ASML and Memory Loss 2019

ASML and Memory Loss 2019
by Robert Maire on 01-25-2019 at 7:00 am

ASML reported a more or less in line quarter as expected, coming in at EUR3.14B in revenues and EPS of EUR1.87. However, guidance was worse than most analysts were expecting with Q1 revenues expected to be EUR2.1B or down about one third.

This cut is something we have been talking about for a while as we have expected sharp memory CAPEX… Read More


Intel Swaggers at CES

Intel Swaggers at CES
by Daniel Payne on 01-24-2019 at 7:00 am

Intel started out as a DRAM company using planar NMOS technology, then later on added EPROM and Microprocessors to the product mix. Their CPU technology enabled the dynamic growth of the PC industry starting with the IBM PC back in 1981 and continuing all of the way to this day. They long ago dropped out of the DRAM marketplace and began… Read More


Samsung pre-announces miss on weak memory and phones

Samsung pre-announces miss on weak memory and phones
by Robert Maire on 01-09-2019 at 7:00 am

It should come as no big surprise that Samsung will miss its Q4 numbers. The company pre announced that profits will be 10.8T KWON (about $9.7B ) versus the 13.2T KWON analysts had predicted, close to a 20% miss. This number is also down about 39% sequentially. Revenue at 59T KWON instead of expected 62.8T KWON and down about 10%. The… Read More


CES 2019 Audi and Samsung

CES 2019 Audi and Samsung
by Roger C. Lanctot on 01-06-2019 at 9:00 am

When Nvidia changed its automotive market messaging from an infotainment-centered theme to autonomous driving two years ago – pronouncing the coming tidal wave of robotaxi development – it matched the almost identical epiphany reached by Intel years prior. Automotive infotainment is a low volume, low revenue… Read More


IEDM 2018 Imec on Interconnect Metals Beyond Copper

IEDM 2018 Imec on Interconnect Metals Beyond Copper
by Scotten Jones on 12-28-2018 at 7:00 am

At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More


IEDM 2018 – ASML EUV Update

IEDM 2018 – ASML EUV Update
by Scotten Jones on 12-11-2018 at 7:00 am

At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More


Intel Q3 2018 Jibber Jabber

Intel Q3 2018 Jibber Jabber
by Daniel Nenni on 10-29-2018 at 7:00 am

This is what happens when you have a CFO acting as a semiconductor CEO, and Robert Holmes is a career CFO with zero semiconductor experience or education. Granted, no way did he write the opening statement, but it was full of jibber jabber anyway. The real disappointing jibber jabber was from our own Murthy Renduchintala on the status… Read More


The real race for superiority is TSMC vs Intel

The real race for superiority is TSMC vs Intel
by Robert Maire on 10-07-2018 at 7:00 am

Recent talk of AMD vs Intel market share share is misguided, the real race for superiority is TSMC vs Intel underlying that, tech dominance between US & China.

There has been much discussion of late about market share between Intel and AMD and how much market share AMD will gain at Intel’s expense due to Intel’s very… Read More


Chip Stocks have been Choppy but China may return

Chip Stocks have been Choppy but China may return
by Robert Maire on 08-19-2018 at 7:00 am

Applied Materials (AMAT) is batting clean up in a quarter that has not been pretty. Lately semi stocks seem to have been hit by not only stock specific issues but continued and increasing memory concerns coupled with more macro issues. On top of all this, China trade issues which have in the meantime taken a back burner to other issues… Read More


IITC – Imec Presents Copper, Cobalt and Ruthenium Interconnect Results

IITC – Imec Presents Copper, Cobalt and Ruthenium Interconnect Results
by Scotten Jones on 07-02-2018 at 12:00 pm

The IEEE Interconnect Technology Conference (IITC): Advanced Metallization Conference was held June 4th through 7th in Santa Clara. Imec presented multiple papers on comparing copper, cobalt and ruthenium interconnect. One paper in particular caught my eye: Marleen H. van der Veen, # N. Heylen, O. Varela Pedreira, S. Decoster,… Read More