functions, primarily multiply-accumulate (MAC) functions, 4-port registers for tightly-coupled memory and SRAM for next-level caching, all most commonly supporting some type of fixed-point representation. But these are leaf-level functions. The layers in a vision CNN may be processing images with 1M+ pixels, each with 24+ bits for color. So the first layer alone has to process a huge number of inputs (down-sampling through later layers will progressively reduce these sizes).

That means you have to use high-level modeling to experiment with architecture choices and to validate your design against real image data. And if you can map your ultimate design to RTL through high-level synthesis (HLS), such as Mentor’s Catapult HLS, so much the better, especially since that tool supports design in straight C++, making it an appealing starting point for people more familiar with algorithms than the intricacies of SystemC (FYI, Catapult HLS also supports SystemC).

Of course if you want to synthesize to a CNN, you’re going to have to accept some limitations on your C++ coding style. For example, you need to use fixed-point data types and you should use fixed-size memory arrays and array indexes, rather than dynamically allocated memory and pointers. Which is not really a problem because you want to do this anyway to reduce power. Mike Fingeroff (HLS Technologist at Mentor) provides guidance (in the white paper link at the end of this blog) on some of the more common areas where you need to adapt.

Taking the HLS path with Catapult HLS offers a number of advantages. The tool can automatically synthesis interface logic (such as AXI4 video stream) based on simple user choices. It will also automatically optimize timing during the synthesis scheduling step, given constraints you set for other factors such as latency and area. In fact in general this is an area where you can experiment with timing versus resource/area tradeoffs based on feedback from the tool. For example you can look at tradeoffs in unrolling loops to drive parallelism. The tool will also help you explore tradeoffs in memory such as word-width and block or interleave choices. And, using PowerPro technology, the tool lets you explore the power implications of all these tradeoffs, so between all these factors you can get to an optimum PPA for your design.

One question occurred to me – how do you bootstrap this process from a trained network with weights? Ellie Burns, Director of Marketing, Calypto Systems Division at Mentor, provided a revealing explanation. It might seem like this is a big deal, but in practice current customers are carrying over the design (and weights) more or less by hand or using their own scripts without difficulty. The much more important need for those teams is the PPA tuning they can get in optimizing microarchitecture choices. Experimenting with options in the synthesis engine and testing/characterizing with real-images/video at the C-level is where they invest the majority of their effort.

Computer vision has become a critical differentiator in many products, but obviously it is not enough that such products support vision. They also need to be fast, very low power and as low cost as possible in many contexts (such as IoT applications). Those are challenging goals; you are adding state-of-the-art functionality but it still needs to fit inside a consumer-acceptable footprint. HLS is an interesting way to get there, by letting you experiment with your algorithm in C++ to optimize and fine-tune the implementation through synthesis. I should add that this flow works both with ASIC-based and FPGA-based designs. You can learn more from this white-paper.


Webinar: NetSpeed is about to change the way SOCs are designed

Webinar: NetSpeed is about to change the way SOCs are designed
by Tom Simon on 08-20-2018 at 12:00 pm

A large part of the effort in designing SOCs has shifted to the integration of their constituent IP blocks. Many IP blocks used in SOCs come as ready to use components and the real work has become making them work together. Network on Chip (NoC) has been a huge help in this task, handling the interconnections between blocks and planning for anticipated traffic. NoCs have evolved quite a bit, becoming more like full blown networks, offering features like QoS, traffic management, cache coherency, high reliability and true layered networking protocols. NetSpeed, a leading provider of NoC technology, is using its foundation technology and a number of innovations to expand their offering to address a much larger part of the job of integrating IP blocks to build an SOC.

NetSpeed’s NocStudio already helps with making architecture decisions and analyzing performance. It also helps with some aspects of SOC verification and physical design. Their new offering, SocBuilder goes much further by handling IP integration and assembly. Additionally, it compliments NocStudio in the areas of SOC verification and physical design. Even more interestingly it provides support for SOC bring-up and debug. Because SocBuilder and NocStudio share a single platform, they share metadata and can be controlled and automated as a single system.

One of SocBuilder’s key features is the use of reference designs and an extensive IP catalog. Information gleaned from the reference designs and protocol information from the IP catalog are used by machine learning, and advanced data analytics and visualization to assist the design process. Because much of the work during SOC design is related to protocol related issues, this is a ripe area for improved analysis and automation. SocBuilder works with IP descriptions in IPXACT and has extensions for additional metadata for IP. NetSpeed is working with a large number of partners to ensure good coverage of popular IP in their catalog.

