Most simple testbenches have close to no structure, are terrible to modify and hopeless to understand. They often take far too much time to implement and provide close to no support when debugging potential problems. This webinar will demonstrate how to build a far better testbench with respect to all these issues – in significantly… Read More
![Figure 1](https://semiwiki.com/wp-content/uploads/2025/01/Figure_1.png)
![System level testing min](https://semiwiki.com/wp-content/uploads/2025/01/System-level-testing-min-1.png)
![Synopsys Predictions for Multi Die Designs in 2025](https://semiwiki.com/wp-content/uploads/2025/01/Synopsys-Predictions-for-Multi-Die-Designs-in-2025.png)
Variation-aware IC Design
We’ve blogged before about Layout Dependent Effects (LDE) on SemiWiki and how it further complicates the IC design and layout process, especially at 28nm and lower nodes because the IC layout starts to change the MOS device performance. There’s an interesting webinarfrom Cadence on Variation-aware IC Design, … Read More
Chasing DP Rabbits
“Now, here, you see, it takes all the running you can do, to keep in the same place. If you want to get somewhere else, you must run at least twice as fast as that!”
—Lewis Carroll, Through the Looking Glass
The use of stitching can greatly reduce the number of double patterning (DP) decomposition violations that a designer has to resolve.… Read More
Two New TSMC-Cadence Webinars for Advanced Node Design
Foundries and EDA vendors are cooperating at increasing levels of technical intimacy as we head to the 20nm and lower nodes. Cadence has a strong position in the EDA tools used for IC design and layout of custom and AMS (Analog Mixed-Signal) designs. They have created a series of webinars to highlight the design challenges and new… Read More
Adam Osborne Pays Wintel a Visit
The news this week that PC sales dropped by double digit percentages and to a level not seen since 2006 sent shudders down the halls of OEMs and chip suppliers. Are we entering a final death spiral as opposed to the gradual decline that most expected? Perhaps there is another explanation. From a distance, it appears that the mobile … Read More
FinFETs: Ask the Experts!
On Friday (April 19[SUP]th[/SUP]) I will be keynoting FinFET day at the EDPS conference in Monterey. This is an excellent opportunity to ask the experts about the challenges of FinFET design and manufacturing in an intimate setting (60 people). If you are interested register today and use the promo codeSemiWiki-EDPS-JFR and … Read More
Ivo Bolsens’ Keynote on the All-Programmable SoC
Ivo Bolsens, the CTO of Xilinx, is giving the opening keynote at the Electronic Design Process Symposium (EDPS) in Monterey on Thursday and Friday this coming week. The title of his keynote is The All Programmable SoC – At the Heart of Next Generation Embedded Systems. He covers a lot of ground but the core of his presentation… Read More
3D IC: Are We There Yet?
For the last few years, thru silicon via (TSV) based ICs have been looming in the mist of the future. Just how far ahead are they? Xiliinx famously has a high-end gate-array in production on a 2.5D interposer, Micron has a memory cube, TSMC has done various things in 3D that it calls CoWoS (chip on wafer on substrate), Qualcomm have been… Read More
TSMC Responds to Samsung!
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
How to make ESL really work – see EDPS
The Electronic Design Process Symposium (EDPS) is April 18 & 19 in Monterey. The workshop style Symposium is in its 20[SUP]th[/SUP] year. The first session is titled “ESL & Platforms”, which immediately follows the opening Keynote address by Ivo Bolsens, CTO of Xilinx.
In his keynote presentation Ivo will present how… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?