CEO Interview with Dr. Maksym Plakhotnyuk of ATLANT 3DDr. Maksym Plakhotnyuk, is the CEO and Founder…Read More
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AI Booming is Fueling Interface IP 23.5% YoY GrowthAI explosion is clearly driving semi-industry since 2020.…Read More
At the recent TSMC OIP symposium, a collaborative presentation by Synopsys and Xilinx highlighted the importance of incorporating the local FinFET device self-heating temperature increase on the acceleration of device reliability mechanisms.… Read More
When Ethernet was introduced in 1983 it ran at 10Mbps and mostly relied on hubs and coaxial cable. Twelve years later a faster speed was introduced, running at 100Mbps. Since then we have seen an acceleration of new data rate introductions. According top the Ethernet Alliance, Ethernet could have 12 speeds before 2020, with 6 of … Read More
The countdown to the end of Moore’s Law is coinciding with the rising complexity in system-on-chip (SoC) designs. And that’s not a mere coincidence. The leverage that has long been coming from shrinking process nodes in terms of cost, performance and power benefits is now increasingly being accomplished through… Read More
A new powerhouse to dominate over AMAT
Combination of best of Breeds
KLAC shareholders get $32 cash plus stock
The wedding invitation…….
Lam Research Corporation (NASDAQ: LRCX) (“Lam”) and KLA-Tencor Corporation (NASDAQ: KLAC) (“KLA-Tencor”) today announced that they have entered… Read More
In recent years, excessive cold or heat in particular regions of the world has become a regular phenomenon; it reminds me about a movie I saw a couple of years ago, “The Day After Tomorrow” in which the whole Manhattan was shown covered with ice. Can’t say whether that can ever happen if at all, but on a better note today, I can see the possibility… Read More
Recent reports have Intel displacing Qualcomm as the modem supplier and TSMC as the foundry for the next Apple A10 SoC. That is if you call this a credible report: … Read More
Back in 2002, the Southwest DFT Conference was born and experts on design for test (DFT) and test got together to share ideas and talk to people in this industry that were trying to solve test challenges of the day.… Read More
One of the most frequently discussed concerns regarding FDSOI adoption is the higher starting wafer cost compared to bulk technology. This discussion was also brought up after my earlier post,… Read More
The intersection of data with intelligent machines is creating new possibilities in industrial automation, and this new frontier is now being increasingly known as the Industrial Internet of Things (IIoT). However, if there is a single major stumbling block that is hindering the IoT take-off at the larger industrial scale, … Read More
SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and… Read More
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