Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More
Lunch with Jim Lai, President of Global Unichip(GUC), was the highlight of my week, I had a very nice crab cake salad. As you may have read, GUC announced itself as the “Flexible ASIC Leader” taking direct aim at the traditional ASIC market led by the likes of IBM, ST Micro, TI, Renesas, and Samsung. This will be like “shooting fish in… Read More
This was my first ARM TechCon, they cordially invited me as media, but it certainly was not what I expected. Making matters worse, I had literally just flown in from a very long weekend sailing in Mexico which was much more interesting and certainly made me much less tolerant of sales and marketing nonsense. My Uncle Jim lives on a sailboat… Read More
SICAS (Semiconductor Industry Capacity Statistics) has released its 2Q 2011 data with significant changes in membership. The data is available through the SIA at: SICASdata The SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United… Read More
EDA companies and foundries must closely collaborate in order to deliver IC tool flows that work without surprises at the 40nm and 28nm nodes.
Tomorrow in San Jose you can attend this 4th annual event hosted by TSMC along with Mentor Graphics and other EDA and IP companies.
Here are some of the topics that will interest IC designers… Read More
If you follow the SemiWiki Twitter feed you may have noticed that The Motley Fool (Seth Jayson) did three more articles on TSMC financials. The first Foolish article was blogged on SemiWiki as “TSMC Financial Status and OIP Update”.
The next three Fool Hardy articles look at cash flow (the cash moving in and out of a business), accounts… Read More
At the TSMC Open Innovation Platform Ecosystem Forum (try saying that three times in a row) next week (on Tuesday 18th), Atrenta will present a paper on the TSMC soft IP qualification flow. It will be presented by Anuj Kumar, senior manager of the customer consulting group.
More and more, chips are not put together what we think of … Read More
Being an internationally recognized industry blogger (IRIB) does have its benefits, one of which is free invites to all of the cool industry conferences! The presentations are canned for the most part but you can learn a lot at the breaks and exhibits if you know the right questions to ask, which I certainly do.
The GSA Semiconductor… Read More
Stephen Crosher started up Moortec in the UK back in 2005 with the help of his former Zarlink co-workers and they set to work offering AMS design services and eventually created their own Analog IP like the temperature sensor shown below:
We spoke by phone last week about his start-up experience and how they approach AMS design.… Read More
Apple will purchase close to eightBILLION dollars in parts from Samsung for the iSeries of products this year alone, making Apple Samsung’s largest customer. Samsung is also Apple’s largest competitor and TSMC’s most viable competitive foundry threat so it was no surprise to see Apple and TSMC team up on the next generations of… Read More
