AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
On Tuesday morning at SEMICON I had the opportunity to sit down with Harry Levinson, Sr. Director of Technology Research and Sr. Fellow at Global Foundries and Michael Lercel, Director of Strategic Marketing at ASML to discuss the state of lithography.
I opened the discussion with a question about how we are going to address lithography… Read More
For SoCs designed for various applications such as mobile, automotive, wearable computing, gaming, virtual reality, PC, imaging, security, and IOT applications, it is incredibly important to keep area (cost) and power as low as possible. Considering the growing percentage of chip area used for memory, it makes sense to choose… Read More
We spend an inordinate amount of energy tracking the big chip – the application processor – in a mobile device. As we’ve seen this space is coming down to a handful of players. A more interesting competition is heating up around the APU for the rest of chips needed to make a phone.… Read More
A significant shift is underway in the fabless semiconductor business model. As the application markets have become more diverse (and more cost-sensitive), product requirements have necessitated a new focus on multi-die packaging technology. … Read More
If you are a regular reader, you’ll know I like to explore the boundaries of technology. Readers I respect sometimes interpret this as a laughable attempt to oppose the inevitable march of progress, but that is not my purpose. In understanding the limits of a particular technology, it is possible to envision what properties a successor… Read More
At E3 2016 in Los Angeles, California Advanced Micro Devices disclosed the numbering and targeted use cases of their full line of Polaris-based GPUs, branded as the “Radeon RX Series” of graphics cards. Advanced Micro Devices had previously disclosed some details about the new Radeon RX series of graphics cards at Computex 2016… Read More
NVIDIA has been working hard to progress forward their new Pascal family of GPUs ever since their announcement at Dreamhack in May 2016 in my hometown, Austin, TX. The announcement included two of NVIDIA’s newest GPUs, the GTX 1080 and GTX 1070, both of which are somewhat available now. I worked with my colleague, Anshel Sag, to review… Read More
Television spots for cars are becoming a little like pharmaceutical ads filled with fine print and warnings about side effects and clarifications. Safety advocates are taking Mercedes to task for its latest TV ads for the 2017 E Class, claiming that the car company is misleading consumers into thinking the car can drive itself.… Read More
One of my favorite pastimes is listening to the quarterly investor calls of the leading semiconductor companies. I can then match up the talking points with the calls I do with Wall Street, the conferences I attend, and the other data points I have collected while working inside the fabless semiconductor ecosystem for more than … Read More
Several companies have attacked the QoS problem in SoC design, and what is emerging from that conversation is the best approach may be several approaches combined in a hybrid QoS solution. At the recent Linley Group Mobile Conference, NetSpeed Systems outlined just such a solution with an unexpected plot twist in synthesis.
The… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?