With the large array of metadata and IP information available to SocBuilder, it can help with all aspects of physical design, including clock/reset/power, trace/debug/telemetry, MMU/security, and interrupts. These chassis related aspects of the design can be vexing, so having tools to guide the process can be critical to meeting quality goals and deadlines. SocBuilder uses industry standard LEF/DEF during floor planning. SocBuilder assists with connectivity and address map design as well.

After floor planning, system simulations can be run in SocBuilder to ensure performance, power and functional safety goals are met. There is visual feedback for a wide variety of system performance parameters such as power and thermal, etc. The final design is then run through extensive LINT checks that covers protocols, power, connections, performance, etc. System level deadlock checks are also included in SocBuilder.

The outputs are comprehensive. SocBuilder provides SystemC, RTL for the design description. DEF, SDC and scripts are output for the physical design. Test benches are also generated. SocBuilder helps with the essential task of software design too. It produces C models, reference documentation and a programmer’s guide. PPA metrics are also output.

There is an upcoming webinar to acquaint SOC designers with the features and to go into more depth regarding how it works. The Webinar will be on Tuesday August 28[SUP]th[/SUP] at 8AM Pacific Time and registration information is available on the NetSpeed website.I did not dwell much on the machine learning aspect, but this is a reminder that machine learning is in the process of transforming design. Companies that have experience with ML in design and that are expanding its use will certainly be able to make big leaps in enhancing designer productivity.


TSMC GlobalFoundries and Samsung Updates from 55DAC

TSMC GlobalFoundries and Samsung Updates from 55DAC
by Daniel Nenni on 08-20-2018 at 7:00 am

One of my favorite traditions at the Design Automation Conference is the Synopsys foundry events (the videos are now available). I learned a long time ago that the foundries are the foundation of the fabless semiconductor ecosystem and your relationships with the foundries can make or break you, absolutely. I also appreciate the free food, food tastes much better when it’s free.

Synopsys has an advantage being not only the number one EDA company but also the number one IP provider with the largest IP portfolio known to semiconductor man or woman. You can bet Synopsys tools and IP are silicon proven on every edge of the process technology spectrum (leading through trailing) without a doubt. One of the benefits of live events of course is that you get to mingle with the crowd and speakers which includes ecosystem executives from all over the world and don’t be surprised if Aart de Geus or Chi-Foon Chan are breaking bread at your table.

My favorite breakfast of course is the one with my semiconductor bellwether TSMC. Willy Chen, Deputy Director, Design Methodology and Service Marketing, TSMC, is a great speaker and very transparent in what he presented last year versus this year. Willy is a very smart and fashionable guy and very approachable so approach him if the opportunity presents itself. Kelvin Low (Moderator), VP of Marketing, Physical Design Group, Arm is also a great speaker. Kelvin spent the first half of his career with foundries (Chartered, GF, and Samsung) and is now IP. Hopefully next he will go into EDA completing the ecosystem trifecta! Also speaking were Kiran Burli, Director, Solutions Marketing, PDG, Arm and Joe Walston, Principal Engineer, Synopsys.

Designing with Leading-Edge Process Technology, CPU Cores and Tools
Faster, smaller, cooler product requirements continue to challenge designers to achieve their targets. TSMC, Arm and Synopsys kicked off DAC 2018 to share results of their collaboration to address these challenges to enable optimized design and accelerate design closure for Arm®-based designs on the latest TSMC process technology using the Synopsys Design Platform. This event video introduces the new Synopsys QuickStart Implementation Kits (QIKs) for ARM® Cortex®-A76 and Cortex-A55 processors that take advantage of ARM POP™ technology and Synopsys tools, and the collaborative design enablement for TSMC 7-nm process technology.

My beautiful wife joined me for the GlobalFoundries dinner which was focused on FD-SOI. As you know I am a big fan of FD-SOI which we track closely on SemiWiki. In fact, Scotten Jones just did a very nice FDSOI Status and Roadmap last month following SEMICON West. Kripa Venkatachalam, Director of Product Management, GLOBALFOUNDRIES, did a very nice presentation followed by Wayne Dai, President and CEO, VeriSilicon, and Jacob Avidan, SVP of Design Group R&D, Synopsys.

Addressing the Design Challenges of IoT Wearables and Automotive with 22FDX Technology
In this video of the Synopsys and GLOBALFOUNDRIES dinner panel event at DAC 2018, you will hear a discussion of how GLOBALFOUNDRIES’ innovative FDX process coupled with Synopsys’ design tools are providing mobile, IoT and automotive chip designers with the low-power and high-performance technology required for product success. VeriSilicon shared some specific examples of their successes with GLOBALFOUNDRIES’ 22FDX process and Synopsys tools. The event concluded with a panel discussion on various aspects of designing with 22FDX and addressing barriers to adoption of this technology.

