Recent reports have Intel displacing Qualcomm as the modem supplier and TSMC as the foundry for the next Apple A10 SoC. That is if you call this a credible report: … Read More
Tag: tsmc
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
Cadence Outlines Automotive Solutions at TSMC OIP Event
I used to joke that my first car could survive a nuclear war. It was a 1971 Volvo sedan (142) that was EMP proof because it had absolutely no semiconductors in the ignition system, just points, condensers and a coil. If you go back to the Model T in 1915 you will see that the “on-board electronics” were not that different. However, today’s… Read More
A FinFET BSIM-CMG model update from UC-Berkeley
Every designer relies upon an underlying “compact” device model for circuit simulations – these models are the lifeblood of the IC industry. Designers may not be aware that there is an organization that qualifies models – the Compact Model Coalition – which operates under the umbrella of the Si2 Consortium: http://www.si2.org/cmc_index.php… Read More
Nine Cost Considerations to Keep IP Relevant –Part2
In the first part of this article I wrote about four types of costs which must be considered when an IP goes through design differentiation, customization, characterization, and selection and evaluation for acquisition. In this part of the article, I will discuss about the other five types of costs which must be considered to enhance… Read More
Can the Likes of iPhone 6s Bring New Disruptions?
In more than 30 years of semiconductors, we have seen many technology-induced disruptions in our ecosystem, be it healthcare, consumer, mobile, aerospace, or any other field for that matter. To name a few are portable healthcare devices at much lower prices, video conferencing over internet that reduced the need of physical … Read More
EUV – So late to the party it may already be over!
Stocks in the semiconductor equipment space continue to fall only this time along with the broad market. We had recently pointed out that LRCX was the last to fall among the large cap companies in the space but now the question becomes when have they fallen enough to say its over, and which stocks have more to fall……
ASML… Read More
Xilinx Skips 10nm
At TSMC’s OIP Symposium recently, Xilinx announced that they would not be building products at the 10nm node. I say “announced” since I was hearing it for the first time, but maybe I just missed it before. Xilinx would go straight from the 16FF+ arrays that they have announced but not started shipping, and to the… Read More
How to Build an IoT Endpoint in Three Months
It is often said that things go in big cycles. One example of this is the design and manufacturing products. People long ago used to build their own things. Think of villagers or settlers hundreds of years ago, if they needed something they would craft it themselves. Then came the industrial revolution and two things happened. One… Read More
New Sensing Scheme for OTP Memories
Last week at TSMC’s OIP symposium, Jen-Tai Hsu, Kilopass’s VP R&D, presented A New Solution to Sensing Scheme Issues Revealed.
See also Jen-Tai Hsu Joins Kilopass and Looks to the Future of Memories
He started with giving some statistics about Kilopass:
- 50+ employees
- 10X growth 2008 to 1015
- over 80 patents (including