Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural PivotIn 2003, legendary computer architect Michael J. Flynn…Read More
Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping SystemQualifying an AI-class RISC-V SoC demands proving that…Read More
DAC News – A New Era of Electronic Design Begins with Siemens EDA AIAI is the centerpiece of DAC this year.…Read More
IC place and route is a big challenge so we see many EDA companies creating tools. On Tuesday at DAC I met with Dave Noble of Pulsic to get an update.
Notes
Dave Noble, VP Operations (EDA since 2003), Sperry Univac since 1974
– had been an EDA distributor for Pulsic as well
More leads qualified on Monday than all days of last year … Read More
3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More
The days following a major conference like DAC are a good time to reflect on the overall health and vibrancy of the electronic design automation (EDA) industry. I’ve been in EDA for 21 years and built two successful startups, and over the last couple of years, have witnessed some decline in both new talent and in venture investment… Read More
Foreign students earn roughly two-thirds of the total engineering Ph.D.s earned in the U.S., yet there is no policy to allow, let alone encourage, them to stay in the U.S. after graduation. I was aware of this problem 14 years ago when I started working in EDA, but haven’t paid much attention since then.
So, I scoured the congressional… Read More
NVM IP offering from NovocellSemiconductor is based on SmartBit, an antifuse, One Time Programmable (OTP) technology, and the OTP block are embedded in standard Logic CMOS without any additional process or post process steps and can be programmed at the wafer level, in package, or in the field, as end user requires. What makes … Read More
I use social media 7 days a week and while at DAC I received a message from Herve Guegan on my LinkedIn account where he basically said, “Hey, go check out Asygn at DAC, they do analog macro models.”… Read More
One year ago I met with Hany Elhak of Synopsys to get an update on what was new with HSPICE in 2011, so this year at DAC Hany met me at the Synopsys booth for a quick update.
HSPICE has something called Precision Parallel so with 16 cores your IC circuit simulations will have about 10 x speed up compared to a single core.… Read More
For a small company, Solido has some very large customers and partners, TSMC being on of them. Why? Because of the high yield and memory performance demand on leading edge technologies, that’s why.
Much has been made of and will continue to be said on the march of Moore’s Law. While economics of scale and performance vs. power… Read More
Tuesday morning at DAC I attended the Synopsys-hosted breakfast to hear from foundries and ARM about the challenges of designing and delivering silicon at the 32nm/28nm and 20nm nodes.
… Read More
As I mentioned in a previous blog Cadence Update 2012, Martin Lund is now in charge of the Cadence IP strategy. Martin read my first blog and wanted to exchange IP strategies so we met at DAC 2012 for a chat. Not only did Martin connect with me on LinkedIn, he also joined the SemiWiki LinkedIn group, which now has 4,000+ members. So yes,… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot