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This just in from Tech Trader Daily, quoting Piper Jaffraychip analyst Gus Richard:
The whole issue for Qualcomm, based on Richard’s conversations with industry types, is that the company has started making its “MSM8960″ chip with Taiwan Semiconductor Manufacturing (TSM) only two to three quarters after TSM introduced… Read More
While I was marlin fishing in Hawaii last week I missed some interesting comments from TSMC executives at the Technology Symposium in Taiwan, a much different show than the one here in San Jose I’m told. It is good to see TSMC setting the record straight and taking a little credit for what they have accomplished! I’m sorry I missed it… Read More
If you look real close at the #49 DAC floor plan you will see the tiny Intel booth dwarfed by those of TSMC, GlobalFoundries, Samsung, and ARM. The number one semiconductor company in the world does not have the budget for the cornerstone conference of the semiconductor ecosystem? Oh my…… Intel has a big foundry hat and no cattle… Read More
There is an interesting discussion in the SemiWiki forum in response to the EETimes article: Intel exec says fabless model ‘collapsing’. Definitely an interesting debate, one worth our time since the advertising click hungry industry pundits will certainly jump all over it. Clearly I’m biased since I helped build… Read More
The previous post in this series provided an overview of FinFET devices. This article will briefly cover FinFET fabrication.
The major process steps in fabricating silicon fins are shown in Figures 1 through 3. The step that defines the fin thickness uses Sidewall Image Transfer (SIT). Low-pressure chemical vapor (isotropic)… Read More
In every Intel product announcement and PR event, there are hours of behind the scenes meetings to discuss what they should introduce, what are the messages and what are the effects on the marketplace to maximize the impact of the moment. The Ivy Bridge product release speaks volumes of what they want to accomplish over the coming… Read More
The biggest news out of the TSMC Symposium last week was the 20nm update. Lots of debate and speculation, just why is TSMC releasing one version of 20nm (20nm SoC) versus multiple versions like in 40nm (LP, G, LPG) and 28nm (HP, HPM, HPL, LP)? Here are my thoughts, I would also be interested in your feedback in the comment section. This… Read More
First the good news: 4G LTE design in activity is off the charts as OEMs building smartphones, tablets and Ultrabooks are buying into the capability for product rollouts that will occur starting in September. Now the bad news: there’s not enough to go around until probably well into 2013. For a Company sitting on over $26B in cash,… Read More
This is the first of a multi-part series, to introduce FinFET technology to SemiWiki readers. These articles will highlight the technology’s key characteristics, and describe some of the advantages, disadvantages, and challenges associated with this transition. Topics in this series will include FinFET fabrication,… Read More
Listening to the Intel earnings call yesterday and then reviewing the transcript last night, I came away with two thoughts that I think are key to understanding where the PC and mobile industry… Read More
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