Last but not least was the Samsung breakfast featuring Robert J. Stear, Senior Director, Samsung Foundry; JC Lin, Vice President of R&D, Synopsys; and John Koeter, Vice President of Marketing, Synopsys. Samsung has made great ecosystem strides in the past few years and is clearly experiencing the benefits. In fact, Samsung is holding a Tech Day on October 17[SUP]th[/SUP] in San Jose. If you have a golden ticket I hope to see you there. Tom Dillinger and I will be covering it for SemiWiki.

EUV is a very hot topic and Samsung is leading the way with their 7nm EUV process. Scott Jones has also covered Samsung and EUV with Samsung 10nm 8nm and 7nm at VLSIT and SEMICON West – Leading Edge Lithography and EUV
Enabling Optimal Design with Samsung 7nm EUV Process Using the Synopsys Design Platform
As each new process technology brings with it significant advantages as well as design challenges, Samsung Foundry and Synopsys continue to collaborate to enable optimal design. At this event, you’ll learn how our efforts provide a robust foundation for designers to get the most from Samsung advanced process technologies using Synopsys’ Design Platform with Fusion Technology and state of the art IP.

Take a look at the videos and let’s talk foundries in the comment section…


AMAT down 10% as expected Foundry spending slow down unexpected

AMAT down 10% as expected Foundry spending slow down unexpected
by Robert Maire on 08-19-2018 at 12:00 pm

Applied reported a more or less in line quarter, slightly beating weaker expectations. As we had projected, the October quarter is expected to have revenues down 10% which is at the low end of our expected 10-15% drop in business. Applied services helped partially make up for some of the equipment sales weakness. Revenue came in at $4.47B versus street of $4.43B and EPS was $1.20 versus street $1.17. The October quarter is guided to $4B and EPS of $0.96 versus $4.46B and $1.17. Its clear that most analysts neglected to cut their numbers despite the widespread news.

Similar to what we heard from both Lam and KLA, management suggested Sept/Oct quarter would be a trough. However we were slightly surprised that management refrained from describing what the recovery might look like, and how long we would be in the trough. This is a sharp variation from KLAC which called for a “sharp snapback” and even weaker than Lam’s vague and softer, “positive trajectory” comments.

Perhaps one of the reasons for the weaker and less committed outlook is that Applied revealed on the call that the weakness in spending which had been limited to Samsungs memory side has now spread to foundry customers. Thats customers with an “S” as in more than one foundry is slowing down their spending.

We can only assume that both TSMC and Samsung are slowing their foundry spend as they are the biggest foundries and GloFo isn’t spending that much to start with. This seems to be somewhat confirmed as the mix of foundry business has been shifting from leading edge to trailing edge spend. The company still feels very bullish about 2019 being up in spend but we think its going to be very hard to get there from here if both memory at Samsung and at least two foundry customers are slowing their spend.

Its also clear that there is not an expectation of a rescue coming in from the display side of the business. The part of the business that’s doing a great job continues to be Applied’s services business which is helping to offset weakness in new tool sales. It’s clear to us that the reduced cyclicality is as much a reflection of a higher services business as it is a reflection of more rational spending

Potential share loss???
In doing the math of AMATs tool business against global WFE spend is seems as if AMAT is losing share as its revenue, as quoted on the call, is not growing as fast as the industry top line. Management danced around without directly answering a question on the call on the share loss math. This could be due to the predominance of memory spending we have seen where AMAT has a lower share.

2019 Outlook

Management doubled down on their outlook for 2019 by saying that 2018 and 2019 will now exceed $100B where they had previously just said $100B. If the October and January quarters are weak in 2018 we can see how 2019 could be better but we are more dubious of what will now have to be higher growth in 2019 to make the numbers work, especially in light of BOTH memory and foundry being weaker.

Handset Weakness?
We had previously mentioned our concern about Samsung’s potential plan to shutter a China handset factory. We think this could be evidence of further slowing which manifested itself as a slow down in foundry spend at both TSMC and Samsung that would obviously have been making chips for the factory that is to be shut.

The Stock
Investors obviously did not like the lower outlook and the spread of weakness to now include foundrieS, as the stock was off over 4% in the after market. We would imagine that this new, added concern about foundry spending will likely weigh on the group as a whole tomorrow. We had also been hoping for a stronger rebound statement that would show some hard evidence or confidence in the speed of some sort of recovery but that was also missing on the call. Applied results coupled with less than stellar news out of Nvidia could spread to other semi names and we could see the overall group weaker as well.

