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The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More
Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More
RVA23 marks a turning point in how mainstream CPUs are expected to scale performance. By making the RISC-V Vector Extension (RVV) mandatory, it elevates structured, explicit parallelism to the same architectural status as scalar execution. Vectors are no longer optional accelerators bolted onto speculation-heavy cores.… Read More
The recent Chiplet Summit at the Santa Clara Convention Center was buzzing with many enabling technologies for chiplet-based design. Collaboration was also on display during many parts of the show. A presentation in the Siemens booth was a perfect example of both of those trends. In the Siemens booth, Perforce presented an excellent… Read More
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At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More
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