Preventing electrical circuit failure is a growing concern for IC designers today. Certain types of failures such as electrostatic discharge (ESD) events, have well established best practices and design rules that circuit designers should be following. Other issues have emerged more recently, such as how to check circuits… Read More
Some call it co-opetition (collaborative competition), some call it keeping your enemies close. Others call it for what it is, unfair competition and/or other types of legally actionable behavior. GlobalFoundries calls it“Fab Syncing”, which in reality will SINK their FABS!
“With this new collaboration, we are making one … Read More
During the weekend, I read two articles that highlighted Apple’s LCD supply chain build out and started to think of how this would look if Apple were to do the same on the x86 side of the ledger. The two articles, one related to Hitachi and Sony building a new 4” LCD for iphones and a more extensive one on Sharp building a new LCD for the iPAD3… Read More
When AMD announced its cutbacks recently many people were left wondering why they were so deep given the strong financial performance in Q3 and the guidance for an up Q4. It couldn’t have been related to the Thailand floods that could have been at most a one-quarter squeeze expected in Q1. Now it is apparent from reports that AMD’s … Read More
When AMD sought to shed its costly manufacturing operations, Ibrahim Ajami saw an interesting opportunity, one that promised to bring semiconductor manufacturing to Abu Dhabi. Let’s start with the January 2010 interview with Ajami, the 35 year old Chief Executive Officer of Advanced Technology Investment Company (ATIC), … Read More
Is it surprising to see that Synopsys has been selected Interface IP partner of the year by TSMC? Not really, as the company is the clear leader on this IP market segment (which includes USB, PCI Express, SATA, DDRn, HDMI, MIPI and others protocols like Ethernet, DisplayPort, Hyper Transport, Infiniband, Serial RapidIO…). But,… Read More
Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More
Lunch with Jim Lai, President of Global Unichip(GUC), was the highlight of my week, I had a very nice crab cake salad. As you may have read, GUC announced itself as the “Flexible ASIC Leader” taking direct aim at the traditional ASIC market led by the likes of IBM, ST Micro, TI, Renesas, and Samsung. This will be like “shooting fish in… Read More
This was my first ARM TechCon, they cordially invited me as media, but it certainly was not what I expected. Making matters worse, I had literally just flown in from a very long weekend sailing in Mexico which was much more interesting and certainly made me much less tolerant of sales and marketing nonsense. My Uncle Jim lives on a sailboat… Read More
SICAS (Semiconductor Industry Capacity Statistics) has released its 2Q 2011 data with significant changes in membership. The data is available through the SIA at: SICASdata The SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United… Read More