Also Read: Chip Stocks have been Choppy but China may return


Chip Stocks have been Choppy but China may return

Chip Stocks have been Choppy but China may return
by Robert Maire on 08-19-2018 at 7:00 am

Applied Materials (AMAT) is batting clean up in a quarter that has not been pretty. Lately semi stocks seem to have been hit by not only stock specific issues but continued and increasing memory concerns coupled with more macro issues. On top of all this, China trade issues which have in the meantime taken a back burner to other issues threaten to boil over yet again.
Continue reading “Chip Stocks have been Choppy but China may return”


Measuring Up 7nm IP

Measuring Up 7nm IP
by Daniel Nenni on 08-17-2018 at 12:00 pm

The Linley Group is an industry-leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications. Their Microprocessor Report is widely read as a source of un-biased, no-nonsense analysis of technologies and trends. So, when they dig into something it’s worth reading.

Mike Demler recently did a piece on eSilicon entitled “eSilicon 7nm SerDes Hits 56GBPS – NeuASIC Platform Includes AI Accelerators for 2.5D/3D ICs”. I know Mike, and he’s one of those “just the facts” kind of guys that speaks from experience, absolutely. I have a copy and here is a quick summary with a link to the report:

The report spends some time reviewing eSilicon’s 7nm SerDes IP. This one IP block has become Star IP for many customers. It implements high-speed serial communication between chips and it’s performance is critical to achieving the overall throughput needed for advanced ASICs. The report goes into some detail about eSilicon’s 56G SerDes – its programmability to allow designers to tune power and performance for long or short reach channels for example. Several other performance statistics about eSilicon’s SerDes are also disclosed in the report.

eSilicon’s 56G SerDes test chip on the bench

eSilicon’s HBM2 PHY is also discussed. This IP implements the physical channel between an ASIC and HBM2 memory stacks. It’s available for a variety of technologies and foundries. The use of this IP to implement 2.5D designs with integrated HBM2 memory stacks on a silicon interposer is also discussed. eSilicon’s line of content-addressable memories are also reviewed in some detail, including application scenarios and performance comparisons with other vendors. The report also delves into eSilicon’s platform focus for its IP offerings, with specific packages for AI and high-performance networking. The details of what goes into a high-performance networking chip are discussed. The methodology eSilicon uses to create platform-based AI chips is also reviewed in some detail.

The report concludes with a frank assessment of market dynamics for the highly competitive networking and AI markets – where eSilicon fits well, and what challenges they will likely face. I believe companies like eSilicon that both develop IP and use the same IP for their ASIC business have a built-in advantage in terms of proven IP quality. As part of my research, I hear all of the bad IP stories from the top semiconductor companies and the foundries. IP really is critical and silicon-proven IP is quite valuable. This Linley report is definitely worth reading. You can download a free copy from the eSilicon website.

Also read: eSilicon and SiFive partner for Next-Generation SerDes IP

About eSilicon
eSilicon is an independent provider of complex FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets. www.esilicon.com

About The Linley Group
The Linley Group is the industry’s leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications. The company provides strategic consulting services, in-depth analytical reports, and conferences focused on advanced technologies for chip and system design. The Linley Group also publishes the weekly Microprocessor Report. For insights on recent industry news, subscribe to the company’s free email: Linley Newsletter. www.linleygroup.com


Why Do Brilliant People Like to Work Together?

Why Do Brilliant People Like to Work Together?
by Daniel Nenni on 08-17-2018 at 7:00 am

This is the eleventh in the series of “20 Questions with Wally Rhines”

In high technology, there are numerous instances of highly productive groups coming together and generating game-changing ideas and products. This happened at Shockley Semiconductor in the 1960s when Gordon Moore, Bob Noyce, Jean Hoerni and more found each other and took advantage of Sherman Fairchild’s offer to start a semiconductor company. It also happened to me in Houston, Texas in 1978 (a much less likely place than Palo Alto, California).

As related in previous blogs, TI had a late start in the microprocessor contest, focused its attention on calculator chips, and was left behind by Intel and Motorola in the general purpose host microprocessor business. But failure has a way of stimulating the desperation needed for success and the group in Houston went on to develop the TMS 320, the first really successful single-chip DSP, and a host of other important technologies.

Although TI arguably has the original microprocessor patent (awarded to Mike Cochran and Gary Boone), the MOS Division was struggling just to produce MOS Memory and the Microprocessor group was focused on a strategy that would catch up with Intel by second-sourcing the 8080A, develop TI’s own set of 8-bit microprocessors and peripherals (the 5500 series) and then leapfrog with the TMS 9900 16-bit chip that would also be used by the computer and defense businesses of TI
( https://spectrum.ieee.org/tech-history/heroic-failures/the-inside-story-of-texas-instruments-biggest-blunder-the-tms9900-microprocessor ).

