The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More
An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
I remember working at Intel and viewing my first SPICE netlist for a DRAM chip, because there was this temperature statement with a number after it, so being a new college graduate I asked lots of questions, like, “What is that temperature value?”
My co-worker answered, “Oh, that’s the estimated junction… Read More
Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More
OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More
In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More
Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More
In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More
Simulation is a broad technique spanning certainly digital logic and circuit simulation but also methods beyond these which are particularly relevant to ADAS design. In fact, much of the design of full ADAS systems begins and ends with these types of modeling. This is in part due to the need fully validate integrity and reliability… Read More
Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.
Power protection chips work like electronic fuses,… Read More
