In the last couple of years, Industry 4.0 has significantly affected manufacturing on a global scale. With a heavy focus on the Internet of Things, the use of smart machines and other devices has become a critical part of Industry 4.0. With new networks of intelligence on the horizon, there is no doubt that Industry 4.0 will continue… Read More
When Design Gets Faster, the Bottleneck Moves Through the Physical StackAI can compress the path to tape-out. The…Read More
Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung FoundryAdvanced semiconductor packaging has become essential to improving…Read More
CEO Interview with Timothy Regan of IN2FABTimothy Regan has substantial experience in analog/ mixed…Read More
The $9.5 Billion Design IP Market: Shifting Boundaries, Arm's Monopoly, and the RISC-V ResponseWhile semiconductor design intellectual property (IP) is a…Read MoreFree Pivotal Semiconductor Books!
Just as a reminder, there are three semiconductor books in PDF format available for free on SemiWiki.com. The only hitch is that you must be a registered SemiWiki member to download them. If you are not currently a member please join here as my guest:… Read More
Dolphin Webinar “The proven recipe for uLP SoC”
Dolphin will hold a live webinar on November 15, 9:00 AM PST or November 22, 10:00 AM GMT. This webinar targets the SoC designers wanting to learn how to quickly implement ultra-low power (uLP) techniques, using proven recipes.… Read More
Flexible IoT Wireless
There’s been quite a bit of debate about what is the “best” wireless option for the IoT, coming down usually in favor of there being no single best option. Applications are so widely varied that different solutions are needed to ideally fit different requirements. However, IoT economics require we settle on a limited set of options,… Read More
Ford Seeks Own Path to Car Sharing and IoT
It’s hard to be a thought leader around the future of transportation when the entire market seems to be moving in one of three directions simultaneously: either ride hailing (Uber, Lyft), car sharing (Zipcar, Car2go) or automated driving (Google, Tesla). If you’re Ford Motor Company and you care about whether you are adding to … Read More
How does the IoT get to 20 Billion?
Not long ago I was asked the question “How do we get to 20 billion IoT devices?” (Actually, I’ve been asked this question multiple times over the past 10+ years.) Great question! How, exactly, do we get to 20 billion (or 30 billion, or a trillion) IoT devices? We’re certainly not going to get there with wearable devices and other… Read More
IP-SoC 2016: IP Innovation, Foundries, IoT and Security
The next IP-SoC conference will be held in Grenoble, France, on December 6-7, 2016 after Shanghai in September and Bangalore, India, in April. This will be the 20[SUP]th[/SUP] edition of this unique IP centric event, as well as the celebration of Design And Reuse 20[SUP]th[/SUP] anniversary. Creating in 1997 a company fully dedicated… Read More
One chip and the MCU variant challenge disappears
Merchant microcontrollers are usually made available in a wide range of variants based on one architecture with different peripheral payloads and packaging options. A couple of companies, notably Cypress with their PSoC families and Silicon Labs with the EFM8 Laser Bee… Read More
Industry 4.0 and Manufacturing Processes
Industry 4.0 or, as it is also known the fourth industrial revolution is the trend that is currently coming into play of automating the manufacturing processes and the use of IoT and other technologies to make industrial processes more readily accomplished. It is working hand in hand with things like the internet of things, cloud… Read More
Optimizing Prototype Debug
In the spectrum of functional verification platforms – software-based simulation, emulation and FPGA-based prototyping – it is generally agreed that while speed shoots up by orders of magnitude (going left to right) ease of debug drops as performance rises and setup time increases rapidly, from close to nothing for simulation… Read More


Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry