CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst ProgramIn a move poised to accelerate the integration…Read More
Chiplets: Powering the Next Generation of AI SystemsAI’s rapid expansion is reshaping semiconductor design. The…Read More
Better Automatic Generation of Documentation from RTL CodeOne technical topic I always find intriguing is…Read More
FD-SOI: A Cyber-Resilient Substrate for Secure Automotive ElectronicsThe paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI)…Read More
Wilfred Gomes is the co-founder, CEO, and president of Mueon Corporation, a next-generation infrastructure startup rethinking how data centers are built for the AI era. The company’s flagship innovation, Cubelets™, modular, stackable units that unite compute, memory, power delivery and thermal management, replace the … Read More
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More
The second chapter of our book “Fabless: The Transformation of Semiconductor Industry” describes the ASIC business and how important it is. That was more than 10 years ago and the ASIC business is still at the forefront of the Semiconductor industry and is a key enabler of the AI revolution we are experiencing today.
First let’s … Read More
In the rapidly evolving landscape of AI, Quadric stands out as a pioneering force in edge computing. Founded in 2018 and headquartered in Burlingame, California, Quadric is a technology company focused on developing high-performance, energy-efficient processors for AI workloads at the edge devices like smartphones, IoT … Read More
By Kamal Khan
In today’s semiconductor industry, success hinges not only on innovation but also on discipline in managing complexity. Every system-on-chip (SoC) is built from hundreds of reusable IP blocks—standard cells, memories, interfaces, and analog components. These IPs are the foundation of the design. But if the foundation… Read More
U.S. electronics production has been on an accelerating growth trend over the last ten months. Three-month average change versus a year ago (3/12 change) has increased from 0.4% in October 2024 to 6.2% in August 2025. Japan’s 3/12 change has been positive since November 2024, but has been decelerating for most of 2025, reaching… Read More
In the complex world of semiconductors, reliability, availability, and serviceability (RAS) have become paramount, especially as devices shrink to nanoscale geometries like 2nm. At the recent 2025 TSMC OIP Forum Noam Brousard, VP of Solutions Engineering at proteanTecs, presented “Failure Prevention with Real-Time… Read More
Daniel is joined by Jake Canon, senior business development engineer at Toshiba America Electronic Components. Jake is an enthusiastic contributor to the semiconductor industry and has been working closely with engineers to find new discrete power solutions for a wide variety of cutting-edge applications.
Dan explores the… Read More
VSORA, a pioneering high-tech company, has engineered a novel architecture designed specifically to meet the stringent demands of AI inference—both in datacenters and at the edge. With near-theoretical performance in latency, throughput, and energy efficiency, VSORA’s architecture breaks away from legacy designs optimized… Read More
The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More
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Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business