SILVACO 073125 Webinar 800x100
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Analog Bits and TSMC!

Analog Bits and TSMC!
by Daniel Nenni on 01-10-2017 at 12:00 pm

TSMC Wafer

As a long time semiconductor IP professional I can tell you for a fact that it is one of the most challenging segments of semiconductor design. Given the growing criticality of semiconductor IP, the challenges of being a leading edge IP provider are increasing and may be at a breaking point. The question now is: What does it take to … Read More


2017 Semiconductor Dead Pool

2017 Semiconductor Dead Pool
by Daniel Nenni on 01-05-2017 at 12:00 pm

In 2015 we saw $85B in semiconductor acquisition activity and in 2016 there was more than $110B. Given 2015 and 2016 were relatively flat years for the $335B semiconductor industry and 2017 looks like more of the same we should expect consolidation to continue, absolutely.

So, let’s come up with a list of companies that may fall in… Read More


The 2017 Leading Edge Semiconductor Landscape

The 2017 Leading Edge Semiconductor Landscape
by Scotten Jones on 12-27-2016 at 6:00 pm

In early September of 2016 I published an article “The 2016 Leading Edge Semiconductor Landscape” that proved to be very popular with many views, comments and reposting’s. Since I wrote that article a lot of new data has become available enabling some projections to be replaced by actual values and new analysis… Read More


Intel Spreadtrum ARM SoCs

Intel Spreadtrum ARM SoCs
by Daniel Nenni on 12-27-2016 at 12:00 pm

In June of 2013 Edward Snowden copied and leaked classified information from the National Security Agency (NSA). His actions exposed numerous surveillance programs that many governments around the world reacted to, including China. In September of 2013 China Vice Premier Ma Kai declared semiconductors a key sector for the … Read More


IEDM 2016 – GLOBALFOUNDRIES 22FDX Update

IEDM 2016 – GLOBALFOUNDRIES 22FDX Update
by Scotten Jones on 12-16-2016 at 4:00 pm

At IEDM in 2015 I had a chance to sit down with Subramani (Subi) Kengeri and get a briefing on GLOBALFOUNDRIES 22FDX technology. At IEDM 2016 Rick Carter of GLOBALFOUNDRIES presented a paper on 22FDX. Following Rick’s presentation, I had a chance to sit down with Rick and John Pellerin, VP of Technology and Integration and … Read More


GLOBALFOUNDRIES ASIC Update!

GLOBALFOUNDRIES ASIC Update!
by Daniel Nenni on 12-15-2016 at 7:00 am

Back in my IP days we spent a lot of time with the ASIC companies chasing multi-million dollar licensing deals. IBM was a fierce ASIC competitor back then with leading edge processes and a silicon proven IP catalog that was unmatched.

Unfortunately that ended at 65nm as the pure-play foundries (TSMC and UMC) and fabless ASIC companies… Read More


An End of Year View of Semi Consolidation

An End of Year View of Semi Consolidation
by Bernard Murphy on 12-14-2016 at 7:00 am

The last couple of years have been tumultuous for the semiconductor market. IC Insights just released a report showing just how much consolidation has concentrated market strength in a small number of companies. The report (which excludes fabs) shows that the 5 top companies – Intel, Samsung, Qualcomm, Broadcom and SK Hynix – … Read More


Advanced Semiconductor Process Cost Trends

Advanced Semiconductor Process Cost Trends
by Scotten Jones on 12-13-2016 at 4:00 pm

The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More


Design for Fanout Packaging

Design for Fanout Packaging
by Bernard Murphy on 12-12-2016 at 12:00 pm

In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More