Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping SystemQualifying an AI-class RISC-V SoC demands proving that…Read More
DAC News – A New Era of Electronic Design Begins with Siemens EDA AIAI is the centerpiece of DAC this year.…Read More
Arteris at the 2025 Design Automation Conference #62DACKey Takeaways: Expanded Multi-Die Solution: Arteris showcases its…Read More
To describe the latest methodology for the addition of Design for Manufacturability fill shapes to design layout data, it’s appropriate to borrow a song title from Bob Dylan – The Times They Are A Changin’. The new technical requirements are best summarized as: “The goal is now to add as much fill as possible, which (ideally) looks… Read More
(I changed the title of this piece as an experiment) Paul McLellan recently wrote on the topic of new ventures crossing the chasm (getting from initial but bounded success to a proven scalable business). That got me to thinking about the EDA market in general. In some ways it has a similar problem, stuck at $5B or so and single-digit… Read More
Most of the discussion around Xilinx UltraScale parts in FPGA-based prototyping modules has been on capacity, and that is certainly a key part of the story. Another use case is developing, one that may be even more important than simply packing a bigger design into a single part without partitioning. The real win with this technology… Read More
It used to be that if you went to a processor conference, you could expect to spend hours listening to talks about pipelining, cache schemes and processor architecture. Well, I went to the Linley Processor Conference this week in Santa Clara and found the topics pretty compelling. Processors are in just about everything. It is easier… Read More
The 53rd DAC (Design Automation Conference) is some 8 months away, however to make this conference and exhibit another success requires planning, people and awareness. That’s where you come in, because you can contribute your expertise in five different areas:
[LIST=1]
Recently imec and Cadence disclosed that they had fabricated 5nm test chips. This afternoon Dan Nenni and I had a conference call with Praveen Raghavan, principal engineer at imec, and Vassilios Gerousis, distinguished engineer at Cadence to get more details on what the test chip is and what was learned.
First off Vassilios really… Read More
By this time, anyone with a pulse in the tech industry knows that Apple has dual sourced the A9 processor for the Iphone 6S, from both Samsung and TSMC. There are even apps to tell whether your 6S has a Samsung or TSMC part in it. People have run performance comparisons and concluded that the processing performance is the same, which … Read More
I used to joke that my first car could survive a nuclear war. It was a 1971 Volvo sedan (142) that was EMP proof because it had absolutely no semiconductors in the ignition system, just points, condensers and a coil. If you go back to the Model T in 1915 you will see that the “on-board electronics” were not that different. However, today’s… Read More
There should be a link between iPhone H/W architecture and the incredible success of the product? Let’s assume and claim that this architecture, based on the internally developed ARM based A9 application processor, is simply the best on the market today…
Apple has implemented SSD in MacBook based on NVM Express (NVMe) protocol.… Read More
The recent mega acquisition of Broadcom Corp by Avago can be traced all the way back to Silicon Valley stalwart Hewlett Packard (founded in a two car Palo Alto garage in 1939). Even more interesting is the man behind the acquisition and how he got to where he is today.Avago began as the semiconductor products division of HP in 1961, … Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot