Chapter 3 – Moore’s Law is Unconstitutional!

Chapter 3 – Moore’s Law is Unconstitutional!
by Wally Rhines on 07-26-2019 at 6:00 am

(Adapted from a presentation first given under this title in 1989 and subsequently expanded in presentations over a period of nearly thirty years)

In 1965, Gordon Moore, then R&D Manager for Fairchild Semiconductor, published a paper in “Electronics” magazine predicting the trend for semiconductors in the next ten years.… Read More


The Coming Tsunami in Multi-chip Packaging

The Coming Tsunami in Multi-chip Packaging
by Tom Dillinger on 07-12-2019 at 6:00 am

The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations.  Yet, from an architectural perspective, the diversity in end product requirements continues to grow.  New heterogeneous processing units are being… Read More


Predicting Trends in the Semiconductor Industry

Predicting Trends in the Semiconductor Industry
by Wally Rhines on 07-05-2019 at 8:00 am

PART ONE – TOOLS FOR PREDICTING SEMICONDUCTOR TRENDS

Chapter 1: LEARNING CURVES PROVIDE PREDICTABLE COST AND REVENUE PER TRANSISTOR

Figure 1 is the most basic of all the predictable parameters of the semiconductor industry, even more so than Moore’s Law.  It is the learning curve for the transistor.  Since 1954, the revenue per… Read More


Synchronizing with Sunlin Chou

Synchronizing with Sunlin Chou
by Sunit Rikhi on 05-29-2019 at 1:38 pm

Sometimes we get to see, up close, leaders who make a truly enormous contribution to society. Dr. Sunlin Chou was one such leader and I was a fortunate fellow traveler. Sunlin led the exponential rise of transistors for 35 years, accelerating the waves of revolutionary digital technologies serving humanity.

Fifty years have … Read More


Intel Q3 2018 Jibber Jabber

Intel Q3 2018 Jibber Jabber
by Daniel Nenni on 10-29-2018 at 7:00 am

This is what happens when you have a CFO acting as a semiconductor CEO, and Robert Holmes is a career CFO with zero semiconductor experience or education. Granted, no way did he write the opening statement, but it was full of jibber jabber anyway. The real disappointing jibber jabber was from our own Murthy Renduchintala on the status… Read More


ASML most immune to slow down due to lead times Not LRCX

ASML most immune to slow down due to lead times Not LRCX
by Robert Maire on 10-21-2018 at 7:00 am

ASML reported EUR2.78B in revenues with EUR2.08B in systems. 58% was for memory. EUV was EUR513M with 5 systems. Importantly orders were for EUR2.20B in systems at 64% memory and 5 EUV tools. This was likely better than expectations given the overall industry weakness. EPS of EUR1.60 was more or less in line with expectations. Guidance… Read More


An update on the Design Productivity Gap

An update on the Design Productivity Gap
by Tom Dillinger on 08-03-2018 at 12:00 pm

Over a decade ago, a group of semiconductor industry experts published a landmark paper as part of the periodic updates to the International Technology Roadmap for Semiconductors, or ITRS for short (link). The ITRS identified a critical design productivity gap. The circuit capacity afforded by the Moore’s Law pace of technology… Read More


Top 10 Highlights from the Samsung Foundry Forum

Top 10 Highlights from the Samsung Foundry Forum
by Tom Dillinger on 05-30-2018 at 9:00 am

Samsung Foundry recently held their annual technology forum in Santa Clara CA. The forum consisted of: presentations on advanced and mainstream process technology roadmaps; the IP readiness for those technology nodes; a review of several unique package offerings; and, an informal panel discussion with IP designers and EDA… Read More


Semiconductor Devices Transforming the World

Semiconductor Devices Transforming the World
by Daniel Nenni on 01-03-2018 at 7:00 am

As we begin another new year we begin another semiconductor conference cycle starting with SEMI ISS on January 15–18 at the Ritz-Carlton in Half Moon Bay California. This conference really sets the tone for the year and gives us a place to start thinking, acting, and reacting. This year it is all about the electronic devices we have… Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More