TSMC Q3 2018 Earnings Call Discussion!

TSMC Q3 2018 Earnings Call Discussion!
by Daniel Nenni on 10-22-2018 at 7:00 am

Image RemovedThe TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another… Read More


Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Image RemovedYears ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important… Read More


Open Silicon Year in Review 2017

Open Silicon Year in Review 2017
by Daniel Nenni on 01-31-2018 at 7:00 am

Image RemovedIf you are interested in what types of chips we will see in the coming years always ask an ASIC provider because they know. Companies of all sizes (small-medium-large) use ASIC companies to get their chips out in the least amount of time and at a minimum cost because that is what ASIC companies do.

IP is an important ingredient… Read More


High Bandwidth Memory ASIC SiPs for Advanced Products!

High Bandwidth Memory ASIC SiPs for Advanced Products!
by Daniel Nenni on 08-30-2017 at 7:00 am

Image RemovedWhen someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and … Read More


DesignCon 2014 AMS Panel Report

DesignCon 2014 AMS Panel Report
by Daniel Nenni on 02-05-2014 at 10:15 am

Image RemovedDesignCon 2014 was very crowded! I have not seen the attendance numbers but as the first conference of the New Year it was very encouraging. The strength of the fabless semiconductor ecosystem is collaboration and face-to-face interactions are the most valuable, absolutely.

The session I moderated was on Mixed … Read More


3D IC @ #48DAC

3D IC @ #48DAC
by Daniel Nenni on 05-23-2011 at 4:54 pm

A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms, as a result the full definition is still somewhat… Read More