Brilliant junior designers like Kevin McDonough and Karl Guttag were involved in the process when I arrived in October 1978. The group was in melt-down mode because the 16-bit microcontroller, called the TMS 9940, was in its sixth or seventh re-spin and looked like it would never work. Although good engineers were resigning at a rapid rate, we had a group in Bedford, England that had just been started. This was the first case I know of where design teams were organized around the world to do 24 hour per day design, with groups of engineers assigned to a particular product in Japan, England and the U.S. could, if needed, pick up the work of each other as the sun moved around the globe and the databases remained in our IBM 4341 or IBM 7090-600 computers.

The Bedford, England design group, was assigned the task of developing peripheral chips for the TMS 9900 16-bit microprocessor. The most notable was the TMS 9914 which implemented the HP GPIB standard. The chip became a long term success despite the lack of success for the TMS 9900. The team even anticipated the risk that others would copy their chip so they went to great lengths to disguise the transistors, making enhancement mode devices look like depletion mode, just to confuse anyone who tried to copy.

A small group was assigned responsibility to develop a graphics chip for the TI Home Computer (https://spectrum.ieee.org/tech-history/heroic-failures/the-texas-instruments-994-worlds-first-16bit-computer ). While the TI 99 Home Computer was a disaster, the chip was not. It led to development of new concepts in graphics and became part of a standard known as MSX that was promoted by K. Nishi, CEO of ASCII Microsoft and was used by more than twenty different computer and video game manufacturers. Many people in graphics development are still familiar with the term “sprites”, a graphical representation that was developed by the TMS 9918 team. This same group went on to develop the TMS 340 graphics processor that was adopted by IBM for the 8514A standard that, unfortunately, experienced a short life before being replaced by VGA in the IBM PC.

About a year after I arrived in Houston (from my previous job as Engineering Manager of Consumer Products in Lubbock), we combined all the logic design resources in Houston under one manager, Jerry Rogers. Jerry had been a career enlisted man in the Navy and joined TI after retirement as a technician while he worked on his engineering degree at the University of Houston. He was an effective manager but very tough, with no sympathy for any performance less than the best. He had a thick skin and was willing to push back on management, a trait that helped with many successes. Later Jerry founded Cyrix, a very successful floating point processor and X86-compatible microprocessor company, and eventually married Jodi Shelton, Founder and CEO of GSA.

During this period in Houston, we hired an amazing array of innovative engineers. TI started a program to train new sales application engineers by assigning them to short stints in the product divisions. Rich Templeton was one of those early assignees. We liked him so well that we convinced him to join our group and give up the rotational training program and he did. Later he became Chairman & CEO of TI. K. Bala was his supervisor. One day in about 1991, Bala mentioned in a conversation with me that he thought one of his employees might be his future supervisor. “Who is that?”, I asked. “Rich Templeton, and I think he might be your boss as well”, said Bala.

Over the years, people who started their careers in that group in Houston eventually managed much of the company. We needed a marketing manager for DSPs when David French (later CEO of Cirrus Logic) was running the business so we brought in Mike Hames who was in the Bipolar PROM group and knew nothing about DSP. When Dave French left to join Don Brooks at Fairchild, we brought in John Scarisbrick to manage the DSP business and he later took it to new heights.

One of the most impressive capabilities came when we needed improved manufacturing. Yukio Sakamoto, the most capable operations manager I’ve ever known, joined us to run all the manufacturing operations. He was dissatisfied with our status and so he promoted Kevin Ritchie multiple levels to the job of DMOS 4 Wafer Fab Manager. People tell me that Kevin became one of the most effective manufacturing managers in the semiconductor industry and recently retired after a distinguished TI career as Senior VP of Technology and Manufacturing. Sakamoto became CEO of Elpida Memory, the company that combined NEC’s and Hitachi’s DRAM businesses.

The 20 Questions with Wally Rhines Series


Networking trends for Automotive ADAS Systems

Networking trends for Automotive ADAS Systems
by Daniel Payne on 08-16-2018 at 12:00 pm

From my restaurant seat today in Lake Oswego, Oregon I watched as an SUV driver backed out and nearly collided with a parked car, so I wanted to wave my arms or start shouting to the driver to warn them about the collision. Cases like this are a daily occurrence to those of us who drive or watch other drivers on the road, so the promises of using Advanced Driver Assistance Systems (ADAS) is especially relevant in keeping us alive and injury free. I did some online research to better understand what’s happening with the networks used in automotive applications.

