A Brief History of ASIC, part II

A Brief History of ASIC, part II
by Paul McLellan on 08-23-2012 at 8:00 pm

All semiconductor companies were caught up in ASIC in some way or another because of the basic economics. Semiconductor technology allowed medium sized designs to be done, and medium sized designs were pretty much all different. The technology didn’t yet allow whole systems to be put on a single chip. So semiconductor companies… Read More


Cadence at 20nm

Cadence at 20nm
by Paul McLellan on 08-21-2012 at 8:10 pm

Cadence has a new white paper out about the changes in IC design that are coming at 20nm. One thing is very clear: 20nm is not simply “more of the same”. All design, from basic standard cells up to huge SoCs has several new challenges to go along with all the old ones that we had at 45nm and 28nm.

I should emphasize that the paper… Read More


A Brief History of ASIC, part I

A Brief History of ASIC, part I
by Paul McLellan on 08-21-2012 at 7:00 pm

In the early 1980s the ideas and infrastructure for what would eventually be called ASIC started to come together. Semiconductor technology had reached the point that a useful number of transistors could be put onto a chip. But unlike earlier, when a chip only held a few transistors and thus could be used to create basic generic building… Read More


A Brief History of SoCs

A Brief History of SoCs
by Daniel Nenni on 08-19-2012 at 10:00 am

Interesting to note; our cell phones today have more computing power than NASA had for the first landing on the moon. The insides of these mobile devices that we can’t live without are not like personal computers or even laptops with a traditional CPU (central processing unit) and a dozen other support chips. The brain, heart, and… Read More


I/O Bandwidth with Tensilica Cores

I/O Bandwidth with Tensilica Cores
by Paul McLellan on 08-17-2012 at 3:00 pm

It is obviously a truism that somewhere in an SoC there is something limiting a further increase in performance. One area where this is especially noticeable is when a Tensilica core is used to create a highly optimized processor for some purpose. The core performance may be boosted by a factor of 10 or even as much as 100. Once the core… Read More


40 Billion Smaller Things On The Clock

40 Billion Smaller Things On The Clock
by Don Dingee on 08-15-2012 at 8:00 pm

Big processors get all the love, it seems. It’s natural, since they are highly complex beasts and need a lot of care and feeding in the EDA and fab cycle. But the law of large numbers is starting to shift energy in the direction of optimizing microcontrollers.

I mulled the math in my head for a while. In a world with 7 billion people and … Read More


What’s Inside Your Phone?

What’s Inside Your Phone?
by Daniel Nenni on 08-14-2012 at 7:35 pm

Now that the mobile market is keeping us all employed, take a close look at what is actually inside those devices we can’t live without. Before SoCs you could just read the codes on the chips. Now it is all Semiconductor IP so you have to do a little more diligence to find out what is really powering your phones and tablets. One thing you… Read More


Chip-Package-System Solution Center

Chip-Package-System Solution Center
by Paul McLellan on 08-14-2012 at 5:48 pm

One of the really big changes about chip design is the way over the last decade or so it is no longer possible to design an SoC, a package for it to go in and the board for the package using different sets of tools and methodologies and then finally bond out the chip and solder it onto the board. The three systems, Chip-Package-System have… Read More


Smartphones: Is It Game Over?

Smartphones: Is It Game Over?
by Paul McLellan on 08-08-2012 at 4:18 pm

The Q2 numbers for smartphones are now all in and the basic story is that Google is now registering an incredible million Android phones per day, half of them made by Samsung. That’s 85% of all the smartphones shipped last quarter. Android has (per IDC) 68% market share of all smartphones out there.

Apple grew by double digit… Read More


Traditional Model of Funding Semiconductor Equipment is Broken?

Traditional Model of Funding Semiconductor Equipment is Broken?
by Paul McLellan on 08-07-2012 at 7:30 pm

At Semicon a few weeks ago the big news was that Intel was making a big investment in ASML as a way of funding two development programs: extreme ultra-violet (EUV) and 450mm wafers. This week TSMC announced that they would join the program too, committing 275M Euros over a five year period. They are also taking a 5% stake in ASML. ASML… Read More