Samsung Foundry recently held their annual technology forum in Santa Clara CA. The forum consisted of: presentations on advanced and mainstream process technology roadmaps; the IP readiness for those technology nodes; a review of several unique package offerings; and, an informal panel discussion with IP designers and EDA… Read More
As we begin another new year we begin another semiconductor conference cycle starting with SEMI ISS on January 15–18 at the Ritz-Carlton in Half Moon Bay California. This conference really sets the tone for the year and gives us a place to start thinking, acting, and reacting. This year it is all about the electronic devices we have… Read More
There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More
Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.
Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More
An earlier article described some of the technical and business highlights from the recent TSMC Symposium in Santa Clara (link). This article continues that discussion, with the top five updates.… Read More
Is it just me or has AMD just pulled off one of the most amazing semiconductor comebacks of the century? Let’s take a closer look.
Who doesn’t long for the days when Intel and AMD went head to head in the battle for microprocessor supremacy? Back then Intel, was still operating under the Andrew Grove mantra of “Only the Paranoid Survive”… Read More
Two weeks ago the SEMI ISS Conference was held at Half Moon Bay in California. On the opening day of the conference Gary Patton CTO of GLOBALFOUNDRIES gave the keynote address and I also had the chance to sit down with Gary for an interview the next day.
When I started doing IC design back in 1978 we had 6,000 nm channel gate lengths, and today you can buy a smart phone with 16 nm or 14 nm technology, although the gate lengths in those phones are more like 34 nm. The International Technology Roadmap for Semiconductors (ITRS) makes predictions about emerging trends in our industry and… Read More
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More
A maturetool. A legacytool. A tool that’s a little long in the tooth. We have all used these terms to refer to an EDA product that has not been able to keep up with technical challenges of model complexity, performance, or new features required by current SoC and system design requirements.… Read More