Automotive networks are tasked with moving massive amounts of data to process and help make decisions, just think about the data that these safety features and systems require:

  • Emergency braking
  • Collision avoidance with other vehicles
  • Pedestrian and cyclist avoidance
  • Lane departure warning
  • HD cameras
  • Radars
  • LIDARs
  • Fully autonomous driving

Our electronics industry is often driven by standards committees, and for networking in ADAS applications we thankfully have the Time Sensitive Networking (TSN) IEEE working group that has thought through all of this and come up with standards and specifications. So let’s take a closer look at how the Ethernet TSN standards can be used in automotive scenarios, then ultimately why you would use automotive-certified Ethernet IP in your SoC design.

Going back to 2005, there was an Ethernet standard for Audio Video Bridging (AVB) used for things like automotive infotainment and in-vehicle networking. These applications aren’t really all that time critical and the data volume was low in comparison to higher-demand tasks like braking control, so in 2012 the IEEE revamped things a bit by transforming this AVB working group into TSN. So with TSN we now have a handful of very specific standards to deal with ADAS requirements:

[table] style=”width: 500px”
|-
| TSN Standard
| Specification Description
|-
| IEEE 802.1Qbv-2015
| Time-aware shaper
|-
| IEEE 802.1Qbu-2016
IEEE 802.3br-2016
| Preemption
|-
| IEEE 802.1Qch-2017
| Cyclic queuing and forwarding
|-
| IEEE 801.1Qci-2017
| Per stream filtering and policing
|-
| IEEE 802.1CB-2017
| Frame replication and elimination
|-
| IEEE 802.1AS-REV
| Enhanced generic precise timing protocol
|-

Time-Aware Shaper
An engineered network will provide a predicted, guaranteed latency. They do this with a time-aware shaper that allows scheduling so that critical traffic gets a higher priority. As an example consider four queues of data, so the IEEE 802.1 Qbv scheduler controls which queue goes first (shown in orange) and so on.

Preemption
In the next example, Queue 2 in orange starts transmitting its frame first, but then a higher priority happens and Queue 3 in green preempts, so in the lower timing diagram we see how the green frame travels ahead of the orange frame. The green frame which is time-critical has preempted the orange frame, providing a predictable latency.

Cyclic Queuing and Forwarding
To make network latencies across bridges more consistent regardless of the network topology there’s a technique called Cycling Queuing and Forwarding. The complete specification is on the IEEE 802 site. Shown below in dark blue is a stream with the shortest cycle packet, while in light blue is a stream in the presence of multiple packets.

Frame Replication and Elimination
How do you find and fix from: cyclical redundancy check (CRC) errors, opens in wires, and flakey connections? With frame replication and elimination. In the following example there’s a time-critical data frame sent along two separate paths, orange and green, then where they join up, any duplicate frames are removed from the streams, so applications can receive frames out of order.

In the IEEE specification there are three ways to implement frame replication and elimination:

  • Talker replicates, listener removes duplicates
  • Bridge replicates, listener removes duplicates
  • Bridge replicates, bridge removes duplicates

Enhanced Generic Precise Timing Protocol
Knowing what time it really is across a network is fundamental, so synchronizing clocks comes up and this protocol lets you use either a single grand master or multiple grand masters, as shown in the next two figures:


Single grand master, sending two copies


Two grand masters, each sending two copies

Each of these TSN specifications have grown over time in order to meet the rigors in automotive design to support real-time networking of ADAS features.

Summary
Ethernet in automobiles has come a long way over the past decade, and now we have TSN to enable the ADAS features of modern SoCs, inching towards autonomous vehicles. With Ethernet in the car we get:

  • Wide range of data rates
  • Reliable operation
  • Interoperability between vendors
  • TSN to standardize on how data travels with predictable latency

SoCs for automotive also need to meet the functional safety standard ISO 26262 and AEC-Q100 for reliability. In the make versus buy decision process for networking chips you can consider IP from Synopsys, like their DesignWare Ethernet Quality-of-Service (QoS) IP because it is ASIL B Ready ISO 26262 certified.

John Swanson from Synopsys has written a detailed Technical Bulletin on this topic.


