Tubes of the Future

Tubes of the Future
by Paul McLellan on 02-07-2013 at 10:00 pm

So what is a silicon nanowire? It is basically a FET where the active element is a wire 3-20nm in diameter. So where a FinFET has the gate wrapped around 3 sides of the transistor, a nanowire (NW) has it wrapped around all four. In essence, the wire runs through the middle of the gate.

There seem to be three issues about building a silicon… Read More


Common Platform Technology Forum February 5th 2013 Live or Online!

Common Platform Technology Forum February 5th 2013 Live or Online!
by Daniel Nenni on 02-03-2013 at 8:00 am

Can’t make it to Santa Clara? Join us online!

The detailed 2013 CPTF agenda is now up in preparation for the February 5th event at the Santa Clara Convention Center. This is one of the rare times that you can get a free lunch! Watch this quick video to see what is in store for us this year. Dr. Paul McLellan and I will be there so please… Read More


Advanced Technology-Design-Manufacturing Co-optimization

Advanced Technology-Design-Manufacturing Co-optimization
by Daniel Nenni on 01-31-2013 at 7:00 pm

I spent some quality time with Subi Kengeri, Vice President, Technology Architecture, Office of the CTO, GLOBALFOUNDRIES in Las Vegas during CES. Great guy, he worked at Silicon Access, Virage and TSMC before GF. One thing you should know about embedded memory guys, SRAM is the first thing that goes through a new process so they … Read More


FD-SOI is Worth More Than Two Cores

FD-SOI is Worth More Than Two Cores
by Paul McLellan on 01-20-2013 at 10:00 pm

This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.

The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More


Intel 22nm SoC Process Exposed!

Intel 22nm SoC Process Exposed!
by Daniel Nenni on 12-27-2012 at 9:00 pm

The biggest surprise embedded in the Intel 22nm SoC disclosure is that they still do NOT use Double Patterning which is a big fat hairy deal if you are serious about the SoC foundry business. The other NOT so surprising thing I noticed in reviewing the blogosphere response is that the industry term FinFET was dominant while the Intel… Read More


FinFET Modeling and Extraction at 16-nm

FinFET Modeling and Extraction at 16-nm
by Daniel Payne on 12-18-2012 at 12:05 pm

In 2012 FinFET is one of the most talked about MOS technologies of the year because traditional planar CMOS has slowed down on scaling below the 28nm node. To learn more about FinFET process modeling I attended a Synopsys webinar where Bari Biswas presented for about 42 minutes include a Q&A portion at the end.


Bari Biswas, SynopsysRead More


Introduction to FinFET Technology Part III

Introduction to FinFET Technology Part III
by Tom Dillinger on 11-21-2012 at 5:30 pm

The preceding two Semiwiki articles in this thread provided an overview to the FinFET structure and fabrication. The next three articles will discuss some of the unique modeling requirements and design constraints that FinFET’s introduce, compared to planar FET technology.

Due to the complexity of FinFET modeling – … Read More


16nm FinFET versus 20nm Planar!

16nm FinFET versus 20nm Planar!
by Daniel Nenni on 11-04-2012 at 8:10 pm

The common theme amongst semiconductor ecosystem conferences this year is FinFETS, probably the most exciting technology we will see this decade. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain.

In planar… Read More


IBM Tapes Out 14nm ARM Processor on Cadence Flow

IBM Tapes Out 14nm ARM Processor on Cadence Flow
by Paul McLellan on 10-30-2012 at 7:33 pm

An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.

This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More


Designing with FinFETs

Designing with FinFETs
by Daniel Payne on 10-08-2012 at 6:13 pm

Intel is the number one semiconductor company in the world and has taken the lead in bringing FinFET (aka Tri-Gate) silicon to market at the 22nm node starting in May 2011, so now we see the pure play foundries playing catch-up and start talking about their own FinFET roadmaps. IC designers and layout engineers want to know how their… Read More