High Bandwidth Memory ASIC SiPs for Advanced Products!

When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences around the world. I have worked with Herb on various conferences and recommend him professionally at every opportunity.

Next month Herb is moderating a webinar with Open-Silicon on High Bandwidth Memory ASIC SiPs for High Performance Computing and Networking Applications on Tuesday, September 19, 2017 from 8:00 AM – 9:00 AM PDT. I strongly suggest you register today because this one will fill up!

This Open-Silicon webinar, moderated by Herb Reiter of eda 2 asic Consulting, Inc., will provide an overviewHBM2 ASIC SiPs (System in a Packages) for density and bandwidth-hungry systems based on silicon proven Open-Silicon’s High Bandwidth Memory (HBM2) IP subsystem solution. . Attendees will also learn about the system integration aspects of 2.5D HBM ASIC SiP, and performance results of various memory access patterns suiting different applications in High Performance Computing and Networking.

The webinar also summarizes silicon validation results of a 2.5D HBM2 ASIC SiP validation/evaluation platform, which is based on Open-Silicon’s HBM2 IP subsystem in TSMC’s 16nm in combination with TSMC’s CoWoSTM 2.5D silicon- interposer technology and HBM2 memory They will discuss the significance of the results and how they demonstrate functional validation and interoperability between Open-Silicon’s HBM2 IP subsystem and the HBM2 memory die stack. Attendees will learn about HBM2 memory and its advantages, applications and use cases.

The panelists will also discuss the HBM2 IP subsystem roadmap and Open-Silicon’s next generation multi-port AXI (Advanced eXtensible Interface) based HBM2 IP subsystem development targeting 2.4Gbps per-pin data rates, and beyond, in TSMC’s 7nm technology. This webinar is ideal for chip designers and system architects of emerging applications, such as high performance computing, networking, deep learning, neural networks, virtual reality, gaming, cloud computing and data centers…

For those of you who don’t know, TSMC’s CoWoS® (Chip-On-Wafer-On-Substrate) advanced packaging technology integrates logic computing and memory chips in a 3-D way for advanced products. CoWos targets high-speed applications such as: Graphics, networking, artificial intelligence, cloud computing, data center, and high-performance computing. CoWos was first implemented at 28nm in 2012 and continues today at 20nm and 16nm. Next up is 7nm which should be a banner node for CoWos, absolutely.

About Open-Silicon
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design — architecture, logic, physical, system, software, IP — and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities.

The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world. To learn more, visit www.open-silicon.com