Power, Signal, Thermal and EMI signoff

Power, Signal, Thermal and EMI signoff
by Paul McLellan on 08-28-2012 at 1:55 pm

Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More


Apple’s Victory Will Re-Shuffle the Semi Industry

Apple’s Victory Will Re-Shuffle the Semi Industry
by Ed McKernan on 08-27-2012 at 2:00 pm

Apple’s legal victory over Samsung has been analyzed in thousands of articles and TWEETs since last Friday’s announcement and surely more will follow. Most of the commentary has focused on the first order impact to handset manufacturers. It is not entirely clear how it will all settle but there are sure to be secondary ramifications… Read More


A Brief History of ASIC, part II

A Brief History of ASIC, part II
by Paul McLellan on 08-23-2012 at 8:00 pm

All semiconductor companies were caught up in ASIC in some way or another because of the basic economics. Semiconductor technology allowed medium sized designs to be done, and medium sized designs were pretty much all different. The technology didn’t yet allow whole systems to be put on a single chip. So semiconductor companies… Read More


Cadence at 20nm

Cadence at 20nm
by Paul McLellan on 08-21-2012 at 8:10 pm

Cadence has a new white paper out about the changes in IC design that are coming at 20nm. One thing is very clear: 20nm is not simply “more of the same”. All design, from basic standard cells up to huge SoCs has several new challenges to go along with all the old ones that we had at 45nm and 28nm.

I should emphasize that the paper… Read More


A Brief History of ASIC, part I

A Brief History of ASIC, part I
by Paul McLellan on 08-21-2012 at 7:00 pm

In the early 1980s the ideas and infrastructure for what would eventually be called ASIC started to come together. Semiconductor technology had reached the point that a useful number of transistors could be put onto a chip. But unlike earlier, when a chip only held a few transistors and thus could be used to create basic generic building… Read More


A Brief History of SoCs

A Brief History of SoCs
by Daniel Nenni on 08-19-2012 at 10:00 am

Interesting to note; our cell phones today have more computing power than NASA had for the first landing on the moon. The insides of these mobile devices that we can’t live without are not like personal computers or even laptops with a traditional CPU (central processing unit) and a dozen other support chips. The brain, heart, and… Read More


I/O Bandwidth with Tensilica Cores

I/O Bandwidth with Tensilica Cores
by Paul McLellan on 08-17-2012 at 3:00 pm

It is obviously a truism that somewhere in an SoC there is something limiting a further increase in performance. One area where this is especially noticeable is when a Tensilica core is used to create a highly optimized processor for some purpose. The core performance may be boosted by a factor of 10 or even as much as 100. Once the core… Read More


40 Billion Smaller Things On The Clock

40 Billion Smaller Things On The Clock
by Don Dingee on 08-15-2012 at 8:00 pm

Big processors get all the love, it seems. It’s natural, since they are highly complex beasts and need a lot of care and feeding in the EDA and fab cycle. But the law of large numbers is starting to shift energy in the direction of optimizing microcontrollers.

I mulled the math in my head for a while. In a world with 7 billion people and … Read More


What’s Inside Your Phone?

What’s Inside Your Phone?
by Daniel Nenni on 08-14-2012 at 7:35 pm

Now that the mobile market is keeping us all employed, take a close look at what is actually inside those devices we can’t live without. Before SoCs you could just read the codes on the chips. Now it is all Semiconductor IP so you have to do a little more diligence to find out what is really powering your phones and tablets. One thing you… Read More


Chip-Package-System Solution Center

Chip-Package-System Solution Center
by Paul McLellan on 08-14-2012 at 5:48 pm

One of the really big changes about chip design is the way over the last decade or so it is no longer possible to design an SoC, a package for it to go in and the board for the package using different sets of tools and methodologies and then finally bond out the chip and solder it onto the board. The three systems, Chip-Package-System have… Read More