Chip, Package, System Analysis – A User View

Chip, Package, System Analysis – A User View
by Bernard Murphy on 08-16-2018 at 7:00 am

While I missed ANSYS (and indeed everyone else) at DAC this year, I was able to attend the ANSYS Innovation Conference last week at the Santa Clara Convention Center. My primary purpose for being there was to listen to a talk by eSilicon which I’ll get to shortly, but before that I sat through a very interesting presentation on the growing importance of simulation in validating medical devices. This isn’t the kind of simulation we usually discuss; these are computational fluid dynamics (CFD) sims for blood flow through stents, insulin flow from insulin pumps and other such worthy objectives. ANSYS has a representative on an FDA advisory committee exploring increased use of simulations in regulation for medical devices. Important and fascinating stuff and a reminder of how broadly ANSYS impacts technology in many areas beyond electronic design.


Back to the main topic, eSilicon gave a presentation at the conference on their work with ANSYS to validate signal and power integrity in designs for eSilicon customers. You should understand first that eSilicon works with customers on the leading-edge of custom ASIC design, from HPC to networking, AI and 5G infrastructure. I wrote recently about their platform-specific offerings for AI and networking at 7nm in advanced 2.5D packaging options with high-bandwidth memory stacks. Point being that this is bleeding-edge design for system customers demanding total system performance, not just “the chip works to spec”. So, these designs are a good test for the ANSYS “chip-package-system” (CPS) mantra.

eSilicon doesn’t build the boards. Their customers do that, so they work collaboratively to extract, analyze and optimize the board design together with the ASIC package, interposer and components on the interposer. The speaker, Teddy Lee from eSilicon, detailed flows they used for signal integrity (SI), DC power integrity (PI) and AC power integrity. For signal integrity they extract 3D models from the MCM database into the ANSYS HFSS tool and from this build S-parameter models for insertion loss, return loss and crosstalk, then optimize traces, materials, spacing, etc. and iterate. They do this for the substrate layout and the interposer design, then connect the 2 models and send to the customer for use in their IBIS-AMI channel analysis.


In DC power integrity, customers want to model DC voltage drop from the voltage regulator module (VRM) on the board, through trace and then through the package. Here a customer will again use SIwave to build a model, with IR drop and current densities, which eSilicon combines with a similar model extracted from the package substrate and the silicon interposer and then runs a DC simulation with SIwave. You can see simulated voltage gradients from the VRM to the package in the first figure and from the substrate up through the interposer in the picture above. This clearly provides very fine-grained analysis of power distribution all the way from the voltage regulator on the board up to the die ports.

In Teddy’s view, this system to die view, with accurate extraction at all levels, is essential to getting reliable PI analysis down to the die. He noted that you can’t just assume an idealized VRM somewhere on the PCB. You have to define where it’s going to sit and extract the real traces though which it will ultimately drive the package – the PI analysis you get from the idealized model may be quite different from the real model.

Teddy wrapped up with an explanation of their approach to AC power integrity where they want to look at the impact of noise generated by the die or on the board (everything looks good at DC, but what happens when a power domain turns on or another device on the board suddenly becomes active?). Here they use RedHawk to build a chip power model for the die and interposer, then combine that with an SIwave model for the package substrate and board. Based on this they do a system-level simulation (PCB down to the die) and perform a frequency domain simulation to see where they should add package-level decaps to reduce system-level resonances at the package. This is followed by a time-domain analysis looking at noise on the die. Depending on how this turns out, they may feed that back to the frequency domain analysis where they can change some of those decaps or perhaps change some trace geometries. And again iterate.

So, it looks like eSilicon sees value in CPS-style iterative analysis for SI and PI, given the demanding expectations of their customers. Chalk up another proof-point for CPS. You can learn more about CPS analysis HERE.


Enabling Complex System Design Environment

Enabling Complex System Design Environment
by Alex Tan on 08-15-2018 at 12:00 pm

Deterministic, yet versatile. Robust and integrated, yet user-friendly and easily customizable. Those are some desirable characteristics of an EDA solution as the boundaries of our design optimization, verification and analysis keep shifting. A left shift driven by a time-to-market schedule compression, while the process and application complexities keep pushing it in the opposite direction.

From the many DAC held technical sessions, early verification has made progress in doing shift-left to keep pace with the implementation process by means of integrating the application or end-product software within the virtual prototyping to do an early system design exploration. Virtual prototyping allows designers to not only explore corner scenarios but also to reproduce the experiments with various permutations of constraints or variants. The more heterogeneous SoCs for the emerging applications demand virtual prototyping that supports not only software and hardware but also the incorporation of digital, analog and interconnect IPs.

Magillem provides robust front-end design XML based solutions that enable and streamline design activities around its integrated environment. It has deployed its products across several industry boundaries –from SoC design houses, semiconductor manufacturers to legal and technical documentation publishers.

