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Connected cars may be starting to resemble overgrown phones in many ways, but there are critical differences now leading processor teams in a different direction away from the ubiquitous mobile SoC architecture – in turn causing designers to reevaluate interconnect strategies.
The modern car has evolved into a microcontroller… Read More
Every ASIC company has a major challenge: they have to work out what it is going to cost to build the customer’s product and commit to deliver it at that price. Too high and you lose the business. Too low and you will wish you’d lost the business. Historically this has been done largely manually. This is an expensive process.… Read More
Google is search, of course, but it is also OS (Android), systems (Glass) and increasingly, maybe, hardware. Rumors are swirling that through careful acquisitions and focused internal development, Google is set to make its own server SoCs.
Google’s Larry Page has stated that they are in the hardware business. They’ve been making… Read More
I have written this before, but I was a ModelSim snob. That has changed after trying Active-HDL from Aldec. I have no plans on going back to ModelSim. You ask why? Well astute reader, great question. Unfortunately these blogs are text limited and there is no way to write about all the bells and whistles of Active-HDL. So before I continue,… Read More
From the sources in which I confirmed the last Intel 14nm delay, I just confirmed another. Intel 14nm is STILL having yield problems. Remember Intel bragging about 14nm being a full node and deriding TSMC because 16nm is “just” 20nm with FinFETs added? Judging by the graph, clearly FinFETs are not the problem here. … Read More
3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
IC designers contemplating the transition to 16nm FinFET technology for their next SoC need to be informed about design flow and IP changes, so TSMC teamed up with Cadence Design Systems today to present a webinar on that topic. I attended the webinar and will summarize my findings.
Shown below is a 3D layout concept of an ideal FinFET… Read More
The 8051 microcontroller has been around for years…decades in fact. It was originally developed in 1980 by Intel. Back then it required 12 clock cycles per instruction but modern cores use just one. While it is still widely used, mostly as an IP core for SoCs, it is running out of steam despite running over 50 times faster than… Read More
Atmel was founded in 1984. The name stands for “advanced technology for memory and logic” although initially the focus was on memory. George Perlegos the founder had worked in the memory group of Intel back when Intel was a memory company and not a microprocessor company although that didn’t stop Intel suing… Read More
When we last visited texture compression technology for OpenGL ES on mobile GPUs, we mentioned Squish image quality results in passing, but weren’t able to explore a key technology at the top of the results. With today’s introduction of the ARM Mali-T720 GPU IP, let’s look at the texture compression technology inside: Adaptive… Read More
Weebit Nano Brings ReRAM Benefits to the Automotive Market