The current Coronavirus crisis is inflicting a lot of pain on people, companies, and governments. I hope I am not getting in trouble with my reasoning, but if you look closely, there are also some “positives” to the Covid-19 crisis.
– It is stress-testing our infrastructure and telling us where we need to improve – as country,… Read More
I had the opportunity to preview the upcoming SemiWiki webinar titled: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs. John Park’s message, describing this powerful Cadence solution, really impressed me. That’s why I want to encourage you to register for it and join this SemiWiki … Read More
Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More
The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More
Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More
If you are interested in what types of chips we will see in the coming years always ask an ASIC provider because they know. Companies of all sizes (small-medium-large) use ASIC companies to get their chips out in the least amount of time and at a minimum cost because that is what ASIC companies do.
IP is an important ingredient to the … Read More
When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
A couple months ago we heard from another vendor in a webinar on HBM and breaking through the “memory wall”. Next week Open Silicon weighs in on the topic in a webinar with partners SK Hynix and Synopsys.… Read More
DesignCon 2014 was very crowded! I have not seen the attendance numbers but as the first conference of the New Year it was very encouraging. The strength of the fabless semiconductor ecosystem is collaboration and face-to-face interactions are the most valuable, absolutely.
The session I moderated was on Mixed Signal Design … Read More
3D IC @ #48DACby Daniel Nenni on 05-23-2011 at 4:54 pmCategories: EDA, Events
A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms, as a result the full definition is still somewhat… Read More