Since rolling out its Magillem Architectural Intent (MAI) for architectural intent capture as covered in my prior blog, the company has announced a joint effort with Imperas for an integrated virtual prototyping platform and also introduced Magillem Flow Architect (MFA), a turnkey solution that help customers define their best recommended flow.

At DAC 2018, I had the opportunity to interview Magillem CEO, Isabel Geday, and Magillem VP of Strategic Account Manager, Paschal Chauvet. The discussion was centered around Magillem continued efforts to accommodate IC design needs and how it adapts with the current trends in the EDA ecosystem.

Some EDA players have announced their product collaborations. Does Magillem have similar efforts?
“I call it a partnership, by not creating duplicated solutions,” said Isabel diplomatically. She gave example of Magillem’s earlier partnership with Imperas using its Verification IP models and debugging software. At DAC, Magillem announced another partnership with Arteris IP, an indisputable leader in NOC-IP that provides SoC cache interconnect solution.

The integration with Arteris IP was demonstrated by a full-compliance validation of the company’s interconnects with the Magillem environment. Using a single design environment, customers can now easily build a SoC using Arteris’ IP instances (FlexNoC and NCore) and the Magillem front-end design environment (MAI, MPAand MRV). “It is very good for customers to have one design environment. To be able to work with and plug all the IPs,” she added.


Since Magillem is based on the industry standard IP-XACT, it enables a possible integration of other tools into its environment. “While the other big players have closed environments, for Magillem it is the DNA of our product to allow integration,” she pointed out. Furthermore, The unified environment also provides more efficient and automated sharing of information across the supply chain during the product development.

There are increasing AI and ML related efforts. How do these impact your products?
“This is very interesting question as we work with methodology and flow aspects,” Isabel said. She gave two examples. The first is from a product application stand point. A large customer has used Magillem solution on some kind of expert system, which interacts with engineers through questionnaires and depending on the given answers make decisions one way or another.

The second example is related to Magillem prior internal effort. “We had activities on the side, done several years ago to demonstrate how versatile is our platform, by building something using the assembly of metadata of descriptions.” She elaborated that the team applied some AI aspects to analyze the interpreted legal texts and the impact of changes made on the existing document corpus. It measured the impacts of the new text fragments on the existing ones and suggested changes when it’s necessary on the existing document corpus. In addition, it was capable of learning a new syntax, when it did not recognize a new pattern. To sum up, she believes that AI is more a replay of previously exercised concept, but with more memories, compute power and algorithms involved.

Aside from these examples, the recently announced Arteris IP-and-Magillem integrated solution has been targeted to simplify the increasingly complex SoCs designs for AI and autonomous driving applications, which are now bounded by the latency of on-chip interconnects rather than the performance of on-chip processors and hardware accelerators.

Here at DAC, more EDA vendors showcasing their products to be accessible on the cloud. What is your take on cloud deployment?
“Our customer are Tier-1 companies and they have entrusted us with their most complex, expensive, demanding SoC platform and designs,” said Isabel. She added that the customers policy is to keep confidentiality as a top-priority. She acknowledged that although some design data intelligence may benefit from cloud based scenario, cloud is not an option yet. “People gain ownership on this internal solution. It is less interesting idea to us than in providing a cognitive assistance to the experts. The customers are very good on what they do. They have to be the decision maker…to make fast decision and be more productive as they deal with huge legacy and data.”

What is your data model? Do you allow customer flow customization?
“Our solution was directly derived from IP-XACT, which is universal inside our tool, allowing our customers to use one data model for the entire design flow,” said Paschal. Embedding external tools can be achieved through the Eclipse plug-in and TGI (Tight Generator Interface), the standard API to manipulate any IP-XACT database. According to Paschal, such flexibility is crucial for smaller companies as they tend to highly customize their environment. The scalability of the compact data model is not an issue as Magillem have worked with SoC having millions of gates.

Traceability is about the ability to track the safety requirements from the initial design inception through its implementation and operation phase. It is a key ingredient for the functional safety standards compliance as defined in IEC 61508 and ISO 26262. With the parsable IP-XACT based data, automated traceability throughout the development flow can be achieved.

Commenting on future works, Isabel stated that the current Magillem platform offering is unique. “Our earlier vision is now very appealing to new customers and new markets,” she added. Ongoing works includes the infrastructure to build the hub of link that will guarantee traceability in a very elegant way. She added that instead of building a hub of data, one then could add different standards and other sort of data while preserving all the essential elements.

By providing a versatile framework that could be retargeted for complex system designs, Magillem solution enables design teams to adapt with changing requirements from both design specifications and implementation methodologies.

For further info on Magillem products, please check HERE.