I’ve just submitted my speaker application for Microelectronics US 2026 in Austin this April.
As we scale toward sub-THz systems, the industry can no longer afford the Reality Gap — the costly divergence between architecture intent, validated behavior, and manufacturing reality.
If selected, I’m looking forward to sharing the SEGA™ (Scalable Engineering Governance Architecture) framework and our latest work on Field-Confined EM Corridors.
It’s time to stop treating packaging as a passive container and start treating it as the active control plane for system-level success.
#AdvancedPackaging #Chiplets #Semiconductor #HeterogeneousIntegration #MicroelectronicsUS
As we scale toward sub-THz systems, the industry can no longer afford the Reality Gap — the costly divergence between architecture intent, validated behavior, and manufacturing reality.
If selected, I’m looking forward to sharing the SEGA™ (Scalable Engineering Governance Architecture) framework and our latest work on Field-Confined EM Corridors.
It’s time to stop treating packaging as a passive container and start treating it as the active control plane for system-level success.
#AdvancedPackaging #Chiplets #Semiconductor #HeterogeneousIntegration #MicroelectronicsUS
