Every process node these days has a new “gotcha” that designers need to be aware of. In some ways this has always been the case but the changes used to be gradual. But now each process node has something discontinuously different. At 20nm the big change is double patterning. At 14/16nm it is FinFET.
Rahul Deokar and John… Read More
Process variation has been a top trending term since SemiWiki began as a result of the articles, wikis, and white papers posted on the Solido landing page. Last year Solido and TSMC did a webinar together, an article in EETimes, and Solido released a book on the subject. Process variation is a challenge today at 28nm and it gets worse… Read More
If you want to know why I have written so much about TSMC in the past five years here it is: TSMC executives are approachable, personable, answer questions straight on, and have yet to lead me astray. If you want an example of this read the Chairman’s comments on the TSMC Q1 2013 earnings call transcript.
“On 16-nanometer FinFET, we … Read More
TSMC has been investing in the fabless semiconductor ecosystem for 25+ years and that is why they are the #1 foundry and lead this industry (my opinion). I’m a big fan of joint webinars. Not only is it collaboration open to the masses, it is a close collaboration between the two sponsoring companies. Having worked on the TSMC… Read More
Vince Hu of Altera presented us her at the GlobalPress Electronics Summit on their process roadmap. Since just a month or two ago they announced that Intel would be their foundry at 14nm, everyone wanted to get a better idea of what was really going on.
At 28nm, Altera use 2 processes, TSMC 28HP (for high end Stratix-5 devices) and TSMC… Read More
Foundries and EDA vendors are cooperating at increasing levels of technical intimacy as we head to the 20nm and lower nodes. Cadence has a strong position in the EDA tools used for IC design and layout of custom and AMS (Analog Mixed-Signal) designs. They have created a series of webinars to highlight the design challenges and new… Read More
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
Suk Lee drew the short straw at the TSMC Symposium yesterday, with the 5pm slot. Not only late in the day but between all the attendees and free beer. The morning sessions had been standing room only, with several hundred standees (as they call them on muni around here, but isn’t a standee really someone being stood on?). But … Read More
TSMC has a lot of capacity. Not just that, it has a lot more under construction. It currently has 3 300mm Gigafabs, fabs 12,14 and 15 (there doesn’t seem to be a 13). This morning, Dr Wang, who is TSMC’s VP of 300mm operations told us about the expansion plans. Currently fab 15 phase 3 and 4, and fab 12 phase 3 are to be ramped… Read More
I blogged last month about single event effects (SEE) where a semiconductor chip behaves incorrectly due to being hit by an ion or a neutron. Since we live on a radioactive planet and are bombarded by cosmic rays from space, this is a real problem, and it is getting worse at each process node. But just how big of a problem is it?
TFIT is … Read More
