FDSOI is gaining traction in the market place. At their foundry forum in May, Samsung announced they have 17 FDSOI products in high volume manufacturing (you can read Tom Dilliger’s write up of the Samsung Foundry Forum here). At SEMICON West in July, GLOBALFOUNDRIES (GF) announced FDSOI design wins worth $2 billion dollars in … Read More
Tag: soitec
SEMICON West – Soitec is becoming a key enabler
A variety of growing and emerging segments of the semiconductor industry rely on Silicon-On-Insulator (SOI) wafers. Soitec is the primary source for SOI wafers particularly on 300mm. On Tuesday at SEMICON I got to sit down with Bernard Aspar, Soitec’s Executive Vice President, Communication & Power BU and Christophe… Read More
IP-SoC 2017: IP Innovation, Foundries, Low Power and Security
The 20[SUP]th[/SUP] IP-SoC conference will be held in Grenoble, France, on December 6-7, 2017. IP-SoC is not just a marketing fest, it’s the unique IP centric conference, with presentations reflecting the complete IP ecosystem: IP suppliers, foundries, industry trends and applications, with a focus on automotive. It will … Read More
Semicon West – The FDSOI Ecosystem
At Semicon West last week I attended presentations by Soitec and CEA Leti, and had breakfast with CEA Leti CEO Marie Semeria, key members of the Fully Depleted Silicon On Insulator (FDSOI) ecosystem. I have also seen some comments in the SemiWiki forum lately that make me believe there is some confusion on the roles of different companies… Read More
IEDM 2016 – Marie Semeria LETI Interview
Marie Semeria is the CEO of Leti, one of the world’s premier research organization for semiconductor technology and the key development center for FDSOI. I first interviewed Marie at SEMICON West and at IEDM I had a chance to sit down with her and get an update on Leti’s efforts over the last several months.
My interview… Read More
Soitec – Enabling the FDSOI Revolution
Recently I published two blogs on Fully Depleted Silicon On Insulator (FDSOI) and the potential the technology shows for a variety of low power and wireless applications. In order to produce FDSOI devices, the device layer has to be thin enough to ensure the device is fully depleted and ideally the buried oxide has to be thin enough… Read More
Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)
By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More
Positive pointers from Samsung, GF, Renesas, NXP/Freescale, ST, Soitec – so will 2016 be the year of FD-SOI?
A little over a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. Quite a bit of it came out of the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on the SOI Consortium website (click here to see what’s there) – but keep checking… Read More
FD-SOI: a Gentle Introduction
Over the last couple of weeks, FD-SOI has been in the news with GlobalFoundries announcement of a 22nm FD-SOI process that will run in the Dresden Fab. Also, earlier in the week I talked to Thomas Skotnicki about the saga (and it is a saga) of how FD-SOI got from his PhD thesis to volume manufacturing and global deployment. But there … Read More
Advantages when Designing with FD-SOI
In total we have blogged 41 times about FD-SOI on SemiWiki which has drawn an audience of 202,960 thus far. Of that traffic 31.68% came directly to SemiWiki (Newsletter), 30.13% came from search, 26.17% from social media (LinkedIn, FaceBook, Twitter, Google+, Reddit, etc…), and 11.99% came from other referring sites. The most… Read More