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Learning Cache Coherency and Cache Coherent Interconnects: ARM White Paper

Learning Cache Coherency and Cache Coherent Interconnects: ARM White Paper
by Eric Esteve on 08-19-2014 at 11:08 am

Cache Coherency is the type of concept that you think you understand, until you try to explain it. It could be wise to come back to fundamentals, and ask what does coherency means to an expert. I have surf the web, found several white papers on ARM site, and now I can try to share these fresh lessons learned (or you may prefer to download… Read More


SEMulator3D: GlobalFoundries Process Variation Reduction

SEMulator3D: GlobalFoundries Process Variation Reduction
by Paul McLellan on 08-19-2014 at 7:01 am

At SEMICON last month, Rohit Pal of GlobalFoundries gave a presentation on their methodology for reducing process variation. It was titled Cpk Based Variation Reduction: 14nm FinFET Technology.

Capability indices such as Cpk is a commonly used technique to assess the variation maturity of a technology. It looks at a given parameter’s… Read More


Enable a new generation of connected devices?

Enable a new generation of connected devices?
by Eric Esteve on 08-19-2014 at 4:08 am

Imagination Technologies has designed a complete environment to address the needs of emerging IoT and other connected devices, FlowCloud. The technology has been engineered by Imagination to optimize device to cloud connectivity for embedded applications. FlowCloud is a cloud based application independent development… Read More


Intel 14nm is NOT in Production Yet!

Intel 14nm is NOT in Production Yet!
by Daniel Nenni on 08-18-2014 at 2:01 pm

Okay, maybe I’m the only one questioning Intel 14nm yield but I think it will be an interesting discussion in the comments section. Here are the questions I would have asked Intel during their recent 14nm PR tour: Has the P1272 process been rolled out to the production fabs in OR, AZ, and Ireland? Is the process officially in production… Read More


FD-SOI at 14nm

FD-SOI at 14nm
by Paul McLellan on 08-17-2014 at 7:01 am

At the recent Semicon West, Michel Haond of ST Microelectronics had a presentation on 14nm FD-SOI, or what they more lengthily call UTBB FD-SOI (which when you expand it all out comes to Ultra Thin Body and Buried-Oxide Fully Depleted Silicon on Insulator). When Chenming Hu (or whoever in his group) came up with the term FinFET it … Read More


Another debug view in the UVM Toolbox

Another debug view in the UVM Toolbox
by Don Dingee on 08-17-2014 at 1:00 am

One of the biggest endearing qualities of a debug environment for any type of coding is availability of multiple ways to accomplish a task. Whether the preference is keyboard shortcuts, mouse left-click drill-down and right-click pull-down menus, source code view, hierarchical class view, or graphical relationship view, … Read More


How to Reduce Maximum Power at RTL Stage?

How to Reduce Maximum Power at RTL Stage?
by Pawan Fangaria on 08-16-2014 at 8:30 am

Of course that reduction has to stay throughout the design cycle up to layout implementation and fabrication. Since the advent of high density, mega functionality SoC designs at advanced nodes and battery life critical devices played by our fingertips, the gap between SoC power requirement and actual SoC power has only increased.… Read More


Cadence Completes Power Signoff Solution with Voltus-Fi

Cadence Completes Power Signoff Solution with Voltus-Fi
by Paul McLellan on 08-15-2014 at 7:01 am

You probably remember Cadence introduced Voltus towards the end of last year at their signoff summit. This was aimed at digital designers. Prior to that they had announced Tempus, their static timing analysis tool. More recently they announced Quantus QRC extraction. All of these tools that end in -us have been re-architected… Read More


A Deeper Insight into Quantus QRC Extraction Solution

A Deeper Insight into Quantus QRC Extraction Solution
by Pawan Fangaria on 08-14-2014 at 7:00 pm

Last month Cadenceannounced its fastest parasitic extraction tool (minimum 5 times better performance compared to other available tools) which can handle growing design sizes with interconnect explosion, number of parasitics and complexities at advanced process nodes including FinFETs, without impacting accuracy of … Read More


When TSMC advocates FD-SOI…

When TSMC advocates FD-SOI…
by Eric Esteve on 08-14-2014 at 1:00 pm

I found a patent recently (May,14 2013) granted to TSMC “Planar Compatible FDSOI Design Architecture”, the following sentences, directly extracted from this patent, advertise FDSOI design better than a commercial promotion! “Devices formed on SOI substrates offer many advantages over their bulk counterparts, includingRead More