Optimizing high performance packages calls for multidisciplinary 3D modeling

Optimizing high performance packages calls for multidisciplinary 3D modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Automating Timing Arc Prediction for AMS IP using ML

Automating Timing Arc Prediction for AMS IP using ML
by Daniel Payne on 10-16-2019 at 6:00 am

NVIDIA designs some of the most complex chips for GPU and AI applications these days, with SoCs exceeding 21 billion transistors. They certainly know how to push the limits of all EDA tools, and they have a strong motivation to automate more manual tasks in order to quicken their time to market. I missed their Designer/IP Track Poster… Read More


Cadence and Green Hills Share More Security Thoughts at ARM Techcon

Cadence and Green Hills Share More Security Thoughts at ARM Techcon
by Randy Smith on 10-15-2019 at 10:00 am

On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More


Formal in the Field: Users are Getting More Sophisticated

Formal in the Field: Users are Getting More Sophisticated
by Bernard Murphy on 10-15-2019 at 5:00 am

Building on an old chestnut, if sufficiently advanced technology looks like magic, there are a number of technology users who are increasingly looking like magicians. Of course when it comes to formal, neither is magical, just very clever. The technology continues to advance and so do the users in their application of those methods.… Read More


Free webinar – Accelerating data processing with FPGA fabrics and NoCs

Free webinar – Accelerating data processing with FPGA fabrics and NoCs
by Tom Simon on 10-14-2019 at 10:00 am

FPGAs have always been a great way to add performance to a system. They are capable of parallel processing and have the added bonus of reprogramability. Achronix has helped boost their utility by offering on-chip embedded FPGA fabric for integration into SoCs. This has had the effect of boosting data rates through these systems… Read More


Response to IP’s Growing Impact On Yield And Reliability

Response to IP’s Growing Impact On Yield And Reliability
by Daniel Nenni on 10-14-2019 at 6:00 am

One of the reasons I founded SemiWiki nine years ago was the lack of EDA, IP and Foundry content in the media. The problem is that unless you work in the industry it is very difficult to write about it in competent technical detail. Most media outlets only know what vendors tell them which is how the semiconductor industry worked before… Read More


Comparing Applied Materials with Lam Research

Comparing Applied Materials with Lam Research
by Robert Castellano on 10-13-2019 at 8:00 am

Lam Research (NASDAQ:LRCX) will announce its quarterly earnings on October 23, 2019, and Applied Materials (NASDAQ:AMAT) the following month on November 14, 2019. Both companies make equipment used to manufacture semiconductor devices. While private and institutional investors often own both individual stocks, this article… Read More


Auto Architecture and the Need for Speed

Auto Architecture and the Need for Speed
by Roger C. Lanctot on 10-11-2019 at 10:00 am

Automotive makers and their suppliers are jacking up the processing power being introduced to cars along with higher speed wireless external connections. These high speed systems promise to collect, process, interpret and transmit sensor data for the purpose of enabling advanced collision avoidance and, ultimately, automated

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My Top Three Reasons to Attend IEDM 2019

My Top Three Reasons to Attend IEDM 2019
by Scotten Jones on 10-11-2019 at 6:10 am

Image RemovedThe International Electron Devices Meeting is a premier event to learn about the latest in semiconductor process technology. Held every year in early December is San Francisco this years conference will be held  from Decembers 7th through December 11th. You can learn more about the conference at their web site hereRead More