Collaboration Required to Maximize ASIC Chiplet ValueIt is a well-known fact that chiplets provide…Read More
Andes Technology is Expanding RISC-V’s Horizons in High-Performance Computing ApplicationsBy: Dr. Charlie Su, President and CTO, Andes…Read More
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 GbpsAs the demand for higher performance computing solutions…Read More
PQShield Builds the First-Ever Post-Quantum Cryptography ChipQuantum computing promises to deliver vast increases in…Read More
Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More
The web is a wonderful place to find information on almost any topic. While top-level information is easy to find, a deep dive often requires the services of a market research firm. These organizations specialize in “going deep” on many technology topics, offering insights not available with a Google search. And these services… Read More
– KLAC reported an OK QTR & flat guide-waiting for 2025 recovery?
– China exposure remains both risk & savior & big in backlog
– Wafer inspect strong- Patterning on long slide- PCB biz for sale
– Some bright spots but memory still weak- Foundry/Logic OK
Quadric Inc. is the leading licensor of general-purpose neural processor IP (GPNPU) that runs both machine learning inference workloads and classic DSP and control algorithms. Quadric’s unified hardware and software architecture is optimized for on-device ML inference. I have know Steve Roddy for many years, he is a high … Read More
– Lam reported as expected and guided flat- No recovery yet
– Some mix shifts but China still 40% (8X US at 5%)-NVM still low
– HBM is promising but Lam needs a broad memory recovery
– Lam has not seen order surge ASML saw- Likely lagging by 3-4 QTRs
As compared… Read More
Dan is joined by Paul Fischer. Paul is the director of Chip Mesoscale Processing in Intel’s Components Research. He and his team are currently working on Gallium Nitride for energy efficient power delivery and RF communications, and technologies for heterogeneous monolithic integration.
Paul discusses the innovations… Read More
– ASML orders more than triple sequentially- Utilization increases
– Management remains conservative with flat revenues 2024 vs 2023
– Recovery will be slow, targeting 2025- Long & weak cyclical bottom
– Litho orders are leading indicator of future wider recovery
Mergers and acquisitions have been a big part of EDA since the beginning. We keep an EDA/IP Mergers and Acquisitions Wiki, it is 13 years old now and has more than one million views. Personally, I have been involved with dozens of acquisitions over my 40 year career, some good, some bad, all are interesting and are an important part … Read More
As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome. We’re planning on starting a live series… Read More
Can you name the EDA vendor that first used AI starting 15 years ago for circuit designers using SPICE simulators? I can remember that vendor, it was Solido, now part of Siemens EDA, and I just read their 8 page paper on how they look at the various levels of AI being used in EDA to help IC designers work smarter and faster than using manual… Read More
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