Jutta Meier is an experienced executive who has held senior positions at global semiconductor companies for over 25 years. She joined IQE in January 2024 as CFO, and was announced as IQE’s CEO in May of 2025. She joined IQE after serving at Intel Corporation as a Senior Finance Director at Intel Foundry Services, supporting Intel’s… Read More
Arm targets the agentic AI era with new edge, cloud and robotics platformsArm is expanding its computing platform for an…Read More
Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AIInstead of tweaking existing designs, VSORA built an…Read More
UWB Without the Integration Headache: Ceva and LG Bring Precision to More ChipsCeva and LG Electronics have joined forces to…Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI ConnectivityBy Tim Messegee, Senior Director of Solutions Marketing…Read More
Semiconductor Engineering Has a State-Continuity ProblemProduct realization depends not only on reaching the…Read MorePodcast EP299: The Current and Future Capabilities of Static Verification at Synopsys with Rimpy Chugh
Dan is joined by Rimpy Chugh, a Principal Product Manager at Synopsys with 14 years of varied experience in EDA and functional verification. Prior to joining Synopsys, Rimpy held field applications and verification engineering positions at Mentor Graphics, Cadence and HCL Technologies.
Dan explores the expanding role of static… Read More
Executive Interview with Ryan W. Parker of Phononic Inc.
CEO Interview with Jon Kemp of Qnity
Jon Kemp is President of the Electronics division for DuPont and Chief Executive Officer-Elect for Qnity, the planned independent Electronics Company, which will be an independent, publicly traded company spun off from DuPont’s (NYSE: DD) Electronics business upon completion of the intended separation on November 1, 2025.… Read More
Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and Startups
Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, is a noted financial analyst who does a yearly presentation on the State of EDA during the Design Automation Conference (DAC). This year was no exception. He and I spent a memorable afternoon discussing the Synopsys-Ansys merger and startups. … Read More
Security Coverage: Assuring Comprehensive Security in Hardware Design
As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
Analysis and Exploration of Parasitic Effects
With advanced semiconductor processes continuing to shrink, the number and complexity of parasitic elements in designs grows exponentially contributing to one of the most significant bottlenecks in the design flow. Undetected parasitic-induced issues can be extremely costly, often resulting in tape-out delays.
Silvaco… Read More
Siemens Proposes Unified Static and Formal Verification with AI
Given my SpyGlass background I always keep an eye out for new ideas that might be emerging in static and formal verification. Whatever can be covered through stimulus-free analysis reduces time that needn’t be wasted in dynamic analysis, also adding certainty to coverage across that range. Still, advances don’t come easily. … Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
By Tetsu Ho
With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


ASML Has High-NA and Chipmakers Can’t Say No